公开(公告)号：US20130061090A1

公开(公告)日：2013-03-07

申请号：US13603848

申请日：2012-09-05

申请人： Kwang Yong LEE

发明人： Kwang Yong LEE

IPC分类号： G06F11/14

CPC分类号： G06F11/1417

摘要： A partial rebooting recovery apparatus is provided. The partial rebooting recovery apparatus may store a system state of a predetermined booting point in time, may receive a failure signal of a system, may call a failure recovery processing function, may recover the system to the system state of the predetermined booting point in time, based on the failure signal, and may reboot the system from a point in time at which the system is recovered.

摘要翻译： 提供部分重启装置。 部分再启动恢复装置可以及时存储预定引导点的系统状态，可以接收系统的故障信号，可以调用故障恢复处理功能，可以将系统恢复到预定启动点的系统状态 基于故障信号，并且可以从系统恢复的时间点重启系统。

公开(公告)号：US08324522B2

公开(公告)日：2012-12-04

申请号：US12591821

申请日：2009-12-02

申请人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

发明人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

IPC分类号： B23K3/00 ,  B23K26/00

CPC分类号： B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

摘要翻译： 提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。 回流装置可以包括线圈，支撑构件和移动构件。 线圈可以从电源接收电流，以使用感应加热方法加热焊球。 支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。 移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

公开(公告)号：US20120123873A1

公开(公告)日：2012-05-17

申请号：US13283016

申请日：2011-10-27

申请人： Kwang-yong LEE ,  Eui-hyeon Hwang ,  Beom-soo Cho

发明人： Kwang-yong LEE ,  Eui-hyeon Hwang ,  Beom-soo Cho

IPC分类号： G06Q30/02 ,  G06Q30/04 ,  G06F15/16

CPC分类号： G06Q30/0273 ,  G06Q10/107 ,  G06Q30/0241 ,  H04L51/063 ,  H04L51/38

摘要： A method for providing a data service and a system for providing a data service applying the same are provided. The method includes selecting a content that is assigned a data assignment quantity indicating a quantity sufficient for using a service; comparing a data generation quantity indicating a quantity of data generated by a user and the data assignment quantity; and performing the service for the data generated by the user according to a result of the comparison.

摘要翻译： 提供了一种用于提供数据服务的方法和用于提供应用其的数据服务的系统。 该方法包括：选择分配了指示足以使用服务的数量的数据分配量的内容; 比较指示由用户生成的数据量的数据生成量和数据分配量; 并根据比较结果对用户生成的数据执行服务。

公开(公告)号：US20110138224A1

公开(公告)日：2011-06-09

申请号：US12787086

申请日：2010-05-25

申请人： Kwang Yong LEE ,  Su-min PARK

发明人： Kwang Yong LEE ,  Su-min PARK

IPC分类号： G06F11/14

CPC分类号： G06F11/079

摘要： A system for tracepoint-based fault diagnosis and recovery includes: a system state tracing model unit for storing state tracing models which are obtained by a modeling technique and are required for fault diagnosis and recovery; a state diagnosis unit for determining whether or not an action event is executable with reference to the state tracing models when the action event is received from a specific tracepoint among multiple tracepoints which exist in each of components within an operating system of the system, and generating a fault recovery command when it is determined that the action is not executable, that is, a fault has occurred; and a fault recovery unit for performing a fault recovery processing based on the state tracing models in response to the generated fault recovery command.

摘要翻译： 用于基于跟踪点的故障诊断和恢复系统包括：用于存储通过建模技术获得并且是故障诊断和恢复所需的状态跟踪模型的系统状态跟踪模型单元; 状态诊断单元，用于当从所述系统的操作系统中的每个组件中存在的多个跟踪点中的特定跟踪点接收到所述动作事件时，参考所述状态跟踪模型来确定动作事件是否可执行，并且生成 确定动作不可执行的故障恢复命令，即已发生故障; 以及故障恢复单元，用于响应于所生成的故障恢复命令，基于状态跟踪模型执行故障恢复处理。

公开(公告)号：US07880490B2

公开(公告)日：2011-02-01

申请号：US12200716

申请日：2008-08-28

申请人： Sang-Hoon Lee ,  Kwang-Yong Lee ,  Se-Jang Oh ,  Young-Soo An

发明人： Sang-Hoon Lee ,  Kwang-Yong Lee ,  Se-Jang Oh ,  Young-Soo An

IPC分类号： G01R31/28

CPC分类号： G01R31/2889 ,  G01R31/3025

摘要： A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

摘要翻译： 无线接口探针卡包括基板部件和传输部件。 基板构件具有以恒定间距排列的多个探针端子。 探针端子可以直接接触布置在晶片上的多个半导体芯片中的每一个上以恒定间距布置的多个焊盘，以对布置在晶片上的半导体芯片进行测试。 传输构件布置在基板构件上，无线地接收测试信号，并通过探针端子将接收到的测试信号提供给晶片的焊盘，并且通过以下方式无线地和外部地传输从晶片的焊盘提供的电特性信号 探头端子。

公开(公告)号：US20100181293A1

公开(公告)日：2010-07-22

申请号：US12591821

申请日：2009-12-02

申请人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

发明人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

IPC分类号： B23K1/00

CPC分类号： B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

摘要翻译： 提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。 回流装置可以包括线圈，支撑构件和移动构件。 线圈可以从电源接收电流，以使用感应加热方法加热焊球。 支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。 移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

公开(公告)号：US20100117213A1

公开(公告)日：2010-05-13

申请号：US12615507

申请日：2009-11-10

申请人： Minill KIM ,  Kwang Yong LEE ,  Jonggi LEE ,  Ji-Seok HONG ,  Hyun Jeong WOO

发明人： Minill KIM ,  Kwang Yong LEE ,  Jonggi LEE ,  Ji-Seok HONG ,  Hyun Jeong WOO

IPC分类号： H01L23/488 ,  H05B6/36

CPC分类号： H05B6/36 ,  B23K1/0016 ,  B23K1/002 ,  B23K2101/40 ,  H01L24/81 ,  H01L2224/81222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/101

摘要： An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.

