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公开(公告)号：US10304807B2
公开(公告)日：2019-05-28
申请号：US15951571
申请日：2018-04-12
发明人： Dae Hyun Park , Eun Jung Jo , Sung Won Jeong , Han Kim , Mi Ja Han
IPC分类号： H01L23/02 , H01L25/065 , H01L23/31 , H01L23/00 , H01L23/538 , H01L25/03
摘要： A fan-out semiconductor package includes: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a first encapsulant encapsulating at least portions of the first interconnection member and the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the first semiconductor chip, and the connection pads of the second semiconductor chip are electrically connected to the redistribution layer of the first interconnection member by wires.
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公开(公告)号：US09853003B1
公开(公告)日：2017-12-26
申请号：US15480573
申请日：2017-04-06
发明人： Mi Ja Han , Seong Hee Choi , Han Kim , Moon Il Kim , Dae Hyun Park
CPC分类号： H01L23/645 , H01L23/3128 , H01L24/02 , H01L24/13 , H01L24/19 , H01L24/20 , H01L2224/02331 , H01L2224/02373 , H01L2224/02379 , H01L2224/02381 , H01L2224/04105 , H01L2224/12105 , H01L2224/13024 , H01L2224/24195 , H01L2225/1035 , H01L2225/1041 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1432 , H01L2924/14335 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H01L2924/37001
摘要： A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the first connection member includes a coil pattern layer electrically connected to the connection pads of the semiconductor chip.
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公开(公告)号：US10157886B2
公开(公告)日：2018-12-18
申请号：US15437766
申请日：2017-02-21
发明人： Dae Hyun Park , Eun Jung Jo , Sung Won Jeong , Han Kim , Mi Ja Han
IPC分类号： H01L23/02 , H01L25/065 , H01L23/00 , H01L23/31
摘要： A fan-out semiconductor package includes: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a first encapsulant encapsulating at least portions of the first interconnection member and the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the first semiconductor chip, and the connection pads of the second semiconductor chip are electrically connected to the redistribution layer of the first interconnection member by wires.
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公开(公告)号：US10121769B2
公开(公告)日：2018-11-06
申请号：US15437766
申请日：2017-02-21
发明人： Dae Hyun Park , Eun Jung Jo , Sung Won Jeong , Han Kim , Mi Ja Han
IPC分类号： H01L23/02 , H01L25/065 , H01L23/00 , H01L23/31
摘要： A fan-out semiconductor package includes: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a first encapsulant encapsulating at least portions of the first interconnection member and the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the first semiconductor chip, and the connection pads of the second semiconductor chip are electrically connected to the redistribution layer of the first interconnection member by wires.
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公开(公告)号：US09526164B2
公开(公告)日：2016-12-20
申请号：US15002028
申请日：2016-01-20
发明人： Han Kim , Dae Hyun Park
CPC分类号： H05K1/0216 , H05K1/0206 , H05K1/0209 , H05K1/0215 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K3/0044 , H05K3/0094 , H05K3/403 , H05K2201/09063 , H05K2201/09618 , H05K2201/09709 , H05K2201/09727 , H05K2201/09854
摘要： A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes a base, a wiring structure disposed on at least one of a surface and an interior of the base, and a plurality of stitching vias penetrating through the base in a thickness direction along an edge of the base and having side surfaces exposed externally.
摘要翻译： 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括底座，设置在基座的表面和内部中的至少一个上的布线结构，以及沿着基座的边缘在厚度方向上穿过基座的多个缝合通孔，并且具有侧表面 外露。
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6.发明授权公开(公告)号：US09313893B2
公开(公告)日：2016-04-12
申请号：US14143616
申请日：2013-12-30
发明人： Doo Hwan Lee , Yul Kyo Chung , Dae Hyun Park , Yee Na Shin , Seung Eun Lee
CPC分类号： H05K1/185 , H01L2224/16227 , H01L2924/15313 , H05K1/0231 , H05K3/4602 , H05K3/4644 , H05K2201/10015 , Y10T29/49139
摘要： A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern.
摘要翻译： 嵌入其中的电子部件的基板包括：第一绝缘层，包括空腔，并且分别包括设置在其上表面和下表面上的第一和第二电路图案; 所述电子部件至少部分地插入所述腔并包括外部电极; 堆叠在所述第一绝缘层上或下的多个积层绝缘层; 分别形成在积层绝缘层上的上下电路图案; 以及连接外部电极，上部电路图案，第一电路图案，第二电路图案和下部电路图案的多个通孔。
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公开(公告)号：US11037884B2
公开(公告)日：2021-06-15
申请号：US16433439
申请日：2019-06-06
发明人： Yoon Seok Seo , Dae Hyun Park , Sang Jong Lee , Chul Kyu Kim , Jae Hyun Lim
IPC分类号： H01L23/552 , H01L23/538 , H01L23/28
摘要： A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.
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公开(公告)号：US10333193B2
公开(公告)日：2019-06-25
申请号：US14754307
申请日：2015-06-29
发明人： Dae Hyun Park , Han Kim
摘要： A printed circuit board and a printed circuit board includes a signal transmitting part; a ground part that includes an impedance adjusting part and a dummy part; and an insulating layer disposed between the signal transmitting part and the ground part.
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公开(公告)号：US10262949B2
公开(公告)日：2019-04-16
申请号：US15944321
申请日：2018-04-03
发明人： Dae Hyun Park , Han Kim , Kang Heon Hur , Young Gwan Ko , Jung Ho Shim
IPC分类号： H05K7/00 , H01L23/538 , H01L25/10 , H01L21/48 , H01L25/00 , H01L21/683 , H01L23/48 , H01L23/00 , H05K1/02 , H05K1/18 , H01L21/56 , H01L23/31
摘要： The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.
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公开(公告)号：US10157851B2
公开(公告)日：2018-12-18
申请号：US15666266
申请日：2017-08-01
发明人： Hyung Joon Kim , Jung Ho Shim , Dae Hyun Park , Han Kim
IPC分类号： H01L29/40 , H01L23/538 , H01L25/065 , H01L23/00
摘要： The present disclosure relates to a fan-out semiconductor package in which a plurality of semiconductor chips are stacked and packaged, and are disposed in a special form to be thus electrically connected to a redistribution layer of a connection member through vias rather than wires. The fan-out semiconductor package can further include a connection member having a through-hole, and at least one of the semiconductor chips can be disposed in the through-hole.
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