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    STRUCTURAL HYBRID ADHESIVES
    1.
    发明申请
    STRUCTURAL HYBRID ADHESIVES 审中-公开
    结构混合粘合剂

    公开(公告)号：US20130267136A1

    公开(公告)日：2013-10-10

    申请号：US13988581

    申请日：2011-12-28

    申请人： Dmitriy Salnikov ,  Michael A. Kropp ,  Ilya Gorodisher

    发明人： Dmitriy Salnikov ,  Michael A. Kropp ,  Ilya Gorodisher

    IPC分类号： C09J163/00 ,  C09J7/00

    CPC分类号： C09J163/00 ,  C08G59/245 ,  C08G59/56 ,  C08G59/66 ,  C08K5/0025 ,  C09J7/00 ,  C09J7/10 ,  C09J7/30 ,  C09J2400/263 ,  C09J2400/283 ,  C09J2463/00 ,  Y10T442/10

    摘要： Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.

    摘要翻译： 提供了粘合剂组合物，其包含：a）包含环氧树脂的基础树脂; b）第一种环氧固化剂; 和c）第二环氧固化剂; 其中选择第一和第二环氧固化剂使得第二环氧固化剂在温度和持续时间条件下在组合物中基本上未反应，使第一环氧固化剂基本上与组合物中的环氧树脂反应。 在一些实施方案中，第一环氧固化剂基本上与组合物中的环氧树脂反应，第二环氧固化剂在组合物中基本上未反应。 在一些实施方案中，粘合剂组合物以粘合剂膜的形式使用。

    Energy-curable cyanate/ethylenically unsaturated compositions
    2.
    发明授权
    Energy-curable cyanate/ethylenically unsaturated compositions 失效
    能量可固化的氰酸酯/烯属不饱和组合物

    公开(公告)号：US5856022A

    公开(公告)日：1999-01-05

    申请号：US553622

    申请日：1995-11-09

    申请人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

    发明人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

    IPC分类号： C08F265/06 ,  F16F1/36 ,  H05K1/02 ,  H05K1/03 ,  B32B27/00

    CPC分类号： F16F1/3605 ,  C08F265/06 ,  H05K1/0271 ,  H05K1/0353 ,  H05K1/0373 ,  Y10T428/31855 ,  Y10T428/31928

    摘要： A composition of matter includes a polymerizable mixture comprising 1 to 99 weight percent of a first monomer and an initiator therefor, the first monomer being one of 1) at least one free-radically polymerizable monomer or 2) at least one cyanate ester monomer, and 99 to 1 weight percent of a second monomer and an initiator therefor, the second monomer being the member of 1) or 2) that is not selected as the first monomer, wherein the curative for the cyanate ester is a transition metal-containing organometallic compound curing agent and the curative for the free-radically polymerizable monomer is a free-radical generating curing agent or a transition metal-containing organometallic compound. The polymeric mixtures are useful, for example, in applications requiring high performance, such as high temperature performance; in composites, particularly structural composites; structural adhesives; vibration damping materials; electronic applications such as printed wiring boards, semiconductor encapsulants and electronic adhesives; photoresists; injection molding and prepregs; protective coatings; tough self-supporting films; and high performance binders. In addition, a curable composition comprising two partially polymerized mixed syrups of ethylenically unsaturated monomers is provided. These compositions are useful as the precursors for vibration damping materials. Further, a curable composition including (1) an ethylenically unsaturated monomer or (2) an ethylenically unsaturated monomer and a cyanate ester monomer, and certain organometallic neutral compounds is useful in the graphic arts.

    摘要翻译： PCT No.PCT / US94 / 06756 Sec。 371日期：1995年11月9日 102（e）日期1995年11月9日PCT Filed 1994年6月15日PCT公布。 公开号WO94 / 29369 日期1994年12月22日物质组成包括含有1至99重量％的第一单体和其引发剂的可聚合混合物，第一单体是1）至少一种可自由基聚合的单体之一或2）至少一种 氰酸酯单体和99至1重量％的第二单体及其引发剂，第二单体为1）或2）未被选择为第一单体的成员，其中氰酸酯的固化剂为过渡 含金属的有机金属化合物固化剂和可自由基聚合的单体的固化剂是产生自由基的固化剂或含过渡金属的有机金属化合物。 聚合物混合物可用于例如需要高性能的应用，例如高温性能; 在复合材料中，特别是结构复合材料; 结构胶; 振动阻尼材料; 电子应用如印刷线路板，半导体密封剂和电子粘合剂; 光致抗蚀剂 注塑和预浸料; 保护涂层; 强硬的自我支持的电影; 和高性能粘合剂。 此外，提供了包含两种部分聚合的烯属不饱和单体的混合糖浆的可固化组合物。 这些组合物可用作减振材料的前体。 此外，包含（1）烯键式不饱和单体或（2）烯键式不饱和单体和氰酸酯单体以及某些有机金属中性化合物的可固化组合物可用于图形领域。

