Thin-film inspection apparatus and method therefor
    1.
    发明授权
    Thin-film inspection apparatus and method therefor 失效
    薄膜检查装置及其方法

    公开(公告)号:US08482744B2

    公开(公告)日:2013-07-09

    申请号:US13120295

    申请日:2009-07-02

    IPC分类号: G01B11/28

    CPC分类号: G01B11/0625

    摘要: A thin-film inspection apparatus calculates a film thickness of a first transparent thin film and a second transparent thin film of an inspection-target substrate including the first and second transparent thin films and a transparent conductive film on a transparent glass substrate. The apparatus has a storage section storing at least two feature-value characteristics in which at least two feature values selected from feature values in a spectral reflectance spectrum; a light irradiation section irradiating the inspection-target substrate with white light through the transparent glass substrate; a light receiving section receiving light reflected from the inspection-target substrate; and an arithmetic section obtaining measurement values of the feature values stored in the storage section from the spectral reflectance spectrum based on the reflected light received by the light receiving section, and calculating the film thickness of each of the first transparent thin film and the second transparent thin film.

    摘要翻译: 薄膜检查装置在透明玻璃基板上计算包括第一透明薄膜和第二透明薄膜的透明导电薄膜的检查对象基板的第一透明薄膜和第二透明薄膜的膜厚。 该装置具有存储至少两个特征值特性的存储部分,其中从光谱反射光谱中的特征值中选择的至少两个特征值; 光照射部,通过透明玻璃基板照射检查对象基板的白色光; 接收从检查对象基板反射的光的受光部; 以及算术部,基于由所述受光部所接收的反射光,从所述光谱反射率光谱求出存储在所述存储部中的特征量的测量值,并且计算所述第一透明薄膜和所述第二透明薄膜 薄膜。

    THIN-FILM INSPECTION APPARATUS AND METHOD THEREFOR
    2.
    发明申请
    THIN-FILM INSPECTION APPARATUS AND METHOD THEREFOR 失效
    薄膜检查装置及其方法

    公开(公告)号:US20110205556A1

    公开(公告)日:2011-08-25

    申请号:US13120295

    申请日:2009-07-02

    IPC分类号: G01B11/06

    CPC分类号: G01B11/0625

    摘要: A thin-film inspection apparatus includes a storage section (14) that stores at least two feature-value characteristics in which at least two feature values selected from feature values in a spectral reflectance spectrum that are affected by a variation in the film thickness of at least one of a first transparent thin film and a second transparent thin film are each associated with the film thickness of the first transparent thin film and the film thickness of the second transparent thin film; a light irradiation section (11) that irradiates an inspection-target substrate (S) with white light through a transparent glass substrate; a light receiving section (12) that receives reflected light reflected from the inspection-target substrate (S); and an arithmetic section (15) that obtains measurement values of the feature values stored in the storage section (14) from a spectral reflectance spectrum generated based on the received reflected light and that calculates the film thickness of each of the first transparent thin film and the second transparent thin film by using the obtained measurement values of the feature values and the feature-value characteristics stored in the storage section (14).

    摘要翻译: 薄膜检查装置包括存储部分(14),其存储至少两个特征值特性,其中从光谱反射光谱中的特征值中选择的至少两个特征值受到在 第一透明薄膜和第二透明薄膜中的至少一个分别与第一透明薄膜的膜厚度和第二透明薄膜的膜厚相关联; 通过透明玻璃基板将白色光照射到检查对象基板(S)的光照射部(11) 接收从所述检查对象基板(S)反射的反射光的受光部(12)。 以及算术部(15),其从基于所接收的反射光生成的光谱反射光谱获得存储在所述存储部(14)中的特征量的测量值,并且计算所述第一透明薄膜和 通过使用获得的存储在存储部分(14)中的特征值和特征值特性的测量值来确定第二透明薄膜。

    Resistivity testing method and device therefor
    3.
    发明授权
    Resistivity testing method and device therefor 有权
    电阻率测试方法及其设备

    公开(公告)号:US07956999B2

    公开(公告)日:2011-06-07

    申请号:US12934717

    申请日:2009-07-02

    IPC分类号: G01J4/00 G01B11/28

    摘要: An object is to efficiently measure the resistivity of a transparent conductive film with high accuracy in a non-destructive and non-contact manner. Provided is a resistivity testing device that includes a light emitting device that emits p-polarized emission light having a wavelength selected by a preliminarily performed test-condition selecting method toward a transparent conductive film, formed on a light-transmissive substrate conveyed along a manufacturing line, from a film-surface side at an incidence angle selected by the method; a light detecting device that detects reflected light reflected at the transparent conductive film; and an information processor that calculates an evaluation value related to the amount of light of the reflected light with respect to the wavelength on the basis of the intensity of the detected light and obtains a resistivity from the calculated evaluation value by using a correlation characteristic in which the evaluation value and the resistivity are associated with each other in advance.

