NONVOLATILE MEMORY DEVICE SUPPORTING HIGH-EFFICIENCY I/O INTERFACE

    公开(公告)号:US20240393981A1

    公开(公告)日:2024-11-28

    申请号:US18793984

    申请日:2024-08-05

    Abstract: A nonvolatile memory device includes a first pin that receives a first signal, a second pin that receives a second signal, third pins that receive third signals, a fourth pin that receives a write enable signal, a memory cell array, and a memory interface circuit that obtains a command, an address, and data from the third signals in a first mode and obtains the command and the address from the first signal and the second signal and the data from the third signals in a second mode. In the first mode, the memory interface circuit obtains the command from the third signals and obtains the address from the third signals. In the second mode, the memory interface circuit obtains the command from the first signal and the second signal and obtains the address from the first signal and the second signal.

    NONVOLATILE MEMORY DEVICE SUPPORTING HIGH-EFFICIENCY I/O INTERFACE

    公开(公告)号:US20220011974A1

    公开(公告)日:2022-01-13

    申请号:US17168620

    申请日:2021-02-05

    Abstract: A nonvolatile memory device includes a first pin that receives a first signal, a second pin that receives a second signal, third pins that receive third signals, a fourth pin that receives a write enable signal, a memory cell array, and a memory interface circuit that obtains a command, an address, and data from the third signals in a first mode and obtains the command and the address from the first signal and the second signal and the data from the third signals in a second mode. In the first mode, the memory interface circuit obtains the command from the third signals and obtains the address from the third signals. In the second mode, the memory interface circuit obtains the command from the first signal and the second signal and obtains the address from the first signal and the second signal.

    MEMORY DEVICE SUPPORTING DBI INTERFACE AND OPERATING METHOD OF MEMORY DEVICE

    公开(公告)号:US20220101895A1

    公开(公告)日:2022-03-31

    申请号:US17477931

    申请日:2021-09-17

    Abstract: A memory device includes a memory cell array, a page buffer, a control logic circuit, a plurality of input/output pins, a data bus inversion (DBI) pin, and an interface circuit. The page buffer is connected to the memory cell array. The control logic circuit is configured to control an operation of the memory cell array. The plurality of input/output pins receive a plurality of data signals from the controller. The DBI pin receives a DBI signal from the controller. The interface circuit count a first number of bits having a logic value of 1 and a second number of bits having a logic value of 0 from the data signals and the DBI signal and provide the data signals to the page buffer or the control logic circuit based on the first number and the second number.

    NONVOLATILE MEMORY DEVICE SUPPORTING HIGH-EFFICIENCY I/O INTERFACE

    公开(公告)号:US20220291871A1

    公开(公告)日:2022-09-15

    申请号:US17828176

    申请日:2022-05-31

    Abstract: A nonvolatile memory device includes a first pin that receives a first signal, a second pin that receives a second signal, third pins that receive third signals, a fourth pin that receives a write enable signal, a memory cell array, and a memory interface circuit that obtains a command, an address, and data from the third signals in a first mode and obtains the command and the address from the first signal and the second signal and the data from the third signals in a second mode. In the first mode, the memory interface circuit obtains the command from the third signals and obtains the address from the third signals. In the second mode, the memory interface circuit obtains the command from the first signal and the second signal and obtains the address from the first signal and the second signal.

    STORAGE DEVICE AND RETRAINING METHOD THEREOF

    公开(公告)号:US20210349660A1

    公开(公告)日:2021-11-11

    申请号:US17030635

    申请日:2020-09-24

    Abstract: A storage device includes NVM package and a controller connected to the NVM package through a channel and controlling operation of the NVM package. The NVM package includes an interface chip, first NVM devices connected to the interface chip through a first internal channel and second NVM devices connected to the interface chip through a second internal channel. The interface chip selects the first internal channel in response to an operation request received from the controller and connects the first internal channel to the channel. The interface chip also determines whether retraining is necessary in relation to the second internal channel and transmits a retraining request to the controller when retraining is necessary.

    MULTI-MODE TRANSMISSION LINE AND STORAGE DEVICE INCLUDING THE SAME

    公开(公告)号:US20200220244A1

    公开(公告)日:2020-07-09

    申请号:US16730277

    申请日:2019-12-30

    Abstract: A multi-mode transmission line includes a first and second conductive layers, first and second waveguide walls, a strip line, and a blind conductor. The second conductive layer that is formed over the first conductive layer. The first waveguide wall is elongated in a first direction and is in contact with the first conductive layer and the second conductive layer in a vertical direction. The second waveguide wall is elongated in the first direction parallel to the first waveguide wall and is in contact with the first conductive layer and the second conductive layer in the vertical direction. The strip line is formed between the first and second conductive layers and between the first and second waveguide walls. The blind conductor is connected to one of the first conductive layer, the second conductive layer, the first waveguide wall, or the second waveguide wall.

    SEMICONDUCTOR MEMORY SYSTEM, SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SEMICONDUCTOR MEMORY DEVICE
    10.
    发明申请
    SEMICONDUCTOR MEMORY SYSTEM, SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SEMICONDUCTOR MEMORY DEVICE 有权
    半导体存储器系统,半导体存储器件和操作半导体存储器件的方法

    公开(公告)号:US20170053683A1

    公开(公告)日:2017-02-23

    申请号:US15198564

    申请日:2016-06-30

    Abstract: A semiconductor device of the inventive concept includes a timing circuit configured to receive a first timing signal of a first pulse width from an external device and output a second timing signal having a pulse width which is gradually being reduced from a second pulse width longer than the pulse width of the first timing signal, and a data input/output circuit receiving the second timing signal and outputting data to the external device in synchronization with the second timing signal.

    Abstract translation: 本发明构思的半导体器件包括:定时电路,被配置为从外部设备接收第一脉冲宽度的第一定时信号,并输出第二定时信号,该第二定时信号具有从第二脉冲宽度逐渐减小的脉冲宽度 第一定时信号的脉冲宽度和接收第二定时信号的数据输入/输出电路,并且与第二定时信号同步地将数据输出到外部设备。

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