公开(公告)号：US09840620B2

公开(公告)日：2017-12-12

申请号：US15022154

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  C08G14/06 ,  C08L61/34 ,  C08J5/24 ,  C08L71/12 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/285 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/3065 ,  C08G14/06 ,  C08J5/24 ,  C08J2371/12 ,  C08J2379/02 ,  C08J2425/10 ,  C08J2471/12 ,  C08K5/14 ,  C08K7/18 ,  C08L25/10 ,  C08L61/34 ,  C08L71/126 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/03 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012

Abstract: Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

公开(公告)号：US20160244611A1

公开(公告)日：2016-08-25

申请号：US15027353

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: C08L79/04 ,  H05K1/02 ,  H05K1/09 ,  C09D179/04 ,  H05K1/03

CPC classification number: C08L79/04 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/10 ,  B32B15/098 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2457/08 ,  C08G14/06 ,  C08G14/12 ,  C08K3/00 ,  C08K3/36 ,  C08K5/14 ,  C08K5/49 ,  C08K5/5399 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L71/126 ,  C08L79/085 ,  C09D179/04 ,  C09J161/34 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0355

Abstract: The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

Abstract translation: 本发明涉及无卤素树脂组合物，预浸料和由其制备的层压材料。 无卤素树脂组合物包含基于有机固体重量份的（A）40至80重量份的烯丙基改性的苯并恶嗪树脂，（B）10至20重量份的烃树脂，（C ）10〜40重量份烯丙基改性聚苯醚树脂，（D）10〜20重量份烯丙基改性双马来酰亚胺树脂，（E）0.01〜3重量份引发剂，（F） 10〜100重量份的填料，（G）0〜80重量份的含磷阻燃剂。 由无卤素树脂组合物制备的预浸料和层压材料具有较低的介电常数和介电损耗角正切值，更高的剥离强度，高玻璃化转变温度，优异的耐热性和更好的阻燃效果。

公开(公告)号：US09771479B2

公开(公告)日：2017-09-26

申请号：US15027353

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: B32B15/04 ,  C08L79/04 ,  C08K3/00 ,  C08K5/49 ,  C08L25/10 ,  C08L71/12 ,  C09D179/04 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  B32B15/098 ,  B32B15/20 ,  C08G14/06 ,  C08G14/12 ,  C09J161/34 ,  B32B5/02 ,  B32B5/26 ,  B32B7/10 ,  B32B15/14 ,  B32B15/18 ,  B32B15/08

CPC classification number: C08L79/04 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/10 ,  B32B15/098 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2457/08 ,  C08G14/06 ,  C08G14/12 ,  C08K3/00 ,  C08K3/36 ,  C08K5/14 ,  C08K5/49 ,  C08K5/5399 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L71/126 ,  C08L79/085 ,  C09D179/04 ,  C09J161/34 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0355

Abstract: The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.