    摘要翻译: 目的是以非破坏性和非接触的方式高精度地有效地测量透明导电膜的电阻率。 提供了一种电阻率测试装置,其包括:发光装置,其将具有通过预先进行的测试条件选择方法选择的波长的p偏振发射光朝向透明导电膜形成,所述透明导电膜形成在沿着制造线传送的透光基板 从膜表面侧以该方法选择的入射角; 检测在透明导电膜上反射的反射光的光检测装置; 以及信息处理器,其基于所检测的光的强度来计算与所述反射光的相对于所述波长的光量相关的评价值,并且通过使用相关特性从所计算的评估值获得电阻率,其中, 评估值和电阻率预先相互关联。

    RESISTIVITY TESTING METHOD AND DEVICE THEREFOR
    4.
    发明申请
    RESISTIVITY TESTING METHOD AND DEVICE THEREFOR 有权
    电阻测试方法及其设备

    公开(公告)号:US20110019190A1

    公开(公告)日:2011-01-27

    申请号:US12934717

    申请日:2009-07-02

    摘要: An object is to efficiently measure the resistivity of a transparent conductive film with high accuracy in a non-destructive and non-contact manner. Provided is a resistivity testing device that includes a light emitting device that emits p-polarized emission light having a wavelength selected by a preliminarily performed test-condition selecting method toward a transparent conductive film, formed on a light-transmissive substrate conveyed along a manufacturing line, from a film-surface side at an incidence angle selected by the method; a light detecting device that detects reflected light reflected at the transparent conductive film; and an information processor that calculates an evaluation value related to the amount of light of the reflected light with respect to the wavelength on the basis of the intensity of the detected light and obtains a resistivity from the calculated evaluation value by using a correlation characteristic in which the evaluation value and the resistivity are associated with each other in advance.

    摘要翻译: 目的是以非破坏性和非接触的方式高精度地有效地测量透明导电膜的电阻率。 提供了一种电阻率测试装置,其包括:发光装置,其将具有通过预先进行的测试条件选择方法选择的波长的p偏振发射光朝向透明导电膜形成,所述透明导电膜形成在沿着制造线传送的透光基板 从膜表面侧以该方法选择的入射角; 检测在透明导电膜上反射的反射光的光检测装置; 以及信息处理器,其基于所检测的光的强度来计算与所述反射光的相对于所述波长的光量相关的评价值,并且通过使用相关特性从所计算的评估值获得电阻率,其中, 评估值和电阻率预先相互关联。

    Thin-film inspection apparatus and inspection method
    5.
    发明授权
    Thin-film inspection apparatus and inspection method 失效
    薄膜检验仪器及检验方法

    公开(公告)号:US08497991B2

    公开(公告)日:2013-07-30

    申请号:US13120319

    申请日:2009-07-02

    IPC分类号: G01N21/47 G01N21/00

    摘要: An object is to reduce the effect of a film thickness variation on the substrate surface of a thin film and improve the measuring accuracy. Provided are a light source that radiates single-wavelength light to an inspection-target substrate (W), which is formed by forming a thin film on a glass substrate from the glass substrate side; a light receiving element that is disposed such that the light receiving axis intersects with the optical axis of illumination light emitted from the light source at a predetermined inclination angle and that receives diffused transmitted light that has been transmitted through the inspection-target substrate W; and a computer (7) that obtains a haze ratio of the thin film on the basis of the intensity of the light received by the light receiving element. The computer (7) has a haze ratio characteristic made by associating the haze ratio and the light intensity of the diffused transmitted light and obtains a haze ratio by using the haze ratio characteristic and the light intensity received by the light receiving element.

