公开(公告)号：US20130300954A1

公开(公告)日：2013-11-14

申请号：US13992835

申请日：2011-12-09

申请人： Seiji Sunohara ,  Junichi Imaizumi ,  Tomoyuki Nakamura ,  Hajime Nakamura ,  Kouji Yamazaki ,  Hiroaki Takahashi ,  Kazuhiro Makishima ,  Kenichi Shinya ,  Megumi Tomomatsu

发明人： Seiji Sunohara ,  Junichi Imaizumi ,  Tomoyuki Nakamura ,  Hajime Nakamura ,  Kouji Yamazaki ,  Hiroaki Takahashi ,  Kazuhiro Makishima ,  Kenichi Shinya ,  Megumi Tomomatsu

IPC分类号： G02F1/1333 ,  G02F1/13

CPC分类号： G02F1/1313 ,  C08F2220/1858 ,  C08G18/672 ,  C08G18/755 ,  C09J4/06 ,  C09J7/10 ,  C09J133/14 ,  C09J175/14 ,  C09J2203/318 ,  C09J2433/00 ,  G02F1/1333 ,  G02F1/13338 ,  G02F2001/133331 ,  G02F2202/28 ,  Y10T428/2887 ,  Y10T428/31938 ,  C08F220/20 ,  C08F220/36 ,  C08G18/48

摘要： The adhesive sheet for an image display device includes a structural unit derived from the following general formula (a), wherein the glass transition temperature is from 10 to 50° C., and tan δ at 40 to 80° C. is from 0.5 to 1.1,The adhesive sheet for an image display device, an image display device, and an adhesive resin composition for an image display can be provided, which are useful for the prevention of cracking, the attenuation of the stress and the impact, that have excellent transparency, which improve the fog and the flicker in an image displayed on the screen, and which reduce the bubbles, the sullage, and the detachment, particularly under high temperature condition (for example, 80° C. or more) or under high-temperature and humidity condition (for example, 85° C./85% RH). In the formula, X is a hydrogen atom or a methyl group.

摘要翻译： 用于图像显示装置的粘合片包括衍生自以下通式（a）的结构单元，其中玻璃化转变温度为10至50℃，而在40至80℃的tanδ为0.5至 1.1。可以提供用于图像显示装置的粘合片，图像显示装置和用于图像显示的粘合剂树脂组合物，其可用于防止具有优异的裂纹，应力和冲击的衰减 透明度，其改善了屏幕上显示的图像中的雾和闪烁，并且特别是在高温条件（例如，80℃或更高）下或在高温条件下，减少了气泡， 温度和湿度条件（例如，85℃/ 85％RH）。 在该式中，X是氢原子或甲基。

公开(公告)号：US06884936B2

公开(公告)日：2005-04-26

申请号：US10468143

申请日：2002-02-25

申请人： Hiroaki Takahashi ,  Junichi Imaizumi ,  Hajime Nakamura ,  Hiroshi Nomura

发明人： Hiroaki Takahashi ,  Junichi Imaizumi ,  Hajime Nakamura ,  Hiroshi Nomura

IPC分类号： H05K9/00

CPC分类号： H05K9/0096

摘要： An electromagnetic wave shield film (1) comprises a transparent base (2), a conductor (4) positioned on the transparent base (2) via an adhesive (3) and having a mesh geometric pattern, and an earth portion (5) arranged around the conductor (4) and including conductive regions (501) which absorb electromagnetic waves, and non-conductive regions (510) which prevent the earth portion (5) from being creased.

摘要翻译： 电磁波屏蔽膜（1）包括透明基底（2），经由粘合剂（3）定位在透明基底（2）上并具有网格几何图形的导体（4）和布置在其上的接地部分 在导体（4）周围并且包括吸收电磁波的导电区域（501）和防止接地部分（5）折皱的非导电区域（510）。

公开(公告)号：US09034449B2

公开(公告)日：2015-05-19

申请号：US13571792

申请日：2012-08-10

申请人： Kouhei Horiuchi ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

发明人： Kouhei Horiuchi ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

IPC分类号： B32B7/12 ,  B32B9/00 ,  B32B33/00 ,  C09J7/02

CPC分类号： B32B37/02 ,  B32B37/12 ,  B32B2307/412 ,  B32B2457/202 ,  C09J7/20 ,  C09J7/40 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2433/00 ,  G02F1/1333 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/24777 ,  Y10T428/2839 ,  Y10T428/2848

摘要： The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order.

摘要翻译： 粘合剂膜包括层压在粘合剂层的两侧的膜状粘合剂层，光分离器和重分离分离器，以及进一步层压在重型剥离分离器上的载体膜。 形成外层的光分离器和载体膜的外边缘向外延伸超过粘合剂层的外边缘，而形成内层的重型剥离隔离物。 因此，粘合剂层的外边缘部分被保护。 首先抓住并释放载体膜的外缘部分，然后夹紧释放光分离器的外边缘部分，最后释放分离器，从而使分离器和载体膜可靠地 并以规定的顺序轻松释放。

公开(公告)号：US20130040093A1

公开(公告)日：2013-02-14

申请号：US13571792

申请日：2012-08-10

申请人： Kouhei HORIUCHI ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

发明人： Kouhei HORIUCHI ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

IPC分类号： C09J7/02

CPC分类号： B32B37/02 ,  B32B37/12 ,  B32B2307/412 ,  B32B2457/202 ,  C09J7/20 ,  C09J7/40 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2433/00 ,  G02F1/1333 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/24777 ,  Y10T428/2839 ,  Y10T428/2848

摘要： The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order.