    Energy-curable cyanate/ethylenically unsaturated compositions
    3.
    发明授权
    Energy-curable cyanate/ethylenically unsaturated compositions 失效
    能量可固化的氰酸酯/烯属不饱和组合物

    公开(公告)号：US6069214A

    公开(公告)日：2000-05-30

    申请号：US66966

    申请日：1998-04-27

    申请人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

    发明人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

    IPC分类号： F16F15/02 ,  B32B27/00 ,  B32B27/06 ,  C08F4/42 ,  C08G73/00 ,  C08G73/06 ,  C08J5/00 ,  C08L79/04 ,  C09J4/02 ,  G03F7/027 ,  G03F7/029 ,  C08L67/07

    CPC分类号： G03F7/027 ,  B32B27/06 ,  C08G73/065 ,  C08G73/0655 ,  C08G73/0661 ,  G03F7/029 ,  Y10T428/31855

    摘要： A composition of matter includes a polymerizable mixture comprising 1 to 99 weight percent of a first monomer and an initiator therefor, the first monomer being one of 1) at least one free-radically polymerizable monomer or 2) at least one cyanate ester monomer, and 99 to 1 weight percent of a second monomer and an initiator therefor, the second monomer being the member of 1) or 2) that is not selected as the first monomer, wherein the curative for the cyanate ester is a transition metal-containing organometallic compound curing agent and the curative for the free-radically polymerizable monomer is a free-radical generating curing agent or a transition metal-containing organometallic compound. The polymeric mixtures are useful, for example, in applications requiring high performance, such as high temperature performance; in composites, particularly structural composites; structural adhesives; vibration damping materials; electronic applications such as printed wiring boards, semiconductor encapsulants and electronic adhesives; photoresists; injection molding and prepregs; protective coatings; tough self-supporting films; and high performance binders. In addition, a curable composition including (1) an ethylenically unsaturated monomer or (2) an ethylenically unsaturated monomer and a cyanate ester monomer, and certain organometallic neutral compounds is useful in the graphic arts.

    摘要翻译： 物质组合物包括可聚合的混合物，其包含1至99重量％的第一单体和其引发剂，第一单体是1）至少一种可自由基聚合的单体之一或2）至少一种氰酸酯单体之一，以及 99至1重量％的第二单体及其引发剂，第二单体为1）或2）未被选择为第一单体的成分，其中氰酸酯的固化剂为含过渡金属的有机金属化合物 固化剂和可自由基聚合单体的固化剂是自由基产生固化剂或含过渡金属的有机金属化合物。 聚合物混合物可用于例如需要高性能的应用，例如高温性能; 在复合材料中，特别是结构复合材料; 结构胶; 振动阻尼材料; 电子应用如印刷线路板，半导体密封剂和电子粘合剂; 光致抗蚀剂 注塑和预浸料; 保护涂层; 强硬的自我支持的电影; 和高性能粘合剂。 此外，包含（1）烯键式不饱和单体或（2）烯键式不饱和单体和氰酸酯单体以及某些有机金属中性化合物的可固化组合物在图形领域中是有用的。

    Energy-curable cyanate/ethylenically unsaturated compositions
    4.
    发明授权
    Energy-curable cyanate/ethylenically unsaturated compositions 失效
    能量可固化的氰酸酯/烯属不饱和组合物

    公开(公告)号：US5744557A

    公开(公告)日：1998-04-28

    申请号：US078981

    申请日：1993-06-16

    申请人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

    发明人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

    IPC分类号： F16F15/02 ,  B32B27/00 ,  B32B27/06 ,  C08F4/42 ,  C08G73/00 ,  C08G73/06 ,  C08J5/00 ,  C08L79/04 ,  C09J4/02 ,  G03F7/027 ,  G03F7/029 ,  C08L67/07

    CPC分类号： G03F7/027 ,  B32B27/06 ,  C08G73/065 ,  C08G73/0655 ,  C08G73/0661 ,  G03F7/029 ,  Y10T428/31855

    摘要： A composition of matter including a polymerizable mixture comprising 1 to 99 weight percent of a first monomer and an initiator therefor, the first monomer being one of 1) at least one free-radically polymerizable monomer or 2) at least one cyanate ester monomer, and 99 to 1 weight percent of a second monomer and an initiator therefor, the second monomer being the member of 1) or 2) that is not selected as the first monomer, wherein the curative for the cyanate ester is a transition metal-containing organometallic compound curing agent and the curative for the free-radically polymerizable monomer is a free-radical generating curing agent or a transition metal-containing organometallic compound. The polymeric mixtures are useful, for example, in applications requiring high performance, such as high temperature performance; in composites, particularly structural composites; structural adhesives; vibration damping materials; electronic applications such as printed wiring boards, semiconductor encapsulants and electronic adhesives; photoresists; injection molding and prepregs; protective coatings; tough self-supporting films; and high performance binders. In addition, a curable composition including (1) an ethylenically unsaturated monomer or (2) an ethylenically unsaturated monomer and a cyanate ester monomer, and certain organometallic neutral compounds is useful in the graphic arts.

