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公开(公告)号:US07482201B2
公开(公告)日:2009-01-27
申请号:US11972904
申请日:2008-01-11
申请人: Scott B. Charles , Kathleen M. Gross , Steven C. Hackett , Michael A. Kropp , William J. Schultz , Wendy L. Thompson
发明人: Scott B. Charles , Kathleen M. Gross , Steven C. Hackett , Michael A. Kropp , William J. Schultz , Wendy L. Thompson
CPC分类号: H01L23/295 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16 , H01L2224/2929 , H01L2224/29386 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H05K3/305 , H01L2924/00 , H01L2924/0665 , H01L2924/05442
摘要: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.
摘要翻译: 本发明提供了制造所述制品的电子制品和方法。 电子制品包括使用包含热固性树脂,固化催化剂和基本上球形,非聚集,无定形和固体的表面处理纳米颗粒的反应产物的底部填充粘合剂粘合并电连接到基底的电子部件。
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公开(公告)号:US07327039B2
公开(公告)日:2008-02-05
申请号:US10441879
申请日:2003-05-20
申请人: Scott B. Charles , Kathleen M. Gross , Steven C. Hackett , Michael A. Kropp , William J. Schultz , Wendy L. Thompson
发明人: Scott B. Charles , Kathleen M. Gross , Steven C. Hackett , Michael A. Kropp , William J. Schultz , Wendy L. Thompson
CPC分类号: H01L23/295 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16 , H01L2224/2929 , H01L2224/29386 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H05K3/305 , H01L2924/00 , H01L2924/0665 , H01L2924/05442
摘要: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.
摘要翻译: 本发明提供了制造所述制品的电子制品和方法。 电子制品包括使用包含热固性树脂,固化催化剂和基本上球形,非聚集,无定形和固体的表面处理纳米颗粒的反应产物的底部填充粘合剂粘合并电连接到基底的电子部件。
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公开(公告)号:US06664318B1
公开(公告)日:2003-12-16
申请号:US09467455
申请日:1999-12-20
申请人: Richard M. Bymark , Frank Y. Xu , Rolf W. Biernath , Michael A. Kropp , Wayne S. Mahoney , Taun L. McKenzie , Wendy L. Thompson
发明人: Richard M. Bymark , Frank Y. Xu , Rolf W. Biernath , Michael A. Kropp , Wayne S. Mahoney , Taun L. McKenzie , Wendy L. Thompson
IPC分类号: C08K524
CPC分类号: C08L101/02 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要: A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.
摘要翻译: 一种用于无溶剂,疏水树脂封装玻璃化转变温度低于0℃并含有非聚硅氧烷低聚物的热机械抗冲击固化组合物,其包含具有反应性官能度的柔性烃主链,最高约40重量% 的粘合促进剂和任选的粘度调节组分。
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4.
公开(公告)号:US20100214732A1
公开(公告)日:2010-08-26
申请号:US12705008
申请日:2010-02-12
摘要: This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.
摘要翻译: 本公开涉及用于将盖子附接和密封到外壳上的垫圈材料。 更具体地说,本公开内容涉及适用于敏感电子部件的容器表面的成形衬垫。 垫片包括柔性聚合物和微粉聚烯烃填料。
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5.
公开(公告)号:US09456513B2
公开(公告)日:2016-09-27
申请号:US12705008
申请日:2010-02-12
IPC分类号: H05K5/06
摘要: This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.
摘要翻译: 本公开涉及用于将盖子附接和密封到外壳上的垫圈材料。 更具体地说,本公开内容涉及适用于敏感电子部件的容器表面的成形衬垫。 垫片包括柔性聚合物和微粉聚烯烃填料。
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公开(公告)号:US06528169B2
公开(公告)日:2003-03-04
申请号:US09888921
申请日:2001-06-25
IPC分类号: B32B2738
CPC分类号: H01L21/563 , C08G59/42 , C08G59/4284 , C09J163/00 , H01L24/29 , H01L2224/73203 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , H01L2924/00
摘要: The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.
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公开(公告)号:US06294259B1
公开(公告)日:2001-09-25
申请号:US09611450
申请日:2000-07-06
IPC分类号: B32B2738
CPC分类号: C09J163/00 , C08G73/101 , C08G73/1014 , C08L63/00 , C08L79/08 , C09J179/08 , Y10T428/31511
摘要: This invention relates to a polyimide hybrid adhesive comprised of an epoxy component, an epoxy curing agent, and a polyimide oligomer of molecular weight of up to about 8,000 (Mn) having repeating units of Formula (1): The adhesives are particularly useful in applications where thermal stability and high adhesive strength are required.
