摘要:
Provided is a multi-carrier communication device capable of reducing the deterioration of a reception quality while suppressing the peak power of a multi-carrier signal. In this device, a clipping strain measurement unit (108) calculates the individual average powers (or the clipping strain powers) of peak suppression signals contained in a center area and in end areas. Moreover, the clipping strain measurement unit (108) uses the calculated clipping strain, to calculates the ratios of the signal powers to the clipping strain powers (or the ratios of the signals to the clipping strains) individually for the center area and the end areas, and outputs the calculated ratios of the signals to the clipping strains to a puncture-modulation mode selection unit (109). On the basis of the ratios of the signals to the clipping strains for the individual areas, the puncture-modulation mode selection unit (109) selects the encoding percentage, the modulation mode or the power of the transmission data to be superposed on the individual areas.
摘要:
Multicarrier transmission apparatus 100 receives channel quality information of subcarriers from multicarrier reception apparatus 200 and interleave pattern setting section 108 sets an interleave pattern according to channel quality of subcarriers. Interleaver 106 interleaves I components and/or Q components of symbols using the set interleave pattern. As a result, it is possible to optimize diversity gains in modulation diversity modulation/demodulation according to channel quality.
摘要:
Provided is a multi-carrier communication device capable of reducing the deterioration of a reception quality while suppressing the peak power of a multi-carrier signal. In this device, a clipping strain measurement unit (108) calculates the individual average powers (or the clipping strain powers) of peak suppression signals contained in a center area and in end areas. Moreover, the clipping strain measurement unit (108) uses the calculated clipping strain, to calculates the ratios of the signal powers to the clipping strain powers (or the ratios of the signals to the clipping strains) individually for the center area and the end areas, and outputs the calculated ratios of the signals to the clipping strains to a puncture-modulation mode selection unit (109). On the basis of the ratios of the signals to the clipping strains for the individual areas, the puncture-modulation mode selection unit (109) selects the encoding percentage, the modulation mode or the power of the transmission data to be superposed on the individual areas.
摘要:
The present invention provides a sponge blasting apparatus comprising: a recovering unit which sucks and recovers a blasting medium jetted out of a nozzle; a sorting unit which sorts the blasting medium sucked and recovered by the recovering unit into a reusable blasting medium and an unreusable blasting medium; a blower which gives a sucking force to the recovering unit via the sorting unit; a dust collector which removes dust from an exhaust air discharged from the sorting unit with a sucking force of the blower; a picking-apart unit which picks apart the reusable blasting medium sorted by the sorting unit; a continuous feeder which, having at least two reservoir tanks into which the reusable blasting medium picked apart by the picking-apart unit is inputted, changes over the two tanks between each other to continuously feed the nozzle with the blasting medium deposited in the tanks; and a carrier which carries to the continuous feeder the reusable blasting medium sorted by the sorting unit.
摘要:
A clock monitoring apparatus according to the invention including a main clock monitoring portion including a first counter for counting a main clock, issuing a normal operation confirming flag indicating that a normal operation is being carried out when the first counter is overflowed or reaches a previously determined set value, monitoring the normal operation confirming flag by a sub clock, issuing a first main clock stop flag having an output in correspondence with H (high level)/L (low level) of the normal operation confirming flag and a main clock initializing signal for initializing the main clock when the main clock is determined to stop and resetting the first main clock stop flag when the main clock is recovered by receiving the main clock initializing signal, and a sub clock switching control portion including a second counter for counting a signal output produced by calculating a logical sum of the sub clock and the first main clock stop flag at fall of the sub clock at a time point of generating the first main clock stop flag, switching to a sub clock operation by issuing a sub clock switching signal when the second counter output is overflowed or reaches a previously determined set value and resetting the second counter output when the main clock is recovered and a second main clock stop flag produced by inverting the first main clock stop flag and delaying the sub clock by a predetermined period by a main clock monitoring portion, is reset.
摘要:
A semiconductor module apparatus is configured such that the upper surface of a substrate on which are mounted a plurality of heat-generating semiconductor devices is covered with a radiation plate serving as a support frame for supporting the substrate. A plurality of radiation fins are protruding from the radiation plate. A cover plate is fixedly attached to the radiation plate in such a manner as to cover the radiation plate from above so as to define an air channel for cooling air therebetween. A cooling fan unit is fixedly disposed within the air channel.
摘要:
A heat radiation device for a thin electronic apparatus includes a rectangular plate-shaped base, a rectangular intermediate plate stacked on the base, a rectangular box-shaped cover stacked on the intermediate plate, and a fan. A depression is formed at a center portion of the base. A plurality of parallel fins are provided to form a discharge port for cooling air. The depression and the discharge port are connected via an arcuate communication portion. A circular opening is formed in the intermediate plate at a position corresponding to that of the depression, and the fan is attached to the circular opening. The intermediate plate and the base are connected together such that heat can be conduced therebetween. When the end surface of a side plate provided at each longer side of the cover is caused to abut the intermediate plate and/or the base, an intake port for cooling air is formed at a shorter side of the cover. When the fan is operated, cooling air is caused to flow between the intake port and the discharge port, so that heat accumulated within the base is radiated to the outside.
摘要:
A cooling device mounts a fan unit above a heat sink. The heat sink is mounted on a heat-generating element or buried therein. The cooling device produces an effective air flow and achieves a uniform cooling action by having the heat sink formed in various shapes. The cooling fan is disposed away from the heat sink or to the side of the sink and is used for effective cooling through an air conduit passage formed by pipes or a cover.
摘要:
The present invention relates to a hair growth inhibitor and a depilation accelerator, each comprising a crude drug selected from Bupleuri Radix, Perillae Herba, Rhel Rhizoma and Akebiae Caulis, or an extract thereof. This inhibitor or accelerator makes it possible to inhibit the growth of body hair or promote depilation, respectively, thereby reducing the frequency of hair removal treatment. Moreover, it makes the hair body finer, thereby facilitating the removal of the hair from feet or arms.
摘要:
A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).