公开(公告)号：US06495470B2

公开(公告)日：2002-12-17

申请号：US08580532

申请日：1995-12-29

申请人： S. M. Reza Sadjadi ,  Mansour Moinpour ,  Te Hua Lin ,  Farhad K. Moghadam

发明人： S. M. Reza Sadjadi ,  Mansour Moinpour ,  Te Hua Lin ,  Farhad K. Moghadam

IPC分类号： H01L21461

CPC分类号： H01L21/76804 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a contact opening between two conductive features over a semiconductor substrate. Oxide spacers are formed adjacent to the conductive features. A doped oxide layer is then deposited over the semiconductor substrate. Finally, the contact opening is etched through the doped oxide layer between the conductive features such that the oxide spacers are exposed within the contact opening.

摘要翻译： 一种在半导体衬底上形成两个导电特征之间的接触开口的方法。 形成与导电特征相邻的氧化物间隔物。 然后在半导体衬底上沉积掺杂的氧化物层。 最后，通过导电特征之间的掺杂氧化物层蚀刻接触开口，使得氧化物间隔物暴露在接触开口内。

公开(公告)号：US5883436A

公开(公告)日：1999-03-16

申请号：US802285

申请日：1997-02-20

申请人： S. M. Reza Sadjadi ,  Mansour Moinpour ,  Te Hua Lin ,  Farhad K. Moghadam

发明人： S. M. Reza Sadjadi ,  Mansour Moinpour ,  Te Hua Lin ,  Farhad K. Moghadam

IPC分类号： H01L21/768 ,  H01L23/522 ,  H01L29/34 ,  H01L23/48

CPC分类号： H01L21/76804 ,  H01L23/5226 ,  H01L2924/0002

摘要： A method of forming a contact opening between two conductive features over a semiconductor substrate. Oxide spacers are formed adjacent to the conductive features. A doped oxide layer is then deposited over the semiconductor substrate. Finally, the contact opening is etched through the doped oxide layer between the conductive features such that the oxide spacers are exposed within the contact opening.

公开(公告)号：US08268118B2

公开(公告)日：2012-09-18

申请号：US12711420

申请日：2010-02-24

申请人： Sangheon Lee ,  Dae-Han Choi ,  Jisoo Kim ,  Peter Cirigliano ,  Zhisong Huang ,  Robert Charatan ,  S. M. Reza Sadjadi

发明人： Sangheon Lee ,  Dae-Han Choi ,  Jisoo Kim ,  Peter Cirigliano ,  Zhisong Huang ,  Robert Charatan ,  S. M. Reza Sadjadi

IPC分类号： H01L21/3065

CPC分类号： C23F4/00 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/76816 ,  Y10S438/947

摘要： A method for forming a feature in an etch layer is provided. A photoresist layer is formed over the etch layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls. A control layer is formed over the photoresist layer and bottoms of the photoresist features. A conformal layer is deposited over the sidewalls of the photoresist features and control layer to reduce the critical dimensions of the photoresist features. Openings in the control layer are opened with a control layer breakthrough chemistry. Features are etched into the etch layer with an etch chemistry, which is different from the control layer break through chemistry, wherein the control layer is more etch resistant to the etch with the etch chemistry than the conformal layer.

摘要翻译： 提供了一种在蚀刻层中形成特征的方法。 在蚀刻层上形成光致抗蚀剂层。 图案化光致抗蚀剂层以形成具有光致抗蚀剂侧壁的光致抗蚀剂特征。 在光致抗蚀剂层和光致抗蚀剂特征的底部上形成控制层。 在光致抗蚀剂特征和控制层的侧壁上沉积保形层以减少光刻胶特征的临界尺寸。 控制层的开口打开，控制层突破性化学。 特征被蚀刻到蚀刻层中，其蚀刻化学性质不同于控制层突破性化学，其中控制层比蚀刻化学性质比共形层更耐蚀刻蚀刻。

