公开(公告)号：US06351030B2

公开(公告)日：2002-02-26

申请号：US09276596

申请日：1999-03-25

申请人： Ross Downey Havens ,  Robert Maynard Japp ,  Jeffrey Alan Knight ,  Mark David Poliks ,  Anne M. Quinn

发明人： Ross Downey Havens ,  Robert Maynard Japp ,  Jeffrey Alan Knight ,  Mark David Poliks ,  Anne M. Quinn

IPC分类号： H01L2328

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.

摘要翻译： 本发明是一种在电子封装上提供保护覆盖物的方法，该电子封装包括第一电路化基板，位于第一基板上并与之电耦合的半导体芯片，以及还在基板上的多个导体，用于将基板电连接到 外部电路化基板。 在一个版本中，该方法包括用保护覆盖物基本上覆盖衬底，半导体芯片和多个导体的一部分的外表面，以浸没在电介质溶液（例如，TEFLON AF）中。 也可以通过刷涂，喷涂或化学气相沉积来涂覆涂层。 在替代实施例中，包括所有导体的所有外表面都涂覆有保护覆盖物（例如，以便于包装运输或其他处理）。 所得到的电子封装也在此描述。

公开(公告)号：US5888850A

公开(公告)日：1999-03-30

申请号：US939302

申请日：1997-09-29

申请人： Ross Downey Havens ,  Robert Maynard Japp ,  Jeffrey Alan Knight ,  Mark David Poliks ,  Anne M. Quinn, deceased

发明人： Ross Downey Havens ,  Robert Maynard Japp ,  Jeffrey Alan Knight ,  Mark David Poliks ,  Anne M. Quinn, deceased

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025

摘要： The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.

摘要翻译： 本发明是一种在电子封装上提供保护覆盖物的方法，该电子封装包括第一电路化基板，位于第一基板上并与之电耦合的半导体芯片，以及还在基板上的多个导体，用于将基板电连接到 外部电路化基板。 在一个版本中，该方法包括用保护覆盖物基本上覆盖衬底，半导体芯片和多个导体的一部分的外表面，以浸没在电介质溶液（例如，TEFLON AF）中。 也可以通过刷涂，喷涂或化学气相沉积来涂覆涂层。 在替代实施例中，包括所有导体的所有外表面都涂覆有保护覆盖物（例如，以便于包装运输或其他处理）。 所得到的电子封装也在此描述。

公开(公告)号：US5298685A

公开(公告)日：1994-03-29

申请号：US913086

申请日：1992-07-14

申请人： Perminder S. Bindra ,  Ross Downey Havens ,  Voya R. Markovich ,  Jaynal A. Molla

发明人： Perminder S. Bindra ,  Ross Downey Havens ,  Voya R. Markovich ,  Jaynal A. Molla

IPC分类号： H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/100

CPC分类号： H05K3/462 ,  H01R12/52 ,  H05K3/368 ,  H05K3/445 ,  H05K1/0272 ,  H05K1/144 ,  H05K2201/0305 ,  H05K2201/0373 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/054 ,  H05K3/0023 ,  H05K3/0094 ,  H05K3/28 ,  H05K3/325 ,  H05K3/36 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4076 ,  H05K3/423 ,  H05K3/428 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49155

摘要： Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.

摘要翻译： 电路板的聚合物副复合物通过电接触垫上的金属树突相互连接，由此一个或多个子复合材料的电接触垫的宽度方向比另一个子复合材料的电接触垫宽。