Abstract:
A memory device may include: an active controller configured to output a row active signal in response to a refresh control signal and a row enable signal when an active signal is activated; a refresh controller configured to generate and store a flag bit for controlling a refresh operation in response to a refresh signal, a precharge signal, and a precharge stop signal, and output the row enable signal corresponding to the stored flag bit to the active controller; and a cell array circuit configured to perform a refresh operation in memory cell array areas in response to the row active signal.
Abstract:
A first data input circuit receives test data from a first pad to generate first input control data for generating cell input data stored in a memory cell array during a first operation period. A first data output circuit receives first output control data generated from cell output data outputted from the memory cell array to output the first output control data to an internal node coupled to a second pad during a second operation period.
Abstract:
A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device may output an external strobe signal and external data. The second semiconductor device may extract error information from the external data in synchronization with the external strobe signal during a write operation and outputs the external data and the error information through input/output (I/O) lines during the write operation. The second semiconductor device may correct errors of internal data with the error information loaded on the I/O lines to output the corrected internal data as the external data during a read operation.
Abstract:
A parallel test device and method are disclosed, which relates to a technology for performing a multi-bit parallel test by compressing data. The parallel test device includes: a pad unit through which data input/output (I/O) operations are achieved; a plurality of input buffers configured to activate write data received from the pad unit in response to a buffer enable signal, and output the write data to a global input/output (GIO) line; a plurality of output drivers configured to activate read data received from the global I/O (GIO) line in response to a strobe delay signal, and output the read data to the pad unit; and a test controller configured to activate the buffer enable signal and the strobe delay signal during a test mode in a manner that the read data received from the plurality of output drivers is applied to the plurality of input buffers such that the read data is operated as the write data.
Abstract:
A phase mixer circuit is configured to receive a first input clock signal and a second input clock signal, and to generate an intermediate clock signal having an intermediate phase between phases of the first and second input clock signals. The phase mixer circuit is configured to determine a logic value of a mixed code signal, and to generate an output clock signal by mixing one of the first and second input clock signals and the intermediate clock signal.
Abstract:
A semiconductor device may include a buffer control signal generation circuit, an input control signal generation circuit and an internal data generation circuit. The buffer control signal generation circuit may be configured to generate a buffer control signal. The buffer control signal may be enabled in synchronization with a point of time that a predetermined section elapses from a point of time that a write command signal is generated. The input control signal generation circuit may be configured to receive a data strobe signal to generate an input control signal, in response to the buffer control signal. The internal data generation circuit may be configured to receive a data signal to generate internal data.
Abstract:
A parallel test device and method are disclosed, which relates to a technology for performing a multi-bit parallel test by compressing data. The parallel test device includes: a pad unit through which data input/output (I/O) operations are achieved; a plurality of input buffers configured to activate write data received from the pad unit in response to a buffer enable signal, and output the write data to a global input/output (GIO) line; a plurality of output drivers configured to activate read data received from the global I/O (GIO) line in response to a strobe delay signal, and output the read data to the pad unit; and a test controller configured to activate the buffer enable signal and the strobe delay signal during a test mode in a manner that the read data received from the plurality of output drivers is applied to the plurality of input buffers such that the read data is operated as the write data.
Abstract:
Data input circuits are provided. The data input circuit includes a drive clock signal generator, a data transmitter and a write driver. The drive clock signal generator is configured to shift and delay a final clock signal generated in response to a pulse of a sampled clock signal and configured to generate a drive clock signal in response to the delayed final clock signal. The data transmitter is configured to output input data signals as write input data signals in response to the drive clock signal. The write driver is configured to receive the write input data signals in response to the drive clock signal to drive signals on global lines.
Abstract:
A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device may output an external strobe signal and external data. The second semiconductor device may extract error information from the external data in synchronization with the external strobe signal during a write operation and outputs the external data and the error information through input/output (I/O) lines during the write operation. The second semiconductor device may correct errors of internal data with the error information loaded on the I/O lines to output the corrected internal data as the external data during a read operation.
Abstract:
A semiconductor device may be provided. The semiconductor device may include a first chip and a second chip. The second chip may be configured to receive signals from the first chip to generate a latch address based on the received signals from the first chip.