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公开(公告)号：US07846998B2
公开(公告)日：2010-12-07
申请号：US10598515
申请日：2005-03-03
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K5/1515 , C08K5/49 , C08K5/544 , C08L2666/28 , C09J163/00 , H01L23/296 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), R1s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; n represents an integer of 0-4; R2s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; and m represents an integer of 0-6.)
摘要翻译： 公开了含有环氧树脂（A）和固化剂（B）的包封环氧树脂材料。 环氧树脂（A）含有下述通式（I）表示的化合物。 封装环氧树脂材料在阻燃性，成形性，耐回流性，耐湿性，高温搁架特性等方面具有优异的可靠性，并且适合用于VLSI的封装。 还公开了一种电子部件，其包括用这种材料封装的元件。 （I）（通式（I）中，R 1可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基和具有1-12个碳原子的取代或未取代的烷氧基的一个; n 表示0-4的整数; R 2可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基和具有1-12个碳原子的取代或未取代的烷氧基的一个; m表示整数 的0-6。）
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公开(公告)号：US20080234409A1
公开(公告)日：2008-09-25
申请号：US10598515
申请日：2005-03-03
IPC分类号： C08L63/00
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K5/1515 , C08K5/49 , C08K5/544 , C08L2666/28 , C09J163/00 , H01L23/296 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), R1s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; n represents an integer of 0-4; R2s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; and m represents an integer of 0-6.)
摘要翻译： 公开了含有环氧树脂（A）和固化剂（B）的包封环氧树脂材料。 环氧树脂（A）含有下述通式（I）表示的化合物。 封装环氧树脂材料在阻燃性，成形性，耐回流性，耐湿性，高温搁架特性等方面具有优异的可靠性，并且适合用于VLSI的封装。 还公开了一种电子部件，其包括用这种材料封装的元件。 （I）（通式（I）中，R 1可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基和取代或未取代的烷氧基 具有1-12个碳原子的基团; n表示0-4的整数; R 2可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基中的一个 和具有1-12个碳原子的取代或未取代的烷氧基; m表示0-6的整数。）
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3.发明申请公开(公告)号：US20060214153A1
公开(公告)日：2006-09-28
申请号：US10552441
申请日：2004-04-07
申请人： Ryoichi Ikezawa , Naoki Nara , Hideyuki Chaki , Yoshihiro Mizukami , Yoshinori Endou , Takaki Kashihara , Fumio Furusawa , Masaki Yoshii , Shinsuke Hagiwara , Mitsuo Katayose
发明人： Ryoichi Ikezawa , Naoki Nara , Hideyuki Chaki , Yoshihiro Mizukami , Yoshinori Endou , Takaki Kashihara , Fumio Furusawa , Masaki Yoshii , Shinsuke Hagiwara , Mitsuo Katayose
CPC分类号： H01L23/295 , H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/1301 , H01L2924/00 , H01L2224/0401
摘要： 1. An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.
摘要翻译： 1.一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）无机填料，其中所述无机填料（C）的平均粒径为12μm以下， 比表面积为3.0m 2 / g以上。
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4.发明授权公开(公告)号：US07397139B2
公开(公告)日：2008-07-08
申请号：US10552441
申请日：2004-04-07
申请人： Ryoichi Ikezawa , Naoki Nara , Hideyuki Chaki , Yoshihiro Mizukami , Yoshinori Endou , Takaki Kashihara , Fumio Furusawa , Masaki Yoshii , Shinsuke Hagiwara , Mitsuo Katayose
发明人： Ryoichi Ikezawa , Naoki Nara , Hideyuki Chaki , Yoshihiro Mizukami , Yoshinori Endou , Takaki Kashihara , Fumio Furusawa , Masaki Yoshii , Shinsuke Hagiwara , Mitsuo Katayose
IPC分类号： H01L23/28
CPC分类号： H01L23/295 , H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/1301 , H01L2924/00 , H01L2224/0401
摘要： An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.