摘要翻译: 本发明涉及由具有式(1)重复单元的分子量高达约8,000(Mn)的环氧组分,环氧固化剂和聚酰亚胺低聚物组成的聚酰亚胺混合粘合剂:该粘合剂特别适用于应用 需要热稳定性和高粘合强度。
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公开(公告)号:US20130267136A1
公开(公告)日:2013-10-10
申请号:US13988581
申请日:2011-12-28
IPC分类号: C09J163/00 , C09J7/00
CPC分类号: C09J163/00 , C08G59/245 , C08G59/56 , C08G59/66 , C08K5/0025 , C09J7/00 , C09J7/10 , C09J7/30 , C09J2400/263 , C09J2400/283 , C09J2463/00 , Y10T442/10
摘要: Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.
摘要翻译: 提供了粘合剂组合物,其包含:a)包含环氧树脂的基础树脂; b)第一种环氧固化剂; 和c)第二环氧固化剂; 其中选择第一和第二环氧固化剂使得第二环氧固化剂在温度和持续时间条件下在组合物中基本上未反应,使第一环氧固化剂基本上与组合物中的环氧树脂反应。 在一些实施方案中,第一环氧固化剂基本上与组合物中的环氧树脂反应,第二环氧固化剂在组合物中基本上未反应。 在一些实施方案中,粘合剂组合物以粘合剂膜的形式使用。
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公开(公告)号:US20090155596A1
公开(公告)日:2009-06-18
申请号:US11955070
申请日:2007-12-12
IPC分类号: C09J5/06 , C09J163/00 , B32B37/12
CPC分类号: C09J163/00 , B41J2/17536 , C09D11/101 , Y10T428/31511
摘要: A method of applying a curable composition. The method includes providing a curable composition comprising about 10 to about 60 weight percent of one or more epoxy resins; about 20 to about 80 weight percent of one or more resins selected from polyester resins, ethyl vinyl acetate resins, thermoplastic resins, and acrylate resins; up to about 30 weight percent of one or more hydroxyl-containing compounds; and an initiator selected from a photoinitiator, a thermal initiator, and combinations thereof. The method further includes initiating cure of the curable composition.
摘要翻译: 施加可固化组合物的方法。 该方法包括提供包含约10至约60重量%的一种或多种环氧树脂的可固化组合物; 约20至约80重量%的一种或多种选自聚酯树脂,乙酸乙烯酯树脂,热塑性树脂和丙烯酸酯树脂的树脂; 至多约30重量%的一种或多种含羟基化合物; 和选自光引发剂,热引发剂及其组合的引发剂。 该方法还包括引发可固化组合物的固化。
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公开(公告)号:US06395124B1
公开(公告)日:2002-05-28
申请号:US09365289
申请日:1999-07-30
申请人: Joel D. Oxman , Michael A. Kropp
发明人: Joel D. Oxman , Michael A. Kropp
IPC分类号: B32B3128
CPC分类号: B32B7/12 , B32B2037/243 , B32B2038/0092 , B32B2307/40 , B32B2429/02 , B32B2457/08 , C08F2/46 , C08F290/067 , C09J4/00 , C09J4/06 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01037 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01322 , H01L2924/12041 , C08F222/1006 , H01L2924/00
摘要: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above. The photopolymerizable adhesive composition can be applied directly to one or both surfaces of an aligned integrated chip and circuit board substrate or the chip aligned on an integrated circuit board substrate can be capillary underfilled with the photopolymerizable adhesive composition, which is subsequently cured. Data storage disks can also be prepared by the method of the invention.
摘要翻译: 层压结构的方法包括至少两层和在这些层之间的可光聚合的粘合剂组合物,至少一层是不透明的,有色的或反射的。 这些层中的一层或两层对波长在大于400nm和高达1200nm的波长的光化辐射是透射的。 可光聚合的粘合剂组合物吸收辐射透射层的所识别的光谱区域中的辐射。 通过在所识别的光谱区域中通过辐射透射层引导辐射并产生层压结构来实现固化。 可以通过上述方法制备集成电路板基板上的未充满的倒装芯片组件。 可光聚合的粘合剂组合物可以直接施加到对准的集成芯片和电路板基板的一个或两个表面,或者在集成电路板基板上排列的芯片可以被毛发填充,然后可光聚合的粘合剂组合物随后被固化。 数据存储盘也可以通过本发明的方法来制备。
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