Bi-layer gate cap for self-aligned contact formation
    1.
    发明授权
    Bi-layer gate cap for self-aligned contact formation 有权
    用于自对准接触形成的双层栅极盖

    公开(公告)号:US09064801B1

    公开(公告)日:2015-06-23

    申请号:US14161721

    申请日:2014-01-23

    摘要: A method of forming a semiconductor structure includes forming a metal gate above a semiconductor substrate and gate spacers adjacent to the metal gate surrounded by an interlevel dielectric (ILD) layer. The gate spacers and the metal gate are recessed until a height of the metal gate is less than a height of the gate spacers. An etch stop liner is deposited above the gate spacers and the metal gate. A gate cap is deposited above the etch stop liner to form a bi-layer gate cap. A contact hole is formed in the ILD layer adjacent to the metal gate, the etch stop liner in the bi-layer gate cap prevents damage of the gate spacers during formation of the contact hole. A conductive material is deposited in the contact hole to form a contact to a source-drain region in the semiconductor substrate.

    摘要翻译: 形成半导体结构的方法包括在半导体衬底之上形成金属栅极和邻近由层间电介质(ILD)层围绕的金属栅极的栅极间隔。 栅极间隔物和金属栅极凹入直到金属栅极的高度小于栅极间隔物的高度。 蚀刻停止衬垫沉积在栅极间隔物和金属栅极上方。 栅极盖沉积在蚀刻停止衬垫上方以形成双层栅极盖。 在与金属栅极相邻的ILD层中形成接触孔,双层栅极帽中的蚀刻停止衬垫防止在形成接触孔期间损坏栅极间隔物。 导电材料沉积在接触孔中以与半导体衬底中的源极 - 漏极区形成接触。

    Semiconductor device and method of fabricating the same

    公开(公告)号:US11367776B2

    公开(公告)日:2022-06-21

    申请号:US16836428

    申请日:2020-03-31

    摘要: A semiconductor device includes a source/drain pattern disposed on a substrate and a source/drain contact connected to the source/drain pattern. The source/drain contact includes a lower contact structure extending in a first direction and an upper contact structure protruding from the lower contact structure. The upper contact structure includes a first sidewall and a second sidewall facing away from each other in the first direction. The first sidewall of the upper contact structure includes a plurality of first sub-sidewalls, and each of the first sub-sidewalls includes a concave surface.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210066453A1

    公开(公告)日:2021-03-04

    申请号:US16836428

    申请日:2020-03-31

    摘要: A semiconductor device includes a source/drain pattern disposed on a substrate and a source/drain contact connected to the source/drain pattern. The source/drain contact includes a lower contact structure extending in a first direction and an upper contact structure protruding from the lower contact structure. The upper contact structure includes a first sidewall and a second sidewall facing away from each other in the first direction. The first sidewall of the upper contact structure includes a plurality of first sub-sidewalls, and each of the first sub-sidewalls includes a concave surface.

    STORAGE DEVICE AND AN OPERATING METHOD OF A STORAGE CONTROLLER THEREOF

    公开(公告)号:US20230146540A1

    公开(公告)日:2023-05-11

    申请号:US17967626

    申请日:2022-10-17

    发明人: Jin Wook Lee

    IPC分类号: G06F3/06

    摘要: An operating method of a storage controller includes receiving a permanent write protection command; checking a distribution of first data included in a target namespace corresponding to the permanent write protection command; setting at least one memory region as a protected memory region, based on at least one metric corresponding to each of a plurality of non-volatile memory devices; and migrating at least a portion of the first data, which is stored in a remaining memory region different from the protected memory region, to the protected memory region