摘要翻译： 一种封装环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）无机填料，其中，所述无机填料（C）的平均粒径为12μm以下， 表面积为3.0m 2 / g以上。
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5.发明申请公开(公告)号：US20120125670A1
公开(公告)日：2012-05-24
申请号：US13388316
申请日：2010-08-02
申请人： Takahiko Kato , Takashi Naito , Takuya Aoyagi , Hiroki Yamamoto , Masato Yoshida , Mitsuo Katayose , Shinji Takeda , Naotaka Tanaka , Shuichiro Adachi
发明人： Takahiko Kato , Takashi Naito , Takuya Aoyagi , Hiroki Yamamoto , Masato Yoshida , Mitsuo Katayose , Shinji Takeda , Naotaka Tanaka , Shuichiro Adachi
CPC分类号： H01L23/49883 , B22F1/0055 , B22F1/0074 , B22F1/02 , C22C1/0425 , C22C1/05 , H01B1/026 , H01J11/12 , H01J11/22 , H01J2211/225 , H01L21/4867 , H01L31/022425 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , H05K3/4629 , H05K2201/0224 , H05K2203/0315 , Y02E10/50 , H01L2924/00
摘要： In an electronic component having a wiring and/or an electrode prepared through firing of a paste or in an electronic component having a wiring in contact with a glass or glass ceramic member, provided is an electronic component using a Cu-based wiring material which less suffers from increase in electric resistance due to oxidation, which less causes bubbles in the glass or glass ceramic, and has satisfactory migration resistance. The Cu—Al alloy powder includes a Cu—Al alloy powder including Cu and, preferably, 50 percent by weight or less of Al; and an aluminum oxide film having a thickness of 80 nm or less and being present on the surface of the Cu—Al alloy powder. The powder, when compounded with a glass or glass ceramic material to give a paste, can be used to form wiring (interconnections), electrodes, and/or contact members.
摘要翻译： 在具有布线和/或通过烧制制成的电极的电子部件或具有与玻璃或玻璃陶瓷部件接触的布线的电子部件中的电子部件中，提供了使用Cu基布线材料的电子部件 由于氧化而导致的电阻增加，玻璃或玻璃陶瓷中的气泡较少，具有良好的耐迁移性。 Cu-Al合金粉末包括Cu-Cu合金粉末，优选为50重量％以下的Al; 以及Cu-Al合金粉末的表面上存在厚度为80nm以下的氧化铝膜。 当与玻璃或玻璃陶瓷材料混合以得到糊剂时，该粉末可用于形成布线（互连），电极和/或接触构件。
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6.发明授权Treating agent for forming a fluoride coating film and method for forming a fluoride coating film 有权用于形成氟化物涂膜的处理剂和形成氟化物涂膜的方法公开(公告)号：US07862654B2
公开(公告)日：2011-01-04
申请号：US12849857
申请日：2010-08-04
CPC分类号： C23C22/02 , B22F1/02 , H01F41/026 , H01F41/0293
摘要： A fluoride coating film formed with a fluoride-containing solution wherein a rare earth fluoride or an alkaline earth metal fluoride, in particular, fluoride of Pr, Nd, Dy, Tb and Ho, is swollen in a solvent comprising a major amount of an alcohol, and the solution is a colloidal solution in which the rare earth fluoride or the alkaline earth metal fluoride is dispersed homogeneously in the solvent comprising a major amount of an alcohol improves magnetic properties of NdFeB rare earth magnets including not only sintered magnets but also bonded magnets.
摘要翻译： 用含氟化物溶液形成的氟化物涂膜，其中稀土氟化物或碱土金属氟化物，特别是Pr，Nd，Dy，Tb和Ho的氟化物在包含主要量的醇的溶剂中溶胀 该溶液是稀土氟化物或碱土金属氟化物均匀分散在包含大量醇的溶剂中的胶体溶液，改善了不仅包括烧结磁体而且包括粘结磁体的NdFeB稀土磁体的磁性能 。
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7.发明申请Epoxy Resin Molding Material for Sealing, and Electronic Component Device 审中-公开用于密封的环氧树脂成型材料和电子部件装置公开(公告)号：US20090247670A1
公开(公告)日：2009-10-01
申请号：US12094532
申请日：2006-11-16
CPC分类号： H01L23/293 , C08G59/621 , C08J3/226 , C08J2363/00 , C08J2463/00 , C08K3/22 , C08K5/0041 , C08L63/00 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B), and a colorant resin mixture (C) wherein a resin (C1) and a colorant (D) having an electric resistivity of 1×105Ω·cm or more are beforehand mixed with each other. This can provide an epoxy resin molding material for sealing which is good in moldabilities such as fluidity and curability, and colorability, and which does not cause a short circuit failure based on an electroconductive material even when the material is used in a package wherein the distance between pads or wires is small; and an electronic component device equipped with an element sealed therewith.
