公开(公告)号：US11592155B2

公开(公告)日：2023-02-28

申请号：US17373038

申请日：2021-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min Kwon ,  Pun-jae Choi ,  Geun-woo Ko ,  Jong-hyun Lee

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/02 ,  F21S41/657 ,  F21S41/141 ,  B60Q1/04

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US09257623B2

公开(公告)日：2016-02-09

申请号：US14574094

申请日：2014-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-jin Kim ,  Min-young Son ,  Yong-min Kwon

IPC: H01L33/38 ,  H01L33/56 ,  H01L33/62 ,  H05B33/08 ,  H04N5/225 ,  H01L33/44 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H04N5/2256 ,  H04N5/2257 ,  H05B33/0845

Abstract: A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween.

Abstract translation: 发光二极管封装包括发光结构，第一电极焊盘和与发光结构连接的第二电极焊盘，与发光结构的底表面接触的绝缘图案层，并与第一 和第二电极焊盘，包括与绝缘图案层的底面接触的通孔的基板，暴露第一电极焊盘的一部分和第二电极焊盘的一部分，第一穿透电极和第二穿透电极， 设置在通孔中，分别与第一和第二电极焊盘连接，设置在发光结构上的荧光材料层，设置在发光结构上并与发光结构间隔开的玻璃，其间具有荧光材料层。

公开(公告)号：US11060689B2

公开(公告)日：2021-07-13

申请号：US16454852

申请日：2019-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min Kwon ,  Pun-jae Choi ,  Geun-woo Ko ,  Jong-hyun Lee

IPC: F21S41/141 ,  H01L33/50 ,  H01L25/075 ,  H01L33/02 ,  B60Q1/04 ,  F21S41/657

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US09691954B2

公开(公告)日：2017-06-27

申请号：US15162754

申请日：2016-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-kuk Lee ,  Si-han Kim ,  Hyung-kun Kim ,  Yong-min Kwon ,  Geun-woo Ko

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/06 ,  H01L33/32 ,  H01L33/18 ,  H01L33/62 ,  H01L33/38 ,  H01L33/56

CPC classification number: H01L33/60 ,  H01L33/007 ,  H01L33/06 ,  H01L33/18 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; an isolating insulation layer; a first connection electrode portion and a second connection electrode portion electrically connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, respectively; a first electrode pad and a second electrode pad electrically connected to the first connection electrode portion and the second connection electrode portion, respectively; a first molding resin layer provided between the first electrode pad and the second electrode pad; a first pillar electrode and a second pillar electrode electrically connected to the first electrode pad and the second electrode pad, respectively; and a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillar electrode and the second pillar electrode.