公开(公告)号：US08172980B2

公开(公告)日：2012-05-08

申请号：US12202043

申请日：2008-08-29

申请人： S. M. Reza Sadjadi ,  Zhi-Song Huang

发明人： S. M. Reza Sadjadi ,  Zhi-Song Huang

IPC分类号： C23F1/00 ,  H01L21/306 ,  C23C16/00

CPC分类号： H01L21/7682 ,  H01J37/32623 ,  H01J37/32633 ,  H01J37/32642 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/31144

摘要： A method for reducing capacitances between semiconductor device wirings is provided. A sacrificial layer is formed over a dielectric layer. A plurality of features are etched into the sacrificial layer and dielectric layer. The features are filled with a filler material. The sacrificial layer is removed, so that parts of the filler material remain exposed above a surface of the dielectric layer, where spaces are between the exposed parts of the filler material, where the spaces are in an area formerly occupied by the sacrificial layer. Widths of the spaces between the parts of the filler material are shrunk with a shrink sidewall deposition. Gaps are etched into the dielectric layer through the shrink sidewall deposition. The filler material and shrink sidewall deposition are removed.

摘要翻译： 提供了用于降低半导体器件布线之间的电容的方法。 在电介质层上形成牺牲层。 多个特征被蚀刻到牺牲层和电介质层中。 功能填充填充材料。 去除牺牲层，使得填充材料的部分保持暴露在电介质层的表面之上，其中空间位于填充材料的暴露部分之间，其中空间在先前被牺牲层占据的区域中。 填充材料部分之间的间隙的宽度随收缩侧壁沉积而收缩。 通过收缩侧壁沉积将间隙蚀刻到介电层中。 去除填充材料和收缩侧壁沉积。

公开(公告)号：US07977242B2

公开(公告)日：2011-07-12

申请号：US12366113

申请日：2009-02-05

申请人： S. M. Reza Sadjadi ,  Lumin Li ,  Andrew R. Romano

发明人： S. M. Reza Sadjadi ,  Lumin Li ,  Andrew R. Romano

IPC分类号： H01L21/461 ,  H01L21/311

CPC分类号： H01L21/0337

摘要： A method for providing features in an etch layer is provided by forming an organic mask layer over the inorganic mask layer, forming a silicon-containing mask layer over the organic mask layer, forming a patterned mask layer over the silicon-containing mask layer, etching the silicon-containing mask layer through the patterned mask, depositing a polymer over the etched silicon-containing mask layer, depositing a silicon-containing film over the polymer, planarizing the silicon-containing film, selectively removing the polymer leaving the silicon-containing film, etching the organic layer, and etching the inorganic layer.

摘要翻译： 通过在无机掩模层上形成有机掩模层，在有机掩模层上形成含硅掩模层，在含硅掩模层上形成图案化掩模层，蚀刻，提供蚀刻层中提供特征的方法 通过图案化掩模的含硅掩模层，在蚀刻的含硅掩模层上沉积聚合物，在聚合物上沉积含硅膜，平坦化含硅膜，选择性地除去离开含硅膜的聚合物 蚀刻有机层，并蚀刻无机层。

公开(公告)号：US07772122B2

公开(公告)日：2010-08-10

申请号：US12233517

申请日：2008-09-18

申请人： Peter Cirigliano ,  Helen Zhu ,  Ji Soo Kim ,  S. M. Reza Sadjadi

发明人： Peter Cirigliano ,  Helen Zhu ,  Ji Soo Kim ,  S. M. Reza Sadjadi

IPC分类号： H01L21/311

CPC分类号： H01L21/0337 ,  H01L21/31144 ,  H01L21/312

摘要： An etch layer underlying a patterned photoresist mask is provided. A plurality of sidewall forming processes are performed. Each sidewall forming process comprises depositing a protective layer on the patterned photoresist mask by performing multiple cyclical depositions. Each cyclical deposition involves at least a depositing phase for depositing a deposition layer over surfaces of the patterned photoresist mask and a profile shaping phase for shaping vertical surfaces in the deposition layer. Each sidewall forming process further comprises a breakthrough etch for selectively etching horizontal surfaces of the protective layer with respect to vertical surfaces of the protective layer. Afterwards, the etch layer is etched to form a feature having a critical dimension that is less than the critical dimension of the features in the patterned photoresist mask.