摘要翻译： 本发明涉及一种用于密封的环氧树脂模制材料，其包括环氧树脂（A），固化剂（B）和着色剂树脂混合物（C），其中树脂（C1）和着色剂（D）具有电 预先混合1×10 5Ω·cm以上的电阻率。 这可以提供一种密封性优异的环氧树脂成型材料，其流动性，固化性，着色性等成型性良好，即使将该材料用于包装中也不会导致基于导电性材料的短路故障， 焊盘或电线之间的距离小; 以及配备有与其密封的元件的电子部件装置。
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8.发明申请REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR 有权磷酸盐和丙二醇化合物的反应产物和用作环氧固化助剂公开(公告)号：US20090005480A1
公开(公告)日：2009-01-01
申请号：US12108023
申请日：2008-04-23
CPC分类号： C08G59/688
摘要： The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation, a curing resin composition containing the curing accelerator, and an electronic component device having a device component encapsulated with the curing resin composition. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.
摘要翻译： 本发明涉及一种固化树脂的固化促进剂，该固化树脂通过使膦化合物（a）与具有至少一个在芳香环上取代的卤素原子的化合物（b）和至少一个能够排出的质子原子反应而得到， 脱卤化氢反应产物，含有固化促进剂的固化树脂组合物和具有由固化树脂组合物包封的装置组分的电子部件装置。 固化促进剂在吸湿性，流动性，回流开裂性和高温保存特性方面表现出优异的固化性。
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9.发明授权
公开(公告)号：US5484685A
公开(公告)日：1996-01-16
申请号：US708839
申请日：1991-05-30
申请人： Seiji Tai , Nobuyuki Hayashi , Koichi Kamijima , Mitsuo Katayose , Takayuki Akimoto , Shigeru Hayashida , Hideo Hagiwara , Susumu Era , Setsuo Kobayashi , Akio Mukoh
发明人： Seiji Tai , Nobuyuki Hayashi , Koichi Kamijima , Mitsuo Katayose , Takayuki Akimoto , Shigeru Hayashida , Hideo Hagiwara , Susumu Era , Setsuo Kobayashi , Akio Mukoh
CPC分类号： C09B47/04 , C09B47/045 , G11B7/248 , Y10S430/146
摘要： A naphthalocyanine derivative of the formula: ##STR1## wherein M, Y, R.sup.1, k, l, m, n are as defined in the specification, is an effective substance for forming a recording layer on a substrate of an optical recording medium having high sensitivity with good properties.
摘要翻译： 具有下式的萘菁菁衍生物：其中M，Y，R 1，k，l，m，n如说明书中所定义的是用于在光学记录基材上形成记录层的有效物质 介质具有高灵敏度和良好的性能。
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10.发明授权Derivative of naphthalocyanine containing perfluoroalkyl group, process for preparing the same and optical recording medium 失效含有全氟烷基的萘酞菁的衍生物，其制备方法和光学记录介质
公开(公告)号：US5378589A
公开(公告)日：1995-01-03
申请号：US87517
申请日：1993-07-02
申请人： Hideo Sawada , Motohiro Mitani , Masaharu Nakayama , Yoshii Morishita , Mitsuo Katayose , Tadashi Okamoto , Nobuyuki Hayashi
发明人： Hideo Sawada , Motohiro Mitani , Masaharu Nakayama , Yoshii Morishita , Mitsuo Katayose , Tadashi Okamoto , Nobuyuki Hayashi
CPC分类号： C07D487/22 , C07F7/0858 , C09B47/085 , C09B47/14 , G11B7/248 , Y10S430/146
摘要： A derivative of naphthalocyanine containing a perfluoroalkyl group and having a particular structure for ensuring excellent weather-proof properties, extremely high solubility in various solvents and capability of forming a film, and an optical recording medium prepared by using the derivative and capable of recording while using a focused beam of a semiconductor laser or the like. The derivative of naphthalocyanine containing a perfluoroalkyl group may be prepared by reacting a perfluoroalkanoyl peroxide having a particular structure with a naphthalocyanine.
摘要翻译： 含有全氟烷基的萘酞菁衍生物，具有特殊的结构，用于确保优异的耐候性，在各种溶剂中的溶解度极高，形成膜的能力以及使用该衍生物并能够在使用时记录的光记录介质 半导体激光器等的聚焦光束。 含有全氟烷基的萘酞菁的衍生物可以通过使具有特定结构的全氟烷酰基过氧化物与萘酞菁反应来制备。
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