SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

    公开(公告)号:US20230080606A1

    公开(公告)日:2023-03-16

    申请号:US17852812

    申请日:2022-06-29

    摘要: A semiconductor device may include: a semiconductor substrate; a peripheral circuit structure on the semiconductor substrate; a plate pattern on the peripheral circuit structure and having a gap; and a stack structure on the plate pattern and including a first stack region and a second stack region. The first stack region may include gate electrodes stacked in a vertical direction perpendicular to an upper surface of the semiconductor substrate, and the second stack region may include both a conductor stack region including conductive layers stacked in the vertical direction and an insulator stack region including molded insulating layers at substantially the same height level as the conductive layers. The semiconductor device may also include vertical memory structure that extends through the first stack region; and source contact plugs electrically connected to at least one of the conductive layers of the conductor stack region and contacting the plate pattern.

    SEMICONDUCTOR DEVICE AND MASSIVE DATA STORAGE SYSTEM INCLUDING THE SAME

    公开(公告)号:US20220139821A1

    公开(公告)日:2022-05-05

    申请号:US17376240

    申请日:2021-07-15

    摘要: A semiconductor device includes lower circuit patterns on a lower substrate; lower bonding patterns on the lower circuit patterns, the lower bonding patterns including a conductive material and being electrically connected to the lower circuit patterns; upper bonding patterns on and contacting the lower bonding patterns, and including a conductive material; a passive device on the upper bonding patterns, and including a conductive material and contacting one of the upper bonding patterns; a gate electrode structure on the passive device, and including gate electrodes spaced apart from each other in a first direction, each of which extends in a second direction, and extension lengths in the second direction of the gate electrodes increasing from a lowermost level toward an uppermost level in a stepwise manner; a channel extending through at least a portion of the gate electrode structure; and an upper substrate on the channel.

    SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

    公开(公告)号:US20230005949A1

    公开(公告)日:2023-01-05

    申请号:US17720453

    申请日:2022-04-14

    摘要: A semiconductor device includes a first structure including a peripheral circuit and a second structure on the first structure. The second structure includes: a stack structure including first and second stack structures; separation structures passing through the first stack structure; a memory vertical structure between the separation structures and passing through the first stack structure; and a capacitor including first and second capacitor electrodes passing through the second stack structure and extending parallel to each other. The first stack structure includes spaced apart gate electrodes and interlayer insulating layers alternately stacked therewith. The second stack structure includes spaced apart first insulating layers, and second insulating layers alternately stacked therewith. Each of the first and second capacitor electrodes has a linear shape. The first and second insulating layers include a different material from each other. The second insulating layers include the same material as the interlayer insulating layers.

    Integrated circuit device and method of fabricating the same

    公开(公告)号:US11251196B2

    公开(公告)日:2022-02-15

    申请号:US16749255

    申请日:2020-01-22

    摘要: An integrated circuit device includes: a lower memory stack including a plurality of lower word lines located on a substrate, an upper memory stack located on the lower memory stack and including a plurality of upper word lines, at least one first lower interconnection layer extending in a horizontal direction at a first vertical level between the lower memory stack and the upper memory stack, and configured to be electrically connected to at least one lower word line selected from the plurality of lower word lines, a separate insulating film covering at least one first lower interconnection layer, and at least one first upper interconnection layer extending in the horizontal direction at a second vertical level higher than the upper memory stack, and configured to be electrically connected to at least one upper word line selected from the upper word lines.

    Integrated circuit device and method of fabricating the same

    公开(公告)号:US11581333B2

    公开(公告)日:2023-02-14

    申请号:US17573015

    申请日:2022-01-11

    摘要: An integrated circuit device includes: a lower memory stack including a plurality of lower word lines located on a substrate, an upper memory stack located on the lower memory stack and including a plurality of upper word lines, at least one first lower interconnection layer extending in a horizontal direction at a first vertical level between the lower memory stack and the upper memory stack, and configured to be electrically connected to at least one lower word line selected from the plurality of lower word lines, a separate insulating film covering at least one first lower interconnection layer, and at least one first upper interconnection layer extending in the horizontal direction at a second vertical level higher than the upper memory stack, and configured to be electrically connected to at least one upper word line selected from the upper word lines.