公开(公告)号：US5234522A

公开(公告)日：1993-08-10

申请号：US800586

申请日：1991-11-27

申请人： Masakatsu Suzuki ,  Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Yasushi Katoh ,  Takato Oti ,  Eikichi Satou

发明人： Masakatsu Suzuki ,  Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Yasushi Katoh ,  Takato Oti ,  Eikichi Satou

IPC分类号： H05K3/20 ,  B32B15/08 ,  C08G73/10 ,  C08J7/04 ,  C09J179/08 ,  H01B3/30 ,  H05K1/00 ,  H05K3/28 ,  H05K3/38

CPC分类号： C08J7/047 ,  B32B15/08 ,  C08G73/1046 ,  C08G73/1071 ,  C09J179/08 ,  H01B3/306 ,  H05K3/281 ,  C08J2379/08 ,  C08J2479/00 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2203/066 ,  H05K2203/095 ,  H05K3/386 ,  Y10T29/49124 ,  Y10T428/2486 ,  Y10T428/31721

摘要： A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

公开(公告)号：US5171826A

公开(公告)日：1992-12-15

申请号：US792027

申请日：1991-11-13

申请人： Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Masakatsu Suzuki ,  Koushi Sakairi ,  Eikichi Satou

发明人： Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Masakatsu Suzuki ,  Koushi Sakairi ,  Eikichi Satou

IPC分类号： B32B7/12 ,  C08G73/12 ,  C08L79/08 ,  H01B3/30 ,  H05K1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC分类号： H01B3/306 ,  B32B7/12 ,  C08G73/12 ,  C08L79/085 ,  H05K3/28 ,  H05K3/281 ,  H05K3/386 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/095 ,  H05K3/4611 ,  H05K3/4635

摘要： A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

摘要翻译： 包含特定聚酰胺酸溶液和双马来酰亚胺化合物的耐热粘合剂组合物在粘合两种材料体之后显示出柔韧性和优异的耐热性，因此可以适用于柔性金属包覆层压板的制造，双面柔性 金属覆层压板和多层印刷电路板，以及用于将覆盖膜附着到印刷电路板上。

公开(公告)号：US4792476A

公开(公告)日：1988-12-20

申请号：US77390

申请日：1987-07-24

申请人： Shun-ichi Numata ,  Koji Fujisaki ,  Noriyuki Kinjo ,  Junichi Imaizumi ,  Yoshikatsu Mikami

发明人： Shun-ichi Numata ,  Koji Fujisaki ,  Noriyuki Kinjo ,  Junichi Imaizumi ,  Yoshikatsu Mikami

IPC分类号： C08G73/10 ,  C08L79/08 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  B32B5/02 ,  B32B15/02 ,  B32B15/08 ,  B32B27/06

CPC分类号： C08L79/08 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/1082 ,  H01L21/312 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5329 ,  H01L2224/24227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K3/4676 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2913 ,  Y10T428/31623 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

公开(公告)号：US5089346A

公开(公告)日：1992-02-18

申请号：US495362

申请日：1990-03-16

申请人： Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Masakatsu Suzuki ,  Koushi Sakairi ,  Eikichi Satou

发明人： Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Masakatsu Suzuki ,  Koushi Sakairi ,  Eikichi Satou

IPC分类号： B32B7/12 ,  C08G73/12 ,  C08L79/08 ,  H01B3/30 ,  H05K1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/28 ,  B32B7/12 ,  C08G73/12 ,  C08L79/085 ,  H01B3/306 ,  H05K3/281 ,  H05K3/386 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/095 ,  H05K3/4611 ,  H05K3/4635 ,  Y10T428/31681

摘要： A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

公开(公告)号：US4690999A

公开(公告)日：1987-09-01

申请号：US636736

申请日：1984-08-01

申请人： Shun-ichi Numata ,  Koji Fujisaki ,  Noriyuki Kinjo ,  Junichi Imaizumi ,  Yoshikatsu Mikami

发明人： Shun-ichi Numata ,  Koji Fujisaki ,  Noriyuki Kinjo ,  Junichi Imaizumi ,  Yoshikatsu Mikami

IPC分类号： C08G73/10 ,  C08L79/08 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03

CPC分类号： C08L79/08 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/1082 ,  H01L21/312 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5329 ,  H01L2224/24227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K3/4676 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2913 ,  Y10T428/31623 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

摘要翻译： 一种树脂材料，其具有作为化学结构单元的至少一个芳族环的聚酰亚胺，所述芳族环可以围绕其分子轴线旋转但在另一方向上不具有柔性，所述聚酰亚胺至少在单轴方向取向，具有低的热膨胀系数，并且可以 与无机材料一起成形为一体，得到复合成形制品。