摘要翻译： 封装半导体芯片的装置包括配置为使用感应加热来回流半导体芯片的焊球的线圈。 线圈包括第一主体，平行于第一主体的第二主体，从第一主体延伸到第二主体的第三主体。 第一和第二主体相对于设置在它们之间的垂直平面是对称的。 第一和第二主体具有彼此面对的倾斜表面，并且倾斜表面彼此向下延伸。

公开(公告)号：US20100038778A1

公开(公告)日：2010-02-18

申请号：US12402123

申请日：2009-03-11

申请人： Kwang-Yong Lee ,  Sun-Won Kang ,  Sang-Hee Kim

发明人： Kwang-Yong Lee ,  Sun-Won Kang ,  Sang-Hee Kim

IPC分类号： H01L23/50 ,  H01L21/441

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/05552 ,  H01L2924/00014

摘要： A void that is created in a conductive electrode in a through hole that extends through an integrated circuit substrate can be used as a joining interface. For example, an integrated circuit structure includes an integrated circuit substrate having a conductive pad on a first face thereof, and a through hole that extends through the integrated circuit substrate from a second face of the integrated circuit substrate that is opposite to the first face and through the pad. A conductive electrode is provided in the through hole that extends from the second face to the first face through and onto the pad. The conductive electrode includes a void therein adjacent the second face. The void includes a void opening adjacent the second face that defines inner walls of the conductive electrode. A conductive material is provided in the void that directly contacts the inner walls of the conductive electrode. Related fabrication methods are also disclosed.

摘要翻译： 在贯通集成电路基板的通孔中的导电电极中产生的空隙可以用作接合界面。 例如，集成电路结构包括在其第一面上具有导电焊盘的集成电路基板和从集成电路基板的与第一面相反的第二面延伸穿过集成电路基板的通孔，以及 通过垫。 导电电极设置在通孔中，该通孔从第二面向第一面延伸并穿过衬垫。 导电电极包括与第二面相邻的空隙。 空隙包括邻近导电电极的内壁的邻近第二面的空隙。 导电材料设置在直接接触导电电极的内壁的空隙中。 还公开了相关的制造方法。

公开(公告)号：US20090066350A1

公开(公告)日：2009-03-12

申请号：US12200716

申请日：2008-08-28

申请人： Sang-Hoon LEE ,  Kwang-Yong LEE ,  Se-Jang OH ,  Young-Soo AN

发明人： Sang-Hoon LEE ,  Kwang-Yong LEE ,  Se-Jang OH ,  Young-Soo AN

IPC分类号： G01R1/073

CPC分类号： G01R31/2889 ,  G01R31/3025

摘要： A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

摘要翻译： 无线接口探针卡包括基板部件和传输部件。 基板构件具有以恒定间距排列的多个探针端子。 探针端子可以直接接触布置在晶片上的多个半导体芯片中的每一个上以恒定间距布置的多个焊盘，以对布置在晶片上的半导体芯片进行测试。 传输构件布置在基板构件上，无线地接收测试信号，并通过探针端子将接收到的测试信号提供给晶片的焊盘，并且通过以下方式无线地和外部地传输从晶片的焊盘提供的电特性信号 探头端子。

公开(公告)号：US20090044139A1

公开(公告)日：2009-02-12

申请号：US12188555

申请日：2008-08-08

申请人： Keun-Ho Shin ,  Kwang-Yong Lee

发明人： Keun-Ho Shin ,  Kwang-Yong Lee

IPC分类号： G06F3/048

CPC分类号： G06F3/0488

摘要： An apparatus and a method for providing a character deletion function is provided. A plurality of deletion items having respective designated deletion schemes are displayed, when there is a request for a deletion mode while inputting characters. It is determined if a Drag event occurs after a Press event occurs in an area where one of the plurality of deletion items is displayed. It is determined if a Release event occurs when the Drag event occurs. A deletion function in a deletion scheme corresponding to a deletion item having an area where the Release event occurs is performed when the Release event occurs. Accordingly, a user has convenience with which, when inputting characters, the user receives various deletion schemes and can perform a desired deletion function in a simple way.

摘要翻译： 提供了一种用于提供字符删除功能的装置和方法。 当在输入字符时存在删除模式的请求时，显示具有各自指定的删除方案的多个删除项目。 在显示多个删除项之一的区域中发生Press事件之后，确定是否发生拖动事件。 当发生Drag事件时，确定是否发生Release事件。 当释放事件发生时，执行与具有发生释放事件的区域的删除项相对应的删除方案中的删除功能。 因此，用户具有便利性，当输入字符时，用户接收各种删除方案，并且可以以简单的方式执行所需的删除功能。