公开(公告)号：US20120199968A1

公开(公告)日：2012-08-09

申请号：US13348020

申请日：2012-01-11

Applicant: Sang-wook PARK ,  Ho-geon Song ,  Kwang-yong LEE

Inventor： Sang-wook PARK ,  Ho-geon Song ,  Kwang-yong LEE

IPC: H01L23/498 ,  H01L23/48

CPC classification number: H01L25/16 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2225/1011 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A semiconductor package and method of manufacturing thereof are provided. The package includes: a substrate; a first metal wire on a top surface of the substrate; a first semiconductor chip disposed on the substrate; a first insulation layer which covers the first semiconductor chip and at least a part of the substrate; a second metal wire formed on a top surface of the first insulation layer; a first via formed in the first insulation layer, wherein the first via electrically connects the second metal wire and the first metal wire; and a second semiconductor chip disposed on the second metal wire, wherein the second semiconductor chip is electrically connected to the second metal wire.

Abstract translation: 提供半导体封装及其制造方法。 该包装包括：基材; 在所述基板的顶表面上的第一金属线; 设置在所述基板上的第一半导体芯片; 覆盖所述第一半导体芯片和所述基板的至少一部分的第一绝缘层; 形成在所述第一绝缘层的顶表面上的第二金属线; 形成在所述第一绝缘层中的第一通孔，其中所述第一通孔电连接所述第二金属线和所述第一金属线; 以及设置在所述第二金属线上的第二半导体芯片，其中所述第二半导体芯片电连接到所述第二金属线。

公开(公告)号：US20120123873A1

公开(公告)日：2012-05-17

申请号：US13283016

申请日：2011-10-27

Applicant: Kwang-yong LEE ,  Eui-hyeon Hwang ,  Beom-soo Cho

Inventor： Kwang-yong LEE ,  Eui-hyeon Hwang ,  Beom-soo Cho

IPC: G06Q30/02 ,  G06Q30/04 ,  G06F15/16

CPC classification number: G06Q30/0273 ,  G06Q10/107 ,  G06Q30/0241 ,  H04L51/063 ,  H04L51/38

Abstract: A method for providing a data service and a system for providing a data service applying the same are provided. The method includes selecting a content that is assigned a data assignment quantity indicating a quantity sufficient for using a service; comparing a data generation quantity indicating a quantity of data generated by a user and the data assignment quantity; and performing the service for the data generated by the user according to a result of the comparison.

Abstract translation: 提供了一种用于提供数据服务的方法和用于提供应用其的数据服务的系统。 该方法包括：选择分配了指示足以使用服务的数量的数据分配量的内容; 比较指示由用户生成的数据量的数据生成量和数据分配量; 并根据比较结果对用户生成的数据执行服务。

公开(公告)号：US20110087816A1

公开(公告)日：2011-04-14

申请号：US12860129

申请日：2010-08-20

Applicant: Bum-hee SEO ,  Cheon-moo LEE ,  Kwang-yong LEE ,  Sang-jin LEE

Inventor： Bum-hee SEO ,  Cheon-moo LEE ,  Kwang-yong LEE ,  Sang-jin LEE

IPC: G06F13/24 ,  G06F15/00

CPC classification number: G06F1/3228 ,  G06F1/3203

Abstract: A computer system and a control method thereof, the computer system including: a processor which executes a program; a communication unit which communicates with an external device; a main body which is provided with the processor. A cover which can be opened and shut with regard to the main body; an open/shut sensor which senses whether the cover is open or shut; and a controller which interrupts an operation of the communication unit if the open/shut sensor senses that the cover is shut.

Abstract translation: 一种计算机系统及其控制方法，所述计算机系统包括：执行程序的处理器; 与外部设备通信的通信单元; 设有处理器的主体。 可以关于主体打开和关闭的盖子; 一个开/关传感器，用于检测盖子是否打开或关闭; 以及如果所述打开/关闭传感器感测到所述盖被关闭则中断所述通信单元的操作的控制器。

公开(公告)号：US20100144137A1

公开(公告)日：2010-06-10

申请号：US12579483

申请日：2009-10-15

Applicant: Kwang-yong LEE ,  Jong-gi Lee ,  Min-ill Kim ,  Min-seung Yoon ,  Ji-seok Hong

Inventor： Kwang-yong LEE ,  Jong-gi Lee ,  Min-ill Kim ,  Min-seung Yoon ,  Ji-seok Hong

IPC: H01L21/768

CPC classification number: H01L21/76898 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/24145 ,  H01L2224/81097 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method of interconnecting semiconductor devices by using capillary motion, thereby simplifying fabricating operations, reducing fabricating costs, and simultaneously filling of through-silicon-vias (TSVs) and interconnecting semiconductor devices. The method includes preparing a first semiconductor device in which first TSVs are formed, positioning solder balls respectively on the first TSVs, performing a back-lap operation on the first semiconductor device, positioning a second semiconductor device, in which second TSVs are formed, above the first semiconductor device on which the solder balls are positioned, and performing a reflow operation such that the solder balls fill the first and second TSVs due to capillary motion.

Abstract translation: 通过使用毛细管运动来互连半导体器件的方法，从而简化了制造操作，降低了制造成本，同时填充了通过硅通孔（TSV）和互连半导体器件。 该方法包括制备其中形成第一TSV的第一半导体器件，分别将焊球定位在第一TSV上，在第一半导体器件上执行回搭操作，将形成有第二TSV的第二半导体器件定位在其中，形成第二TSV 焊球位于其上的第一半导体器件，并且执行回流操作，使得焊球由于毛细管运动而填充第一和第二TSV。