THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE

    公开(公告)号:US20210005629A1

    公开(公告)日:2021-01-07

    申请号:US17025479

    申请日:2020-09-18

    Abstract: A three-dimensional semiconductor memory device may include a peripheral circuit structure including transistors on a first substrate, and a cell array structure on the peripheral circuit structure, the cell array structure including: a first stack structure block comprising first stack structures arranged side by side in a first direction on a second substrate, a second stack structure block comprising second stack structures arranged side by side in the first direction on the second substrate, a separation structure disposed on the second substrate between the first stack structure block and the second stack structure block and comprising first mold layers and second mold layers, and a contact plug penetrating the separation structure. The cell array structure may include a first metal pad and the peripheral circuit structure may include a second metal pad. The first metal pad may be in contact with the second metal pad.

    NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATION
    10.
    发明申请
    NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATION 有权
    非易失性存储器件和操作方法

    公开(公告)号:US20150078095A1

    公开(公告)日:2015-03-19

    申请号:US14322335

    申请日:2014-07-02

    Abstract: A nonvolatile memory device includes a voltage generator that sequentially provides a first setup voltage and second setup voltage to a word line of a memory cell array, and control logic including a time control unit that determines a word line setup time for the word line in relation to the second setup voltage based on a difference between the first and second setup voltages.

    Abstract translation: 非易失性存储器件包括:电压发生器,其向存储单元阵列的字线依次提供第一设定电压和第二设定电压;以及控制逻辑,包括时间控制单元,所述时间控制单元确定所述字线的字线建立时间 基于所述第一和第二设定电压之间的差,将所述第二设置电压提供给所述第二设置电压。

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