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    Wiring substrate
    1.
    发明授权
    Wiring substrate 有权
    接线基板

    公开(公告)号：US09538664B2

    公开(公告)日：2017-01-03

    申请号：US14104282

    申请日：2013-12-12

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Hiroharu Yanagisawa ,  Kentaro Kaneko ,  Kazuhiro Oshima ,  Junichi Nakamura

    IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K3/0035 ,  H05K1/0366 ,  H05K3/0038 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/0346

    Abstract: A wiring substrate includes a first wiring layer with a wiring pattern and a metal foil. A first insulating layer includes a first through hole having a first end facing the metal foil and a second end. A second wiring layer includes a first opening having a diameter smaller than the second end. A second insulating layer includes a second through hole having a third end facing the wiring pattern and a fourth end. A third wiring layer includes a second opening having a diameter smaller than the fourth end. A first via is filled in the first opening, the first through hole, and a first recess, in the metal foil, having a diameter greater than the first end. A second via is filled in the second opening, the second through hole, and a second recess, in the wiring pattern, having a diameter greater than the third end.

    Abstract translation: 布线基板包括具有布线图案的第一布线层和金属箔。 第一绝缘层包括具有面向金属箔的第一端和第二端的第一通孔。 第二布线层包括直径小于第二端的第一开口。 第二绝缘层包括具有面向布线图案的第三端和第四端的第二通孔。 第三布线层包括直径小于第四端的第二开口。 第一通孔被填充在金属箔中的第一开口，第一通孔和第一凹部中，其具有大于第一端的直径。 第二通孔填充在布线图案中的第二开口，第二通孔和第二凹槽中，其直径大于第三端。

    ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
    电子元件内置衬底及其制造方法

    公开(公告)号：US20130319740A1

    公开(公告)日：2013-12-05

    申请号：US13904447

    申请日：2013-05-29

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Junji Sato ,  Tomohiro Nomura ,  Kazuhiro Oshima

    IPC: H05K1/18

    CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15313 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/10636 ,  H05K2203/0191 ,  Y02P70/611

    Abstract: An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively.

    Abstract translation: 电子部件内置基板包括具有芯部件的基板，所述芯部件具有设置有电子部件的开口，形成在所述芯部件的第一表面上的第一辅助绝缘层; 第二辅助绝缘层，形成在所述芯构件的第二表面上，所述第二辅助绝缘层具有第一通孔，填充所述电子部件之间的间隙和所述芯部件的开口的侧表面的填充树脂部分，以及 第一布线层，形成在第二辅助绝缘层上，并通过第一通孔连接到电子部件的连接端子。 芯构件的第一表面和整个第二表面的整体分别与第一辅助绝缘层和第二辅助绝缘层直接接触。

    Wiring board
    3.
    发明授权
    Wiring board 有权

    公开(公告)号：US10398027B2

    公开(公告)日：2019-08-27

    申请号：US16207446

    申请日：2018-12-03

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Kazuhiro Oshima ,  Junji Sato ,  Hitoshi Kondo ,  Katsuya Fukase

    IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31

    Abstract: A wiring board includes: a wiring structure including: a first insulating layer; a first wiring layer formed on a bottom surface of the first insulating layer; and a protective insulating layer which covers the bottom surface of the first insulating layer and has a first opening; and a support base member bonded to the protective insulating layer with an adhesive layer and has a second opening. A diameter of the second opening at a position between the top surface and the bottom surface of the support base member in a thickness direction of the support base member is smaller than a diameter of the second opening at the top surface of the support base member and a diameter of the second opening at the bottom surface of the support base member, and smaller than a diameter of the first opening.

    Electronic component built-in substrate and method of manufacturing the same
    6.
    发明授权
    Electronic component built-in substrate and method of manufacturing the same 有权
    电子元件内置基板及其制造方法

    公开(公告)号：US09247646B2

    公开(公告)日：2016-01-26

    申请号：US13904447

    申请日：2013-05-29

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Junji Sato ,  Tomohiro Nomura ,  Kazuhiro Oshima

    IPC: H05K1/18 ,  H05K3/46

    CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15313 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/10636 ,  H05K2203/0191 ,  Y02P70/611

    Abstract: An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively.

    Abstract translation: 电子部件内置基板包括具有芯部件的基板，所述芯部件具有设置有电子部件的开口，形成在所述芯部件的第一表面上的第一辅助绝缘层; 第二辅助绝缘层，形成在所述芯构件的第二表面上，所述第二辅助绝缘层具有第一通孔，填充所述电子部件之间的间隙和所述芯部件的开口的侧表面的填充树脂部分，以及 第一布线层，形成在第二辅助绝缘层上，并通过第一通孔连接到电子部件的连接端子。 芯构件的第一表面和整个第二表面的整体分别与第一辅助绝缘层和第二辅助绝缘层直接接触。

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