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公开(公告)号：US09966331B2
公开(公告)日：2018-05-08
申请号：US15056515
申请日：2016-02-29
IPC分类号： H01L23/498 , H01L25/10
CPC分类号： H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L25/105 , H01L2224/73204 , H01L2924/15311
摘要： The wiring substrate includes an insulation layer that includes a lower surface, an upper surface, and an intermediate surface located between the lower surface and the upper surface. A first wiring layer is formed on the lower surface of the insulation layer. A second wiring layer is formed on the intermediate surface of the insulation layer. A recess is formed in the upper surface of the insulation layer. The recess overlaps, in a plan view, a first through hole that extends through the insulation layer. The first through hole is filled with a via wiring, which is formed integrally with the first wiring layer. A bump is formed integrally with the via wiring and projected into the recess. An upper end surface of the bump is located above an upper surface of the second wiring layer.
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公开(公告)号：US20220223454A1
公开(公告)日：2022-07-14
申请号：US17573147
申请日：2022-01-11
IPC分类号： H01L21/683
摘要： A substrate fixing device includes: a base plate; an electrostatic adsorption member that adsorbs and holds a substrate; and a first adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate. A storage modulus of the first adhesive layer is not less than 0.01 MPa and not more than 25 MPa within a temperature range of −110° C. to 250° C.
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公开(公告)号：US09538664B2
公开(公告)日：2017-01-03
申请号：US14104282
申请日：2013-12-12
CPC分类号： H05K3/0035 , H05K1/0366 , H05K3/0038 , H05K3/3436 , H05K3/4007 , H05K3/421 , H05K3/427 , H05K3/4652 , H05K2201/096 , H05K2201/09827 , H05K2203/0346
摘要： A wiring substrate includes a first wiring layer with a wiring pattern and a metal foil. A first insulating layer includes a first through hole having a first end facing the metal foil and a second end. A second wiring layer includes a first opening having a diameter smaller than the second end. A second insulating layer includes a second through hole having a third end facing the wiring pattern and a fourth end. A third wiring layer includes a second opening having a diameter smaller than the fourth end. A first via is filled in the first opening, the first through hole, and a first recess, in the metal foil, having a diameter greater than the first end. A second via is filled in the second opening, the second through hole, and a second recess, in the wiring pattern, having a diameter greater than the third end.
摘要翻译： 布线基板包括具有布线图案的第一布线层和金属箔。 第一绝缘层包括具有面向金属箔的第一端和第二端的第一通孔。 第二布线层包括直径小于第二端的第一开口。 第二绝缘层包括具有面向布线图案的第三端和第四端的第二通孔。 第三布线层包括直径小于第四端的第二开口。 第一通孔被填充在金属箔中的第一开口，第一通孔和第一凹部中，其具有大于第一端的直径。 第二通孔填充在布线图案中的第二开口，第二通孔和第二凹槽中，其直径大于第三端。
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公开(公告)号：US20240249966A1
公开(公告)日：2024-07-25
申请号：US18418449
申请日：2024-01-22
IPC分类号： H01L21/683 , H01L21/687
CPC分类号： H01L21/6833 , H01L21/68757 , H01L21/68785
摘要： A substrate fixing device includes a base plate having a first surface in which a plurality of first bottomed holes are formed, an electrostatic chuck mounted on the first surface of the base plate and having a second surface facing the first surface, the second surface being formed therein with a plurality of second bottomed holes each connected to each of the first bottomed holes, and a plurality of fixing members each fit into one first bottomed hole and one second bottomed hole.
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公开(公告)号：US09698094B2
公开(公告)日：2017-07-04
申请号：US15228059
申请日：2016-08-04
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/486 , H01L21/563 , H01L21/568 , H01L23/3128 , H01L23/3178 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/13144 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81395 , H01L2224/81444 , H01L2224/81447 , H01L2224/83005 , H01L2224/83385 , H01L2224/92125 , H01L2924/15153 , H01L2924/15311 , H01L2924/1816 , H05K1/0213 , H05K1/111 , H05K1/181 , H05K3/205 , H05K2201/0769 , H05K2201/09472 , H05K2201/09772 , H05K2201/098 , H05K2201/10674 , H05K2201/2072 , H05K2203/0278 , H05K2203/1105 , H01L2924/00014 , H01L2924/014
摘要： A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer, and the recess portion is filled with the insulating layer.