摘要翻译： 提供了图案化光刻胶掩模下面的蚀刻层。 执行多个侧壁形成工序。 每个侧壁形成工艺包括通过执行多个循环沉积在图案化的光致抗蚀剂掩模上沉积保护层。 每个循环沉积涉及至少沉积阶段，用于在图案化的光致抗蚀剂掩模的表面上沉积沉积层，以及用于在沉积层中形成垂直表面的轮廓成形阶段。 每个侧壁形成工艺还包括用于相对于保护层的垂直表面选择性地蚀刻保护层的水平表面的穿透蚀刻。 之后，刻蚀蚀刻层以形成临界尺寸小于图案化光致抗蚀剂掩模中特征的临界尺寸的特征。

公开(公告)号：US07491647B2

公开(公告)日：2009-02-17

申请号：US11223363

申请日：2005-09-09

申请人： S. M. Reza Sadjadi ,  Peter Cirigliano ,  Ji Soo Kim ,  Zhisong Huang ,  Eric A. Hudson

发明人： S. M. Reza Sadjadi ,  Peter Cirigliano ,  Ji Soo Kim ,  Zhisong Huang ,  Eric A. Hudson

IPC分类号： H01L21/311

CPC分类号： H01L21/0273 ,  H01L21/0274 ,  H01L21/31144 ,  H01L21/76802 ,  Y10S438/942 ,  Y10S438/949

摘要： A method for etching a feature in an etch layer is provided. A patterned photoresist mask is formed over the etch layer with photoresist features with sidewalls wherein the sidewalls of the photoresist features have striations forming peaks and valleys. The striations of the sidewalls of the photoresist features are reduced. The reducing the striations comprises at least one cycle, wherein each cycle comprises etching back peaks formed by the striations of the sidewalls of the photoresist features and depositing on the sidewalls of the photoresist features. Features are etched into the etch layer through the photoresist features. The photoresist mask is removed.

摘要翻译： 提供了蚀刻蚀刻层中的特征的方法。 在具有侧壁的光致抗蚀剂特征的蚀刻层上形成图案化的光致抗蚀剂掩模，其中光致抗蚀剂特征的侧壁具有形成峰和谷的条纹。 光致抗蚀剂特征的侧壁的条纹减小。 减小条纹包括至少一个周期，其中每个周期包括蚀刻由光致抗蚀剂特征的侧壁的条纹形成的峰，并沉积在光致抗蚀剂特征的侧壁上。 通过光致抗蚀剂特征将特征蚀刻到蚀刻层中。 去除光致抗蚀剂掩模。

公开(公告)号：US07432189B2

公开(公告)日：2008-10-07

申请号：US11291672

申请日：2005-11-30

申请人： S. M. Reza Sadjadi ,  Zhi-Song Huang

发明人： S. M. Reza Sadjadi ,  Zhi-Song Huang

IPC分类号： H01L21/4763

CPC分类号： H01L21/7682 ,  H01J37/32623 ,  H01J37/32633 ,  H01J37/32642 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/31144

摘要： A method for reducing capacitances between semiconductor device wirings is provided. A sacrificial layer is formed over a dielectric layer. A plurality of features are etched into the sacrificial layer and dielectric layer. The features are filled with a filler material. The sacrificial layer is removed, so that parts of the filler material remain exposed above a surface of the dielectric layer, where spaces are between the exposed parts of the filler material, where the spaces are in an area formerly occupied by the sacrificial layer. Widths of the spaces between the parts of the filler material are shrunk with a shrink sidewall deposition. Gaps are etched into the dielectric layer through the shrink sidewall deposition. The filler material and shrink sidewall deposition are removed.

