MEMORY SYSTEM INCLUDING A DELEGATE PAGE AND METHOD OF IDENTIFYING A STATUS OF A MEMORY SYSTEM

    公开(公告)号:US20180261298A1

    公开(公告)日:2018-09-13

    申请号:US15821155

    申请日:2017-11-22

    申请人: SK hynix Inc.

    IPC分类号: G11C29/38 G06F3/06 G11C29/36

    摘要: A nonvolatile memory system may include a nonvolatile memory device, a delegate page attacker, and a health status analyzer. The nonvolatile memory device may include at least one memory block including a plurality of storage pages and a delegate page. The delegate page attacker may be configured to attack a bit of the delegate page at the same corresponding location as a bit of the storage page in which an error occurs. The health status analyzer may be configured to perform write and read operations for the delegate page and analyzes error information occurred in the write and read operations to determine whether the nonvolatile memory device is in a failure status.

    SEMICONDUCTOR MEMORY SYSTEM AND METHOD OF REPAIRING THE SEMICONDUCTOR MEMORY SYSTEM

    公开(公告)号:US20190303253A1

    公开(公告)日:2019-10-03

    申请号:US16212302

    申请日:2018-12-06

    申请人: SK hynix Inc.

    IPC分类号: G06F11/20 G06F11/10 G11C29/52

    摘要: A semiconductor memory system includes a memory medium and a data input/output (I/O) pin repair control circuit. The memory medium includes a plurality of memory dies and a spare die. Each of the plurality of memory dies has a plurality of memory regions and a plurality of data I/O pins, and the spare die has a plurality of spare regions and a plurality of data I/O pins. The data I/O pin repair control circuit performs a repair process for replacing an abnormal data I/O pin among the plurality of data I/O pins included in any of the plurality of memory dies with a data I/O pin of the plurality of data I/O pins included in the spare die.

    ERROR CORRECTION METHOD OF A MEMORY SYSTEM

    公开(公告)号:US20210286674A1

    公开(公告)日:2021-09-16

    申请号:US17332448

    申请日:2021-05-27

    申请人: SK hynix Inc.

    IPC分类号: G06F11/10 H03M13/15

    摘要: An error correction method may include performing a first error correction code (ECC) decoding operation of read data outputted from a memory medium and storing the read data outputted from the memory medium into a loop-buffer, in a first operation mode, and performing a second ECC decoding operation of the read data stored in the loop-buffer may be performed in a second operation mode.

    MEMORY APPARATUS AND METHOD OF WEAR-LEVELING OF A MEMORY APPARATUS

    公开(公告)号:US20190171561A1

    公开(公告)日:2019-06-06

    申请号:US16271431

    申请日:2019-02-08

    申请人: SK hynix Inc.

    IPC分类号: G06F12/02

    摘要: A memory apparatus and a method of wear-leveling of a memory apparatus may be provided. The memory apparatus may include a memory having a plurality of storage blocks and a plurality of free blocks. The memory apparatus may include a memory controller configured for performing a first global wear-leveling to move data of a first storage block, which is a hot block among the storage blocks, to a first free block among the free blocks. The memory apparatus may include a memory controller configured for remapping a result of a logic operation of a logical page address of each of the pages in the first storage block and a first security refresh key to a physical page address of each of the pages in the first free block.

    SEMICONDUCTOR DEVICES AND SEMICONDUCTOR SYSTEMS

    公开(公告)号:US20170344422A1

    公开(公告)日:2017-11-30

    申请号:US15377024

    申请日:2016-12-13

    申请人: SK hynix Inc.

    IPC分类号: G06F11/10 G06F3/06 G11C29/52

    摘要: A semiconductor device may be provided. The semiconductor device may include an error correction circuit and a verification operation control circuit. The error correction circuit may be configured to output first correction data obtained by correcting an error of first read data inputted through a transmission data signal received, externally from the error correction circuit, as a correction data signal and configured to generate a write control signal according to the number of errors of the first read data. The verification operation control circuit may be configured to receive first correction data through the correction data signal to output the first correction data through an internal correction data signal and configured to generate an internal command signal for storing the first correction data externally from the semiconductor device, based on the write control signal.