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公开(公告)号:US10062430B2
公开(公告)日:2018-08-28
申请号:US15889783
申请日:2018-02-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoon-Joo Eom , Joon-Young Park , Yongcheol Bae , Won Young Lee , Seongjin Jang , Junghwan Choi , Joosun Choi
IPC: G11C5/06 , G11C11/4096 , G11C7/10 , G11C11/4093
CPC classification number: G11C11/4096 , G11C7/1084 , G11C11/4093 , G11C2207/105
Abstract: A multi channel semiconductor device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.
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公开(公告)号:US09742355B2
公开(公告)日:2017-08-22
申请号:US14959195
申请日:2015-12-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoon-Joo Eom , Seung-Jun Bae , Dae-Sik Moon , Joon-Young Park , Min-Su Ahn
IPC: H03F3/45 , H03D7/14 , H03K19/003
CPC classification number: H03D7/1441 , H03F3/45183 , H03F2203/45051 , H03F2203/45466 , H03F2203/45674 , H03F2203/45702 , H03K19/00361
Abstract: A buffer circuit includes a first differential amplifier, second differential amplifier, third differential amplifier, and mixer. The first differential amplifier generates a positive differential signal and a negative differential signal based on an input signal and a reference voltage signal. The second differential amplifier generates a first signal based on the positive differential signal and the negative differential signal. The third differential amplifier generates a second signal having a different phase from the first signal based on the positive differential signal and the negative differential signal. The mixer outputs a signal, generated by mixing the first signal and the second signal, as an output signal.
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公开(公告)号:US11721391B2
公开(公告)日:2023-08-08
申请号:US17875865
申请日:2022-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoon-Joo Eom , Joon-Young Park , Yongcheol Bae , Won Young Lee , Seongjin Jang , Junghwan Choi , Joosun Choi
IPC: G11C11/4093 , G11C11/4096 , G11C7/10
CPC classification number: G11C11/4096 , G11C7/1084 , G11C11/4093 , G11C2207/105
Abstract: An operation method of a semiconductor device is disclosed. The semiconductor device includes separate first and second dies in a package and receives first types of signals through first and second respective channels independent of each other and corresponding to the first and second respective dies. The method includes a step in which when information for controlling internal operations of the first and second dies is first applied to the first die through a first pad, the first die performs the internal operation and also transmits the information to the second die through an internal interface connecting the first die and the second die, and a step in which when the information is transmitted to the second die, the second die performs the internal operation.
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公开(公告)号:US11443794B2
公开(公告)日:2022-09-13
申请号:US16289747
申请日:2019-03-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoon-Joo Eom , Joon-Young Park , Yongcheol Bae , Won Young Lee , Seongjin Jang , Junghwan Choi , Joosun Choi
IPC: G11C11/4093 , G11C11/4096 , G11C7/10
Abstract: An operation method of a semiconductor device is disclosed. The semiconductor device includes separate first and second dies in a package and receives first types of signals through first and second respective channels independent of each other and corresponding to the first and second respective dies. The method includes a step in which when information for controlling internal operations of the first and second dies is first applied to the first die through a first pad, the first die performs the internal operation and also transmits the information to the second die through an internal interface connecting the first die and the second die, and a step in which when the information is transmitted to the second die, the second die performs the internal operation.
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公开(公告)号:US11961564B2
公开(公告)日:2024-04-16
申请号:US17503952
申请日:2021-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chang-Yeon Yu , Kui-Han Ko , Il-Han Park , June-Hong Park , Joo-Yong Park , Joon-Young Park , Bong-Soon Lim
CPC classification number: G11C16/102 , G11C16/0433 , G11C16/08 , G11C16/24 , G11C16/26 , G11C16/0483
Abstract: To program in a nonvolatile memory device including a cell region including first metal pads and a peripheral region including second metal pads and vertically connected to the cell region by the first metal pads and the second metal pads, a memory block is provided with a plurality of sub blocks disposed in a vertical direction where the memory block includes a plurality of cell strings each including a plurality of memory cells connected in series and disposed in the vertical direction. A plurality of intermediate switching transistors are disposed in a boundary portion between two adjacent sub blocks in the vertical direction. Each of the plurality of intermediate switching transistors is selectively activated based on a program address during a program operation. The selectively activating each of the plurality of intermediate switching transistors includes selectively turning on one or more intermediate switching transistors in a selected cell string based on the program address.
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公开(公告)号:US11183249B2
公开(公告)日:2021-11-23
申请号:US16141147
申请日:2018-09-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chang-Yeon Yu , Kui-Han Ko , Il-Han Park , June-Hong Park , Joo-Yong Park , Joon-Young Park , Bong-Soon Lim
IPC: G11C16/16 , G11C16/08 , G11C16/26 , G11C16/04 , G11C16/24 , G11C11/56 , G11C16/10 , H01L27/11556 , H01L27/1157 , H01L27/11582
Abstract: To program in a nonvolatile memory device, a memory block is provided with a plurality of sub blocks disposed in a vertical direction where the memory block includes a plurality of cell strings each including a plurality of memory cells connected in series and disposed in the vertical direction. A plurality of intermediate switching transistors are disposed in a boundary portion between two adjacent sub blocks in the vertical direction. Each of the plurality of intermediate switching transistors is selectively activated based on a program address during a program operation. The selectively activating each of the plurality of intermediate switching transistors includes selectively turning on one or more intermediate switching transistors in a selected cell string based on the program address.
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公开(公告)号:US09899075B2
公开(公告)日:2018-02-20
申请号:US14795191
申请日:2015-07-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoon-Joo Eom , Joon-Young Park , Yongcheol Bae , Won Young Lee , Seongjin Jang , Junghwan Choi , Joosun Choi
IPC: G11C5/06 , G11C11/4096 , G11C11/4093 , G11C7/10
CPC classification number: G11C11/4096 , G11C7/1084 , G11C11/4093 , G11C2207/105
Abstract: A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.
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8.
公开(公告)号:US09355706B2
公开(公告)日:2016-05-31
申请号:US14322129
申请日:2014-07-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Minsu Ahn , Seungjun Bae , Joon-Young Park , Yoon-Joo Eom
IPC: G11C7/10 , G11C11/4076 , G11C7/02 , G11C7/22 , G11C11/4093
CPC classification number: G11C11/4076 , G11C7/02 , G11C7/1066 , G11C7/222 , G11C11/4093
Abstract: An output circuit includes first and second output drivers. The first output driver is configured to transfer a first data signal directly to an output pad in synchronization with a clock signal. The second output driver is configured to transfer a second data signal directly to the output pad in synchronization with an inversion clock signal. The clock signal and the inversion clock enable multiplexing of the first data signal and the second data signal to provide a multiplexed output data signal.
Abstract translation: 输出电路包括第一和第二输出驱动器。 第一输出驱动器被配置为与时钟信号同步地将第一数据信号直接传送到输出焊盘。 第二输出驱动器被配置为与反相时钟信号同步地将第二数据信号直接传送到输出焊盘。 时钟信号和反相时钟使第一数据信号和第二数据信号复用,从而提供多路输出数据信号。
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公开(公告)号:US10255969B2
公开(公告)日:2019-04-09
申请号:US16032837
申请日:2018-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoon-Joo Eom , Joon-Young Park , Yongcheol Bae , Won Young Lee , Seongjin Jang , Junghwan Choi , Joosun Choi
IPC: G11C5/06 , G11C11/4096 , G11C11/4093 , G11C7/10
Abstract: A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.
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