Multilayer wiring substrate
    7.
    发明授权
    Multilayer wiring substrate 有权
    多层布线基板

    公开(公告)号:US08658905B2

    公开(公告)日:2014-02-25

    申请号:US13070094

    申请日:2011-03-23

    IPC分类号: H05K1/03

    摘要: In a wiring laminate portion of a multilayer wiring substrate, a solder resist layer having a plurality of openings is disposed on a main surface side of the laminate structure, and connection terminals are embedded in an outermost resin insulation layer in contact with the solder resist layer. Each of the connection terminals comprises a copper layer and a metallic layer formed of at least one type of metal other than copper. A main-surface-side circumferential portion of the copper layer is covered by the solder resist layer. At least a portion of the metallic layer is located in a recess in a main-surface-side central portion of the copper layer. At least a portion of the metallic layer is exposed via a corresponding opening.

    摘要翻译: 在多层布线基板的布线层叠部分中,具有多个开口的阻焊层设置在层叠结构的主表面侧,并且连接端子嵌入在与阻焊层接触的最外层树脂绝缘层中 。 每个连接端子包括铜层和由铜以外的至少一种类型的金属形成的金属层。 铜层的主表面侧圆周部分被阻焊层覆盖。 金属层的至少一部分位于铜层的主表面侧中央部的凹部中。 金属层的至少一部分经由相应的开口露出。

    Multilayer wiring substrate
    8.
    发明授权
    Multilayer wiring substrate 失效
    多层布线基板

    公开(公告)号:US08530751B2

    公开(公告)日:2013-09-10

    申请号:US13195290

    申请日:2011-08-01

    IPC分类号: H05K1/00

    摘要: A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion coefficient as compared with first-type resin insulation layers. On a cross section of the laminate structure taken along a thickness direction thereof, the ratio of a total thickness of the second-type resin insulation layers located in an area A2 to a thickness corresponding to the area A2 is greater than the ratio of a total thickness of the second-type resin insulation layers located in an area A1 to a thickness corresponding to the area A1. The laminate structure is warped such that the laminate structure is convex toward the side where the second main face is present.

    摘要翻译: 多层布线基板包括层叠结构,其中树脂绝缘层和导体层交替层叠。 树脂绝缘层包括第一类树脂绝缘层和第二类树脂绝缘层,其中第二类树脂绝缘层与第一类型树脂绝缘层相比,其中含有大量的无机材料并且热膨胀系数较小。 在沿其厚度方向截取的层叠结构的横截面上,位于A2区域中的第二类树脂绝缘层的总厚度与对应于区域A2的厚度的比率大于总共 位于区域A1中的第二类型树脂绝缘层的厚度为对应于区域A1的厚度。 层压结构翘曲,使得层压结构向第二主面存在的一侧凸出。

    TITANIUM ALLOY TURBINE BLADE
    10.
    发明申请
    TITANIUM ALLOY TURBINE BLADE 审中-公开
    钛合金涡轮叶片

    公开(公告)号:US20120183410A1

    公开(公告)日:2012-07-19

    申请号:US13337636

    申请日:2011-12-27

    IPC分类号: F04D29/38

    摘要: It is an objective of the present invention to provide an effective use of the friction stir processing (FSP) technology for Ti-alloy turbine blades with a long radial length, and provide a Ti-alloy turbine blade having both high erosion resistance and high long term reliability. There is provided a turbine blade made of an α-β titanium alloy having an average Vickers hardness of 320 Hv or less, the turbine blade having a leading edge, in which: the turbine blade includes, at the leading edge thereof, a first hardened surface region having a thickness of from 0.5 to 3.0 mm and having an average Vickers hardness of 340 Hv or more; and the first hardened surface region is formed by friction stir processing a surface region of the leading edge of the turbine blade.

    摘要翻译: 本发明的一个目的是为了有效利用具有长径向长度的钛合金涡轮叶片的摩擦搅拌处理(FSP)技术,并且提供具有高抗侵蚀性和高长度的Ti合金涡轮叶片 长期可靠性。 提供由α-&bgr制成的涡轮叶片; 具有320Hv或更小的维氏硬度的钛合金,所述涡轮叶片具有前缘,其中:所述涡轮叶片在其前缘处包括厚度为0.5至3.0mm的第一硬化表面区域和 平均维氏硬度为340Hv或更高; 并且通过摩擦搅拌处理涡轮叶片的前缘的表面区域来形成第一硬化表面区域。