    摘要翻译： 一种包含可聚合混合物的组合物，其包含1至99重量％的第一单体和其引发剂，所述第一单体是1）至少一种可自由基聚合的单体之一或2）至少一种氰酸酯单体，和 99至1重量％的第二单体及其引发剂，第二单体为1）或2）未被选择为第一单体的成分，其中氰酸酯的固化剂为含过渡金属的有机金属化合物 固化剂和可自由基聚合单体的固化剂是自由基产生固化剂或含过渡金属的有机金属化合物。 聚合物混合物可用于例如需要高性能的应用，例如高温性能; 在复合材料中，特别是结构复合材料; 结构胶; 振动阻尼材料; 电子应用如印刷线路板，半导体密封剂和电子粘合剂; 光致抗蚀剂 注塑和预浸料; 保护涂层; 强硬的自我支持的电影; 和高性能粘合剂。 此外，包含（1）烯键式不饱和单体或（2）烯键式不饱和单体和氰酸酯单体以及某些有机金属中性化合物的可固化组合物在图形领域中是有用的。

    NOZZLE SEALING COMPOSITION AND METHOD
    8.
    发明申请
    NOZZLE SEALING COMPOSITION AND METHOD 审中-公开
    喷嘴密封组合物和方法

    公开(公告)号：US20090155596A1

    公开(公告)日：2009-06-18

    申请号：US11955070

    申请日：2007-12-12

    申请人： Michael A. Kropp ,  Roger A. Grisle ,  Eric G. Larson

    发明人： Michael A. Kropp ,  Roger A. Grisle ,  Eric G. Larson

    IPC分类号： C09J5/06 ,  C09J163/00 ,  B32B37/12

    CPC分类号： C09J163/00 ,  B41J2/17536 ,  C09D11/101 ,  Y10T428/31511

    摘要： A method of applying a curable composition. The method includes providing a curable composition comprising about 10 to about 60 weight percent of one or more epoxy resins; about 20 to about 80 weight percent of one or more resins selected from polyester resins, ethyl vinyl acetate resins, thermoplastic resins, and acrylate resins; up to about 30 weight percent of one or more hydroxyl-containing compounds; and an initiator selected from a photoinitiator, a thermal initiator, and combinations thereof. The method further includes initiating cure of the curable composition.

    摘要翻译： 施加可固化组合物的方法。 该方法包括提供包含约10至约60重量％的一种或多种环氧树脂的可固化组合物; 约20至约80重量％的一种或多种选自聚酯树脂，乙酸乙烯酯树脂，热塑性树脂和丙烯酸酯树脂的树脂; 至多约30重量％的一种或多种含羟基化合物; 和选自光引发剂，热引发剂及其组合的引发剂。 该方法还包括引发可固化组合物的固化。

    Method of producing a laminated structure
    9.
    发明授权
    Method of producing a laminated structure 有权
    层压结构体的制造方法

    公开(公告)号：US06395124B1

    公开(公告)日：2002-05-28

    申请号：US09365289

    申请日：1999-07-30

    申请人： Joel D. Oxman ,  Michael A. Kropp

    发明人： Joel D. Oxman ,  Michael A. Kropp

    IPC分类号： B32B3128

    CPC分类号： B32B7/12 ,  B32B2037/243 ,  B32B2038/0092 ,  B32B2307/40 ,  B32B2429/02 ,  B32B2457/08 ,  C08F2/46 ,  C08F290/067 ,  C09J4/00 ,  C09J4/06 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12041 ,  C08F222/1006 ,  H01L2924/00

    摘要： A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above. The photopolymerizable adhesive composition can be applied directly to one or both surfaces of an aligned integrated chip and circuit board substrate or the chip aligned on an integrated circuit board substrate can be capillary underfilled with the photopolymerizable adhesive composition, which is subsequently cured. Data storage disks can also be prepared by the method of the invention.

    摘要翻译： 层压结构的方法包括至少两层和在这些层之间的可光聚合的粘合剂组合物，至少一层是不透明的，有色的或反射的。 这些层中的一层或两层对波长在大于400nm和高达1200nm的波长的光化辐射是透射的。 可光聚合的粘合剂组合物吸收辐射透射层的所识别的光谱区域中的辐射。 通过在所识别的光谱区域中通过辐射透射层引导辐射并产生层压结构来实现固化。 可以通过上述方法制备集成电路板基板上的未充满的倒装芯片组件。 可光聚合的粘合剂组合物可以直接施加到对准的集成芯片和电路板基板的一个或两个表面，或者在集成电路板基板上排列的芯片可以被毛发填充，然后可光聚合的粘合剂组合物随后被固化。 数据存储盘也可以通过本发明的方法来制备。