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公开(公告)号：US11456200B2
公开(公告)日：2022-09-27
申请号：US16896815
申请日：2020-06-09
IPC分类号： H01L21/683 , H01J37/32 , H01L21/67
摘要： A substrate fixing apparatus includes: a base plate; an electrostatic adsorption member that adsorbs and retains a substrate; a support member that is disposed on the base plate to support the electrostatic adsorption member; and an adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate. The support member directly contacts the base plate and the electrostatic adsorption member. An elastic modulus of the support member is higher than an elastic modulus of the adhesive layer.
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公开(公告)号：US11088006B2
公开(公告)日：2021-08-10
申请号：US16430569
申请日：2019-06-04
IPC分类号： H01L21/683 , H01L21/67
摘要： An electrostatic chuck includes a platform, a power feed pin, a tubular insulator, an adhesive layer, and a first primer. The platform includes an electrode. The power feed pin contacts the electrode. The tubular insulator is provided around the power feed pin. The adhesive layer bonds the platform and the tubular insulator together. The first primer is provided on a surface of the tubular insulator facing toward the adhesive layer.
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公开(公告)号：US09961767B2
公开(公告)日：2018-05-01
申请号：US14990978
申请日：2016-01-08
IPC分类号： H05K1/18 , H05K1/03 , H05K3/00 , H05K3/46 , H05K7/12 , H05K7/00 , H05K1/02 , H05K1/11 , H05K3/34
CPC分类号： H05K1/036 , H05K1/02 , H05K1/0296 , H05K1/0298 , H05K1/0366 , H05K1/111 , H05K1/181 , H05K3/007 , H05K3/3436 , H05K3/4682 , H05K2201/01 , H05K2201/0183 , H05K2201/10
摘要： A circuit board includes an insulating layer including first and second insulator films, a first wiring layer embedded in the first insulator film and including pads and first wiring patterns exposed from the first insulator film, and a second wiring layer including second wiring patterns formed on the second insulator film and via wirings penetrating the insulating layer and electrically connecting the second wiring patterns to the first wiring layer. The first insulator film is made of a reinforcement-free resin that includes no reinforcing member. The second insulator film is made of a reinforcing member impregnated with a resin.
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公开(公告)号：US11152293B2
公开(公告)日：2021-10-19
申请号：US16701416
申请日：2019-12-03
IPC分类号： H01L23/498 , H01L21/48 , H01L23/16 , H01L23/00 , H01L21/56 , H01L23/31 , H01L23/538 , H01L23/14
摘要： A wiring board includes an insulating layer including a first insulating film provided with a first surface and a second surface that is opposite to the first surface, and composed of only resin, and a second insulating film provided with a first surface and a second surface that is opposite to the first surface, including a reinforcing member and resin, in which the reinforcing member is impregnated with the resin, and stacked on the first surface of the first insulating film such that the second surface of the second insulating film contacts the first surface of the first insulating film and the second surface of the first insulating film is exposed outside; and a first wiring layer embedded in the first insulating film, a predetermined surface of the first wiring layer being exposed from the second surface of the first insulating film.
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公开(公告)号：US20190385883A1
公开(公告)日：2019-12-19
申请号：US16430569
申请日：2019-06-04
IPC分类号： H01L21/683 , H01L21/67
摘要： An electrostatic chuck includes a platform, a power feed pin, a tubular insulator, an adhesive layer, and a first primer. The platform includes an electrode. The power feed pin contacts the electrode. The tubular insulator is provided around the power feed pin. The adhesive layer bonds the platform and the tubular insulator together. The first primer is provided on a surface of the tubular insulator facing toward the adhesive layer.
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