摘要:
Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.
摘要:
Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.
摘要:
Disclosed is a photosensitive resin composition comprising a resin (A) soluble in an aqueous alkaline solution, a crosslinking agent (B), a photopolymerization initiator (C) and a curing agent (D) wherein the curing agent (D) is an epoxy compound obtained by glycidylating a compound containing not less than 80% of a tetraphenylethane derivative represented by the following formula (1). In the formula, R1 to R8 independently represents a hydrogen atom, a C1-C4 alkyl group or a halogen atom.
摘要:
A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided.An alkaline aqueous solution-soluble photosensitive resin composition containing an alkaline aqueous solution-soluble resin (A) obtained by adding a polybasic acid anhydride (c) to a resin (C) which is a reaction product of an epoxy resin (a) represented by the formula (1) with an unsaturated monocarboxylic acid (b), an epoxy resin (a′) represented by the formula (1) as a curing agent (B) and a photopolymerization initiator. [In the formula, n represents a positive number of 1 to 10 as an average value.]
摘要:
The present invention provides a novel polyamide acid resin (A) containing an unsaturated group, suitable to a photosensitive resin composition, and a photosensitive resin composition using the same, which is excellent in photosensitivity, and the resultant cured product is excellent in flexibility as well as adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, and the like. Said polyamide acid resin (A) containing an unsaturated group is obtained by reacting an unsaturated group-containing polyester resin (a) having a terminal anhydride group, and a compound (b) having two amino groups in a molecule, and said photosensitive resin composition is obtained by reacting a resin composition containing said polyamide acid resin (A) containing an unsaturated group, a crosslinker (B) and a photopolymerization initiator (C).
摘要:
[PROBLEMS] To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof. [MEANS FOR SOLVING PROBLEMS] A photosensitive resin composition comprising a carboxyl group-containing resin (A) which is a reaction product of a compound (a) represented by the following formula (1): wherein n is an average value of 1 to 20; R1 and R2 may be the same or different, and are each a hydrogen atom, a halogen atom or a C1 to C4 lower alkyl group; R3, R5, R8 and R10 may be the same or different, and are each a hydrogen atom, a halogen atom or a methyl group; and R4, R6, R7 and R9 may be the same or different, and are each a hydrogen atom or a methyl group, a compound (b) having an ethylenically unsaturated group and a glycidyl group in the molecule and a polybasic acid anhydride (c), a crosslinking agent (B) and a photopolymerization initiator (C), and a cured product thereof.
摘要:
A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin (A) soluble in aqueous alkali solutions, the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).
摘要:
A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin (A) soluble in aqueous alkali solutions, the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).
摘要:
An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer.A copper foil with a resin layer characterized in that a copper foil having no roughening treatment applied thereto is directly joined to a resin layer, which contains a phenolic hydroxyl group-containing aromatic polyamide resin having a structure represented by the following formula (1): in the formula (1), m and n denote average values and satisfy the relationship: 0.005≦n/(m+n)
摘要翻译:本发明的目的是提供一种铜箔,其具有用作柔性印刷线路板的树脂基板的树脂层,并且在不进行粗糙化处理的铜箔和原料之间具有良好的粘附性 树脂层。 一种具有树脂层的铜箔,其特征在于将不进行粗糙化处理的铜箔直接接合到树脂层上,所述树脂层含有具有由下式(1)表示的结构的含酚羟基的芳族聚酰胺树脂: 在式(1)中,m和n表示平均值,满足关系式:0.005&nlE; n /(m + n)<0.05,m + n为2〜200; Ar1是二价芳族基团; Ar 2是具有酚性羟基的二价芳香族基团,Ar 3是二价芳香族基团。
摘要:
Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005≦n/(m+n)