    摘要翻译: 目的是减少薄膜的薄膜厚度变化对薄膜的基板表面的影响,提高测量精度。 提供了通过从玻璃基板侧在玻璃基板上形成薄膜而将单波长光照射到检查对象基板(W)的光源, 光接收元件被设置为使得光接收轴线以与预定倾斜角度从光源发射的照明光的光轴相交并且接收已经透射通过检查对象基板W的扩散透射光; 以及基于由光接收元件接收的光的强度来获得薄膜的雾度比的计算机(7)。 计算机(7)具有通过使雾化率和扩散透射光的光强度相关联而获得的雾度比特性,并且通过使用由光接收元件接收的雾度比特性和光强度来获得雾度比。

    THIN-FILM INSPECTION APPARATUS AND INSPECTION METHOD
    6.
    发明申请
    THIN-FILM INSPECTION APPARATUS AND INSPECTION METHOD 失效
    薄膜检查装置和检查方法

    公开(公告)号:US20110194113A1

    公开(公告)日:2011-08-11

    申请号:US13120319

    申请日:2009-07-02

    IPC分类号: G01N21/47

    摘要: An object is to reduce the effect of a film thickness variation on the substrate surface of a thin film and improve the measuring accuracy. Provided are a light source that radiates single-wavelength light to an inspection-target substrate (W), which is formed by forming a thin film on a glass substrate from the glass substrate side; a light receiving element that is disposed such that the light receiving axis intersects with the optical axis of illumination light emitted from the light source at a predetermined inclination angle and that receives diffused transmitted light that has been transmitted through the inspection-target substrate W; and a computer (7) that obtains a haze ratio of the thin film on the basis of the intensity of the light received by the light receiving element. The computer (7) has a haze ratio characteristic made by associating the haze ratio and the light intensity of the diffused transmitted light and obtains a haze ratio by using the haze ratio characteristic and the light intensity received by the light receiving element.

    摘要翻译: 目的是减少薄膜的薄膜厚度变化对薄膜的基板表面的影响,提高测量精度。 提供了通过从玻璃基板侧在玻璃基板上形成薄膜而将单波长光照射到检查对象基板(W)的光源, 光接收元件被设置为使得光接收轴线以与预定倾斜角度从光源发射的照明光的光轴相交并且接收已经透射通过检查对象基板W的扩散透射光; 以及基于由光接收元件接收的光的强度来获得薄膜的雾度比的计算机(7)。 计算机(7)具有通过使雾化率和扩散透射光的光强度相关联而获得的雾度比特性,并且通过使用由光接收元件接收的雾度比特性和光强度来获得雾度比。

    High-frequency power supply structure and plasma CVD device using the same
    8.
    发明授权
    High-frequency power supply structure and plasma CVD device using the same 失效
    高频电源结构和等离子体CVD装置使用相同

    公开(公告)号:US07319295B2

    公开(公告)日:2008-01-15

    申请号:US10506544

    申请日:2003-03-13

    IPC分类号: H01J7/24

    CPC分类号: H01J37/32577 H01J37/32082

    摘要: A radio frequency power supply structure and a plasma CVD device comprising the same are provided in which reflection of radio frequency power at a connecting portion where an RF cable connects to an electrode is reduced so that incidence of the radio frequency power into the electrode increases. In the radio frequency power supply structure for use in a device generating plasma by charging a plate-like electrode with a radio frequency power, the radio frequency power supply structure supplying the electrode with the radio frequency power from an RF cable, the RF cable is positioned on an extended plane of a plane formed by the electrode to connect to the electrode at a connecting portion provided on an end peripheral portion of the electrode. The RF cable connects to the electrode substantially in the same plane as the plane formed by the electrode. Voltage acting after the connecting portion becomes symmetric relative to the plane formed by the electrode and the electric line of force also becomes symmetric. Thereby, change of impedance at the connecting portion is reduced, reflection of the radio frequency power at the connecting portion is reduced, incidence of the radio frequency power into the electrode increases and the efficiency of film forming and surface treatment is enhanced.

