公开(公告)号：US20060081989A1

公开(公告)日：2006-04-20

申请号：US10998741

申请日：2004-11-30

申请人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jay Lin ,  Syh-Yuh Cheng

发明人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jay Lin ,  Syh-Yuh Cheng

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2203/0726 ,  H05K2203/104 ,  Y10S977/761 ,  Y10S977/762 ,  Y10S977/766 ,  Y10S977/77 ,  Y10S977/778 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

公开(公告)号：US20060243972A1

公开(公告)日：2006-11-02

申请号：US11477412

申请日：2006-06-30

申请人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

发明人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

IPC分类号： H01L29/08

CPC分类号： H01L23/49827 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2203/0726 ,  H05K2203/104 ,  Y10S977/761 ,  Y10S977/762 ,  Y10S977/766 ,  Y10S977/77 ,  Y10S977/778 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

公开(公告)号：US20060249834A1

公开(公告)日：2006-11-09

申请号：US11477413

申请日：2006-06-30

申请人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

发明人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

IPC分类号： H01L23/12

CPC分类号： H01L23/49827 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2203/0726 ,  H05K2203/104 ,  Y10S977/761 ,  Y10S977/762 ,  Y10S977/766 ,  Y10S977/77 ,  Y10S977/778 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

公开(公告)号：US07163885B2

公开(公告)日：2007-01-16

申请号：US10862515

申请日：2004-06-05

申请人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

发明人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L21/2885 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/19042 ,  H01L2924/00

摘要： A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical bonding between metal and thiol with electric charges. The chip is placed in a reactor with a solution along with the conductive particles. The conductive particles are then migrated and fixed to the bonding locations on the bumps of a chip through an electrophoresis procedure. For conductive particles not carrying charges, they can sink naturally to the surface of chip bumps due to their higher density than water in the solution. An electroplating procedure is then applied to fix the conductive particles onto the bump.

摘要翻译： 提供了使用电泳技术将颗粒分散并固定在芯片的凸块上的方法。 通过在金属和硫醇之间进行电荷的化学键合来处理颗粒和芯片凸块以携带电荷。 将芯片与导电颗粒一起放置在具有溶液的反应器中。 然后通过电泳方法将导电颗粒迁移并固定到芯片的凸块上的结合位置。 对于不携带电荷的导电颗粒，由于它们比溶液中的密度高，它们可以自然地沉积到芯片凸块的表面。 然后施加电镀程序以将导电颗粒固定到凸块上。

公开(公告)号：US20050227475A1

公开(公告)日：2005-10-13

申请号：US10862515

申请日：2004-06-05

申请人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

发明人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

IPC分类号： H01L21/288 ,  H01L21/36 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60

CPC分类号： H01L21/4853 ,  H01L21/2885 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/19042 ,  H01L2924/00

摘要： A method for dispersing conductive particles is provided, which takes advantages of simplified process and lower cost. The present invention is in applying of chemical bonding between metal and thiol with electric charge, thereby makes conductive particles and chip bumps carry charges. The conductive particles are then migrated and fixed to the bonding locations on the bumps of a chip through an electrophoresis procedure. The conductive particles will not come off during subsequent processes. The present invention can be applied to flip-chip packaging or other fine-pitch applications. With the present invention, the distance between bumps is smaller than 20 μm and the density of conductive particles is larger than 15 particles per bump.

摘要翻译： 提供了分散导电颗粒的方法，其优点是工艺简单，成本低。 本发明是通过电荷施加金属与硫醇之间的化学键合，从而使导电粒子和芯片凸起带电。 然后通过电泳方法将导电颗粒迁移并固定到芯片的凸块上的结合位置。 导电颗粒在后续工艺中不会脱落。 本发明可以应用于倒装芯片封装或其它细间距应用。 通过本发明，凸块之间的距离小于20μm，并且导电颗粒的密度大于每个凸块15个颗粒。

公开(公告)号：US20120211058A1

公开(公告)日：2012-08-23

申请号：US13372362

申请日：2012-02-13

申请人： Yu-Chih Chen ,  Hsi Sheng Chen ,  Chang-Ming Lin

发明人： Yu-Chih Chen ,  Hsi Sheng Chen ,  Chang-Ming Lin

IPC分类号： H01L31/048

CPC分类号： H01Q13/10 ,  H01Q1/2208 ,  H01Q9/0407 ,  H02S30/10

摘要： A solar panel includes a wireless device attached to or embedded in the solar panel where the wireless device includes a wireless transceiver circuit and a memory. In one embodiment, the solar panel includes an antenna formed on the metal frame of the solar panel where the antenna is electrically connected to the wireless device to extend a communication range of the wireless device. In another embodiment, the solar panel includes an antenna formed attached to a junction box of the solar panel. The antenna can be a slot antenna or a patch antenna.