摘要翻译： 提供了用于降低半导体器件布线之间的电容的方法。 在电介质层上形成牺牲层。 多个特征被蚀刻到牺牲层和电介质层中。 功能填充填充材料。 去除牺牲层，使得填充材料的部分保持暴露在电介质层的表面之上，其中空间位于填充材料的暴露部分之间，其中空间在先前被牺牲层占据的区域中。 填充材料部分之间的间隙的宽度随收缩侧壁沉积而收缩。 通过收缩侧壁沉积将间隙蚀刻到介电层中。 去除填充材料和收缩侧壁沉积。

公开(公告)号：US07429533B2

公开(公告)日：2008-09-30

申请号：US11432194

申请日：2006-05-10

申请人： Zhisong Huang ,  Jeffrey Marks ,  S. M. Reza Sadjadi

发明人： Zhisong Huang ,  Jeffrey Marks ,  S. M. Reza Sadjadi

IPC分类号： H01L21/311 ,  H01L21/306

CPC分类号： H01L21/0337 ,  H01L21/0338 ,  H01L21/3086 ,  H01L21/3088 ,  H01L21/31144 ,  H01L21/32139

摘要： A method for providing features in an etch layer is provided. A sacrificial patterned layer with sacrificial features is provided over an etch layer. Conformal sidewalls are formed in the sacrificial features, comprising at least two cycles of a sidewall formation process, wherein each cycle comprises a sidewall deposition phase and a sidewall profile shaping phase. Parts of the sacrificial patterned layer between conformal sidewalls are removed leaving the conformal sidewalls with gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed. Features are etched in the etch layer using the conformal sidewalls as an etch mask, wherein the features in the etch layer are etched through the gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed.

摘要翻译： 提供了一种用于在蚀刻层中提供特征的方法。 在蚀刻层上提供具有牺牲特征的牺牲图案层。 保形侧壁形成在牺牲特征中，包括侧壁形成工艺的至少两个循环，其中每个循环包括侧壁沉积阶段和侧壁轮廓成形阶段。 除去共形侧壁之间的牺牲图案层的部分，留下保形侧壁，其中保形侧壁之间的间隙被选择性地去除牺牲图案层的部分。 使用保形侧壁作为蚀刻掩模在蚀刻层中蚀刻特征，其中蚀刻层中的特征被蚀刻通过牺牲图案层的部分被选择性去除的共形侧壁之间的间隙。

公开(公告)号：US07390749B2

公开(公告)日：2008-06-24

申请号：US11558238

申请日：2006-11-09

申请人： Ji Soo Kim ,  Sangheon Lee ,  Daehan Choi ,  S. M. Reza Sadjadi

发明人： Ji Soo Kim ,  Sangheon Lee ,  Daehan Choi ,  S. M. Reza Sadjadi

IPC分类号： H01L21/311

CPC分类号： H01L21/0338 ,  H01L21/0337 ,  H01L21/31144

摘要： A method for providing features in an etch layer with a memory region and a peripheral region is provided. A memory patterned mask is formed over a first sacrificial layer. A first set of sacrificial layer features is etched into the first sacrificial layer and a second sacrificial layer. Features of the first set of sacrificial layer features are filled with filler material. The first sacrificial layer is removed. The spaces are shrunk with a shrink sidewall deposition. A second set of sacrificial layer features is etched into the second sacrificial layer. The filler material and shrink sidewall deposition are removed. A peripheral patterned mask is formed over the memory region and peripheral region. The second sacrificial layer is etched through the peripheral patterned mask. The peripheral patterned mask is removed. Features are etched into the etch layer from the second sacrificial layer.

摘要翻译： 提供了一种用于在具有存储区域和周边区域的蚀刻层中提供特征的方法。 存储器图案化掩模形成在第一牺牲层上。 第一组牺牲层特征被蚀刻到第一牺牲层和第二牺牲层中。 第一组牺牲层特征的特征填充有填充材料。 第一牺牲层被去除。 这些空间随着收缩侧壁沉积而收缩。 第二组牺牲层特征被蚀刻到第二牺牲层中。 去除填充材料和收缩侧壁沉积。 在存储器区域和外围区域上形成周边图案化掩模。 通过外围图案化掩模蚀刻第二牺牲层。 去除周边图案掩模。 特征从第二牺牲层蚀刻到蚀刻层中。