    摘要翻译: 提供射频电源结构和包括该射频电源结构的等离子体CVD装置,其中RF电缆连接到电极的连接部分处的射频功率的反射减小,使得射频功率进入电极的入射增加。 在通过对具有射频功率的板状电极进行充电来生成等离子体的装置的射频电源结构中,射频电源结构从RF电缆向射频电源供给射频电力,RF电缆为 位于由电极形成的平面的延伸平面上,以在设置在电极的端部周边部分上的连接部分处连接到电极。 RF电缆基本上在与电极形成的平面相同的平面中连接到电极。 在连接部分之后作用的电压相对于由电极和电力线形成的平面对称也变为对称。 由此,连接部的阻抗变化减小,连接部处的射频功率的反射减小,电极的射频功率的增加,成膜和表面处理的效率提高。

    High-frequency power supply structure and plasma cvd device using the same
    9.
    发明申请
    High-frequency power supply structure and plasma cvd device using the same 失效
    高频电源结构和等离子cvd设备使用相同

    公开(公告)号:US20050127844A1

    公开(公告)日:2005-06-16

    申请号:US10506544

    申请日:2003-03-13

    CPC分类号: H01J37/32577 H01J37/32082

    摘要: A radio frequency power supply structure and a plasma CVD device comprising the same are provided in which reflection of radio frequency power at a connecting portion where an RF cable connects to an electrode is reduced so that incidence of the radio frequency power into the electrode increases. In the radio frequency power supply structure for use in a device generating plasma by charging a plate-like electrode with a radio frequency power, the radio frequency power supply structure supplying the electrode with the radio frequency power from an RF cable, the RF cable is positioned on an extended plane of a plane formed by the electrode to connect to the electrode at a connecting portion provided on an end peripheral portion of the electrode. The RF cable connects to the electrode substantially in the same plane as the plane formed by the electrode. Voltage acting after the connecting portion becomes symmetric relative to the plane formed by the electrode and the electric line of force also becomes symmetric. Thereby, change of impedance at the connecting portion is reduced, reflection of the radio frequency power at the connecting portion is reduced, incidence of the radio frequency power into the electrode increases and the efficiency of film forming and surface treatment is enhanced.

    摘要翻译: 提供射频电源结构和包括该射频电源结构的等离子体CVD装置,其中RF电缆连接到电极的连接部分处的射频功率的反射减小,使得射频功率进入电极的入射增加。 在通过对具有射频功率的板状电极进行充电来生成等离子体的装置的射频电源结构中,射频电源结构从RF电缆向射频电源供给射频电力,RF电缆为 位于由电极形成的平面的延伸平面上,以在设置在电极的端部周边部分上的连接部分处连接到电极。 RF电缆基本上在与电极形成的平面相同的平面中连接到电极。 在连接部分之后作用的电压相对于由电极和电力线形成的平面对称也变为对称。 由此,连接部的阻抗变化减小,连接部处的射频功率的反射减小,电极的射频功率的增加,成膜和表面处理的效率提高。

    Process for producing photovoltaic device
    10.
    发明授权
    Process for producing photovoltaic device 失效
    光电器件生产工艺

    公开(公告)号:US08088641B2

    公开(公告)日:2012-01-03

    申请号:US12993252

    申请日:2008-10-30

    摘要: A process for producing a photovoltaic device, wherein when providing an n-type amorphous silicon layer on an i-type amorphous silicon layer, a desired crystallization ratio can be achieved without reducing the deposition rate. The production process comprises a p-layer formation step of depositing a p-type amorphous silicon layer, an i-layer formation step of depositing an i-type amorphous silicon layer on the p-type amorphous silicon layer, and an n-layer formation step of depositing an n-type amorphous silicon layer on the i-type amorphous silicon layer, wherein the n-layer formation step comprises a first n-layer formation step of depositing a first n-layer on the i-type amorphous silicon layer, and a second n-layer formation step of depositing a second n-layer on the first n-layer, and the deposition conditions for the first n-layer formation step are conditions that yield a higher crystallization ratio than the deposition conditions for the second n-layer formation step, for deposition onto the same base material substrate.

    摘要翻译: 一种制造光电器件的方法,其中当在i型非晶硅层上提供n型非晶硅层时,可以在不降低沉积速率的情况下实现期望的结晶比。 该制造方法包括沉积p型非晶硅层的p层形成步骤,在p型非晶硅层上沉积i型非晶硅层的i层形成步骤和n层形成 在i型非晶硅层上沉积n型非晶硅层的步骤,其中n层形成步骤包括在i型非晶硅层上沉积第一n层的第一n层形成步骤, 以及在第一n层上沉积第二n层的第二n层形成步骤,并且用于第一n层形成步骤的沉积条件是产生比第二n层的沉积条件更高的结晶比的条件 层形成步骤,用于沉积到相同的基底材料基底上。