公开(公告)号：US06979895B2

公开(公告)日：2005-12-27

申请号：US10600232

申请日：2003-06-19

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L21/98 ,  H01L25/065 ,  H05K1/14 ,  H01L23/02 ,  H01L23/34

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H05K1/144 ,  Y10S438/928 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package comprising multiple stacked substrates having flip-chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

摘要翻译： 一种半导体封装，包括多个堆叠的衬底，其具有通过片上组装技术附接到衬底的倒装芯片以实现密集封装。 基板优选地通过柱状结构的电连接彼此堆叠在一起。 电连接实现层叠基板之间的电连通，必须具有足够的高度以为安装在基板上的部件提供间隙，并且应优选地足够坚固以在堆叠的基板之间提供支撑。

公开(公告)号：US5994166A

公开(公告)日：1999-11-30

申请号：US813467

申请日：1997-03-10

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L21/98 ,  H01L25/065 ,  H05K1/14 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/50 ,  H01L25/0652 ,  H05K1/144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  Y10S438/928 ,  Y10T29/49144

摘要： A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

摘要翻译： 一种半导体封装，其包括多个堆叠的衬底，其具有通过板上组装技术附接到衬底的倒装芯片以实现密集封装。 基板优选地通过柱状结构的电连接彼此堆叠在一起。 电连接实现层叠基板之间的电连通，必须具有足够的高度以为安装在基板上的部件提供间隙，并且应优选地足够坚固以在堆叠的基板之间提供支撑。

公开(公告)号：US06815251B1

公开(公告)日：2004-11-09

申请号：US09241177

申请日：1999-02-01

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L2144

CPC分类号： H01L23/5386 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high density multi-chip module and method for construction thereof, wherein a plurality of integrated circuit dice with at least one row of generally central bond pads is bonded in a staggered flip-chip style to opposite sides of a metallized substrate. The bond pads of each die are positioned over a through-hole in the substrate, and the bond pads are wire-bonded from one side of the substrate to circuitry on the opposing side of the substrate. Application of a glob-top sealant into the through-holes seals the bond pads and bond wires. A ball grid array may be formed in the peripheral area surrounding the dice on one side of the substrate, or an edge connector may be incorporated for connection to an external circuit.

摘要翻译： 一种高密度多芯片模块及其构造方法，其中具有至少一排大致中心接合焊盘的多个集成电路芯片以交错的倒装芯片式结合到金属化衬底的相对侧。 每个管芯的接合焊盘定位在衬底中的通孔上方，并且接合焊盘从衬底的一侧引线接合到衬底的相对侧上的电路。 球形密封剂在通孔中的应用密封接合焊盘和接合线。 球栅阵列可以形成在基板的一侧上围绕骰子的周边区域中，或者可以并入边缘连接器以连接到外部电路。

公开(公告)号：US06583503B2

公开(公告)日：2003-06-24

申请号：US10137584

申请日：2002-05-02

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L2302

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H05K1/144 ,  Y10S438/928 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

公开(公告)号：US06404044B2

公开(公告)日：2002-06-11

申请号：US09834706

申请日：2001-04-13

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L2302

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H05K1/144 ,  Y10S438/928 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

摘要翻译： 一种半导体封装，其包括多个层叠衬底，其具有通过片上组装技术附接到衬底的倒装芯片以实现密集封装。 基板优选地通过柱状结构的电连接彼此堆叠在一起。 电连接实现层叠基板之间的电连通，必须具有足够的高度以为安装在基板上的部件提供间隙，并且应优选地足够坚固以在堆叠的基板之间提供支撑。

公开(公告)号：US06222265B1

公开(公告)日：2001-04-24

申请号：US09466454

申请日：1999-12-17

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L2334

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H05K1/144 ,  Y10S438/928 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

公开(公告)号：US07061092B2

公开(公告)日：2006-06-13

申请号：US10289549

申请日：2002-11-06

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L23/48

CPC分类号： H01L23/5386 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high-density multi-chip module and method for construction thereof, wherein a plurality of integrated circuit dice with at least one row of generally central bond pads is bonded in a staggered flip-chip style to opposite sides of a metallized substrate. The bond pads of each die are positioned over a through-hole in the substrate, and the bond pads are wire-bonded from one side of the substrate to circuitry on the opposing side of the substrate. Application of a glob-top sealant into the through-holes seals the bond pads and bond wires. A ball grid array may be formed in the peripheral area surrounding the dice on one side of the substrate, or an edge connection may be incorporated for connection to an external circuit.

