VARIABLE RESISTANCE MEMORY DEVICE
    3.
    发明申请

    公开(公告)号:US20200227475A1

    公开(公告)日:2020-07-16

    申请号:US16567094

    申请日:2019-09-11

    IPC分类号: H01L27/24 H01L45/00

    摘要: A variable resistance memory device including insulating patterns sequentially stacked on a substrate; first conductive lines between adjacent ones of the insulating patterns and spaced apart from each other in a first direction; a second conductive line between the first conductive lines and penetrating the insulating patterns in a third direction perpendicular to a top surface of the substrate; a phase-change pattern between the second conductive line and each of the first conductive lines and between the adjacent ones of the insulating patterns to cover a top surface of a first adjacent insulating pattern and a bottom surface of a second adjacent insulating pattern; and a selection element between the phase-change pattern and the second conductive line and between the adjacent ones of the insulating patterns to cover the top surface of the first adjacent insulating pattern and the bottom surface of the second adjacent insulating pattern.

    PHYSICAL VAPOR DEPOSITION METHODS AND SYSTEMS TO FORM SEMICONDUCTOR FILMS USING COUNTERBALANCE MAGNETIC FIELD GENERATORS
    4.
    发明申请
    PHYSICAL VAPOR DEPOSITION METHODS AND SYSTEMS TO FORM SEMICONDUCTOR FILMS USING COUNTERBALANCE MAGNETIC FIELD GENERATORS 有权
    物理蒸发沉积方法和系统使用平衡磁场发生器形成半导体膜

    公开(公告)号:US20150311065A1

    公开(公告)日:2015-10-29

    申请号:US14792597

    申请日:2015-07-06

    IPC分类号: H01L21/02 C23C14/35 H01J37/34

    摘要: Embodiments relate generally to semiconductor device fabrication and processes, and more particularly, to systems and methods that implement magnetic field generators configured to generate rotating magnetic fields to facilitate physical vapor deposition (“PVD”). In one embodiment, a system generates a first portion of a magnetic field adjacent a first circumferential portion of a substrate, and can generate a second portion of the magnetic field adjacent to a second circumferential portion of the substrate. The second circumferential portion is disposed at an endpoint of a diameter that passes through an axis of rotation to another endpoint of the diameter at which the first circumferential portion resides. The second peak magnitude can be less than the first peak magnitude. The system rotates the first and second portions of the magnetic fields to decompose a target material to form a plasma adjacent the substrate. The system forms a film upon the substrate.

    摘要翻译: 实施例通常涉及半导体器件制造和工艺,更具体地,涉及实现磁场发生器的系统和方法,其被配置为产生旋转磁场以促进物理气相沉积(“PVD”)。 在一个实施例中,系统产生与衬底的第一周向部分相邻的磁场的第一部分,并且可以产生与衬底的第二圆周部分相邻的磁场的第二部分。 第二圆周部分设置在通过旋转轴线的直径的端点处,到达第一圆周部分所在直径的另一端点。 第二峰值可以小于第一峰值。 该系统使磁场的第一和第二部分旋转以分解目标材料以在基片附近形成等离子体。 该系统在基底上形成膜。

    SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE MATERIAL PATTERN

    公开(公告)号:US20220085286A1

    公开(公告)日:2022-03-17

    申请号:US17384933

    申请日:2021-07-26

    IPC分类号: H01L45/00 H01L27/24

    摘要: A semiconductor device includes a first conductive line on a lower structure and extending in a first horizontal direction; a second conductive line on the first conductive line and extending in a second horizontal direction, the second horizontal direction being perpendicular to the first horizontal direction; and a memory cell structure between the first conductive line and the second conductive line. The memory cell may structure include a data storage material pattern and a selector material pattern overlapping the data storage material pattern in a vertical direction. The data storage material pattern may include a phase change material layer of InαGeβSbγTeδ. In the phase change material layer of InαGeβSbγTeδ, a sum of α and β may be lower than about 30 at. %, and a sum of γ and δ may be higher than about 70 at. %.

    THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

    公开(公告)号:US20210384256A1

    公开(公告)日:2021-12-09

    申请号:US17406166

    申请日:2021-08-19

    IPC分类号: H01L27/24 H01L45/00 G11C5/06

    摘要: A three-dimensional semiconductor memory device includes first conductive lines extending horizontally in a first direction, a second conductive line extending vertically in a second direction perpendicular to the first direction, and memory cells at cross-points between the first conductive lines and the second conductive line. The first conductive lines are laterally spaced apart from each other in a third direction crossing the first direction. Each of the memory cells includes a variable resistance element and a switching element that are horizontally arranged. The variable resistance element includes a first variable resistance pattern and a second variable resistance pattern arranged in the second direction, a first electrode between the first variable resistance pattern and the first conductive line, a second electrode between the second variable resistance pattern and the second conductive line, and a third electrode between the first variable resistance pattern and the second variable resistance pattern.