摘要翻译： 太阳能电池板包括附接到太阳能电池板或嵌入太阳能电池板的无线设备，其中无线设备包括无线收发器电路和存储器。 在一个实施例中，太阳能面板包括形成在太阳能电池板的金属框架上的天线，其中天线电连接到无线设备以扩展无线设备的通信范围。 在另一个实施例中，太阳能电池板包括一个形成在太阳能电池板接线盒上的天线。 天线可以是缝隙天线或贴片天线。

公开(公告)号：US20060113656A1

公开(公告)日：2006-06-01

申请号：US11333346

申请日：2006-01-18

申请人： Rouh Uang ,  Yu-Chih Chen

发明人： Rouh Uang ,  Yu-Chih Chen

IPC分类号： H01L23/48

CPC分类号： B82Y10/00 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5384 ,  H01L24/29 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/10378 ,  Y10S977/762

摘要： A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity. The present conductive film can be served as an electrical connection between a fine-pitch chip and a chip or a fine-pitch chip and a substrate.

公开(公告)号：US10955752B2

公开(公告)日：2021-03-23

申请号：US16420134

申请日：2019-05-22

申请人： Yu-Chih Chen ,  Po-Chung Cheng ,  Li-Jui Chen ,  Shang-Chieh Chien ,  Sheng-Kang Yu ,  Wei-Chun Yen

发明人： Yu-Chih Chen ,  Po-Chung Cheng ,  Li-Jui Chen ,  Shang-Chieh Chien ,  Sheng-Kang Yu ,  Wei-Chun Yen

IPC分类号： G03F7/00 ,  G03F7/20 ,  H05G2/00 ,  G02B5/08

摘要： An EUV collector mirror for an extreme ultra violet (EUV) radiation source apparatus includes an EUV collector mirror body on which a reflective layer as a reflective surface is disposed, a heater attached to or embedded in the EUV collector mirror body and a drain structure to drain melted metal from the reflective surface of the EUV collector mirror body to a back side of the EUV collector mirror body.

公开(公告)号：US20110220182A1

公开(公告)日：2011-09-15

申请号：US12896687

申请日：2010-10-01

申请人： Chang-Ming Lin ,  Yu-Chih Chen

发明人： Chang-Ming Lin ,  Yu-Chih Chen

IPC分类号： H01L31/048

CPC分类号： H01L31/0504 ,  H01L31/02021 ,  H01L31/048 ,  H01L2924/0002 ,  H02S40/34 ,  H02S50/00 ,  Y02E10/50 ,  H01L2924/00

摘要： In one embodiment, a wireless device is embedded in a solar panel for providing remote tracking and/or performance monitoring of the solar panel. The wireless device may be a wireless tracking device including a memory for storing the identification or identity information of the solar panel or of the individual solar cells forming the panel. The wireless device may be a wireless tracking and monitoring device to provide both tracking and performance monitoring functions. In another embodiment, the wireless device is affixed to the exposed side of the back sheet of the solar panel but within the junction box interface so that the wireless device is enclosed in the junction box housing. In other embodiments, some of the elements of the wireless device may be embedded in the solar panel while other elements are affixed to the exposed back sheet inside the junction box housing.

摘要翻译： 在一个实施例中，将无线设备嵌入太阳能电池板中，以提供太阳能电池板的远程跟踪和/或性能监控。 无线设备可以是包括用于存储太阳能电池板或形成面板的各个太阳能电池的识别或身份信息的存储器的无线跟踪设备。 无线设备可以是无线跟踪和监控设备，以提供跟踪和性能监控功能。 在另一个实施例中，无线设备固定到太阳能电池板的背板的暴露侧，但是在接线盒接口内，使得无线设备被封装在接线盒外壳中。 在其他实施例中，无线设备的一些元件可以嵌入在太阳能电池板中，而其它元件固定到接线盒壳体内的暴露的背板上。

公开(公告)号：US20070046830A1

公开(公告)日：2007-03-01

申请号：US11467166

申请日：2006-08-25

申请人： Yu-Chih Chen ,  Kuo-Tien Su ,  Meng-Nan Tsou

发明人： Yu-Chih Chen ,  Kuo-Tien Su ,  Meng-Nan Tsou

IPC分类号： H04N5/44 ,  H04N9/64

CPC分类号： H04N5/4448 ,  H04N21/42646 ,  H04N21/4316 ,  H04N21/4331 ,  H04N21/4334 ,  H04N21/435 ,  H04N21/440281 ,  H04N21/4858

摘要： A method and an apparatus for capturing consecutive frames in digital video are disclosed. Through adding a function of capturing consecutive frames in digital video to digital televisions or digital recording equipments, the continuous fantastic frames in digital video can be displayed on the screen for users to watch and choose. Besides, with a recording function, those fabulous frames can also be preserved for the use of the follow-up view and demonstration. Finally, the purpose of capturing and storing best frames is achieved.

摘要翻译： 公开了一种在数字视频中捕获连续帧的方法和装置。 通过在数字电视或数字录像设备中添加将数字视频中的连续帧捕获的功能，可以在屏幕上显示数字视频中连续的奇幻帧，供用户观看和选择。 此外，通过录音功能，还可以保留这些神话般的框架，以便使用后续视图和演示。 最后，实现捕获和存储最佳帧的目的。