摘要翻译： 一种高密度多芯片模块及其构造方法，其中具有至少一排大体上中心的接合焊盘的多个集成电路晶片以交错的倒装芯片式结合到金属化衬底的相对侧。 每个管芯的接合焊盘定位在衬底中的通孔上方，并且接合焊盘从衬底的一侧引线接合到衬底的相对侧上的电路。 球形密封剂在通孔中的应用密封接合焊盘和接合线。 球栅阵列可以形成在基板的一侧上围绕骰子的周边区域中，或者可以并入边缘连接用于连接到外部电路。

公开(公告)号：US6051878A

公开(公告)日：2000-04-18

申请号：US233997

申请日：1999-01-19

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L21/98 ,  H01L25/065 ,  H05K1/14 ,  H01L23/02

CPC分类号： H01L25/50 ,  H01L25/0652 ,  H05K1/144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  Y10S438/928 ,  Y10T29/49144

摘要： A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

摘要翻译： 一种半导体封装，其包括多个堆叠的衬底，其具有通过板上组装技术附接到衬底的倒装芯片以实现密集封装。 基板优选地通过柱状结构的电连接彼此堆叠在一起。 电连接实现层叠基板之间的电连通，必须具有足够的高度以为安装在基板上的部件提供间隙，并且应优选地足够坚固以在堆叠的基板之间提供支撑。

公开(公告)号：US08816405B2

公开(公告)日：2014-08-26

申请号：US13084649

申请日：2011-04-12

申请人： Salman Akram

发明人： Salman Akram

IPC分类号： H01L27/148

CPC分类号： H01L27/14607 ,  H01L27/146 ,  H01L27/14601 ,  H01L27/14603 ,  H01L27/14605 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14647 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/14692 ,  H01L31/02162 ,  H01L31/022408 ,  H01L31/028 ,  H01L31/0288 ,  H01L31/0352 ,  H01L31/035281 ,  H01L31/03762 ,  H01L31/1804

摘要： An elevated photosensor for image sensors and methods of forming the photosensor. The photosensor may have light sensors having indentation features including, but not limited to, v-shaped, u-shaped, or other shaped features. Light sensors having such an indentation feature can redirect incident light that is not absorbed by one portion of the photosensor to another portion of the photosensor for additional absorption. In addition, the elevated photosensors reduce the size of the pixel cells while reducing leakage, image lag, and barrier problems.

摘要翻译： 用于图像传感器的升高的光电传感器和形成光电传感器的方法。 光传感器可以具有具有凹陷特征的光传感器，包括但不限于v形，u形或其它成形特征。 具有这种压痕特征的光传感器可以将不被光电传感器的一部分吸收的入射光重定向到光传感器的另一部分以便额外吸收。 此外，升高的光电传感器减小像素单元的尺寸，同时减少泄漏，图像滞后和屏障问题。

公开(公告)号：US20120135567A1

公开(公告)日：2012-05-31

申请号：US13367158

申请日：2012-02-06

申请人： Salman Akram ,  David R. Hembree

发明人： Salman Akram ,  David R. Hembree

IPC分类号： H01L21/98 ,  F28F7/00

CPC分类号： H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.

摘要翻译： 本文公开了用于从堆叠的微特征装置传递热量的方法和装置。 在一个实施例中，微特征装置组件包括具有端子的支撑构件和具有由支撑构件承载的第一外部触点的第一微电子模具。 第一外部触点可操作地耦合到支撑构件上的端子。 组件还包括具有集成电路的第二微电子管芯和电耦合到第一外部触点的第二外部触头。 第一模具在支撑构件和第二模具之间。 组件还可以包括在第一模具和第二模具之间的传热单元。 传热单元包括第一传热部分，第二传热部分和第一和第二传热部分之间的间隙，使得第一外部接触部和第二外部接触部与间隙对准。