公开(公告)号：US20060186414A1

公开(公告)日：2006-08-24

申请号：US11354046

申请日：2006-02-14

申请人： Seong-Yong Hwang ,  Kyoung-Ju Shin ,  Weon-Sik Oh

发明人： Seong-Yong Hwang ,  Kyoung-Ju Shin ,  Weon-Sik Oh

IPC分类号： H01L27/105 ,  H01L21/00

CPC分类号： G02F1/136286 ,  G02F1/13458 ,  H01L27/124

摘要： A substrate includes an array area and a data pad area adjacent to the array area. A gate line, a data line and a switching device are formed in the array area of the substrate. A data pad extending from an end of the data line and a supporter provided between the substrate and the data pad are provided in a data pad area to allow the data pad to be placed at a higher position than a passivation layer. Thus, a contact resistance occurring between an anisotropic conductive film and a bump and a contact resistance occurring between the anisotropic conductive film and the data pad are reduced.

摘要翻译： 衬底包括与阵列区域相邻的阵列区域和数据焊盘区域。 栅极线，数据线和开关器件形成在衬底的阵列区域中。 从数据线的端部延伸的数据焊盘和设置在基板和数据焊盘之间的支撑件设置在数据焊盘区域中，以使数据焊盘位于比钝化层更高的位置。 因此，各向异性导电膜和凸块之间发生的接触电阻和各向异性导电膜与数据焊盘之间的接触电阻降低。

公开(公告)号：US07943931B2

公开(公告)日：2011-05-17

申请号：US11354046

申请日：2006-02-14

申请人： Seong-Yong Hwang ,  Kyoung-Ju Shin ,  Weon-Sik Oh

发明人： Seong-Yong Hwang ,  Kyoung-Ju Shin ,  Weon-Sik Oh

IPC分类号： H01L29/04

CPC分类号： G02F1/136286 ,  G02F1/13458 ,  H01L27/124

摘要： A substrate includes an array area and a data pad area adjacent to the array area. A gate line, a data line and a switching device are formed in the array area of the substrate. A data pad extending from an end of the data line and a supporter provided between the substrate and the data pad are provided in a data pad area to allow the data pad to be placed at a higher position than a passivation layer. Thus, a contact resistance occurring between an anisotropic conductive film and a bump and a contact resistance occurring between the anisotropic conductive film and the data pad are reduced.

摘要翻译： 衬底包括与阵列区域相邻的阵列区域和数据焊盘区域。 栅极线，数据线和开关器件形成在衬底的阵列区域中。 从数据线的端部延伸的数据焊盘和设置在基板和数据焊盘之间的支撑件设置在数据焊盘区域中，以使数据焊盘位于比钝化层更高的位置。 因此，各向异性导电膜和凸块之间发生的接触电阻和各向异性导电膜与数据焊盘之间的接触电阻降低。

公开(公告)号：US07528486B2

公开(公告)日：2009-05-05

申请号：US10970360

申请日：2004-10-21

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Lak Choi ,  Chun-Ho Song

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Lak Choi ,  Chun-Ho Song

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/485 ,  H01B1/22

CPC分类号： H01L24/83 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01028

摘要： In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic conductive film includes a resin layer and the conductive particles. The anisotropic conductive film electrically connects an electrode of a substrate and the bump of a semiconductor chip. A volume ratio of the conductive particles to the resin layer is about 0.1 to about 0.12. A number of the conductive particles per cubic millimeter (mm3) is about 4 millions to about 7 millions. A standard deviation of heights of the bumps is no more than about 0.25. An interval between each of the bumps and an electrode of the substrate is no more than about 1.3 μm. Therefore, the size of each of the conductive particles is optimized so that a failure probability of the open circuit is decreased.

摘要翻译： 在包括导电颗粒和凸块的各向异性导电膜和具有各向异性导电膜和凸块的半导体芯片的封装结构中，各向异性导电膜包括树脂层和导电颗粒。 各向异性导电膜将衬底的电极和半导体芯片的凸起电连接。 导电颗粒与树脂层的体积比为约0.1至约0.12。 每立方毫米（mm3）的导电颗粒数量约为400万到约700万。 凸块的高度的标准偏差不大于约0.25。 每个凸起和基底的电极之间的间隔不大于约1.3μm。 因此，优化每个导电粒子的尺寸，使得开路的故障概率降低。

公开(公告)号：US07224424B2

公开(公告)日：2007-05-29

申请号：US10720652

申请日：2003-11-24

申请人： Seong-Yong Hwang ,  Sung-Chul Kang ,  Weon-Sik Oh ,  Cheol-Yong Jeong ,  Jin-Suk Lee ,  Ju-Young Yoon ,  Won-Gu Cho

发明人： Seong-Yong Hwang ,  Sung-Chul Kang ,  Weon-Sik Oh ,  Cheol-Yong Jeong ,  Jin-Suk Lee ,  Ju-Young Yoon ,  Won-Gu Cho

IPC分类号： G02F1/1345

CPC分类号： G02F1/13452 ,  G02F2001/13456 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.

摘要翻译： 在驱动IC和具有该驱动IC的显示装置中，驱动IC包括设置在驱动IC的下表面上并沿驱动IC的边缘排成多行的多个凸块。 沿着与凸块对准的方向垂直的方向并排排列在彼此不同的行的凸起。 因此，当使用各向异性导电膜将驱动IC安装在显示面板上时，各向异性导电膜可以平滑地流过由驱动IC的凸块限定的空间，从而改善驱动IC和显示装置的电特性。

公开(公告)号：US20050285836A1

公开(公告)日：2005-12-29

申请号：US11159098

申请日：2005-06-23

申请人： Seong-Yong Hwang ,  An-Na Park ,  Weon-Sik Oh ,  Jin-Kwan Kim ,  Sung-Lak Choi ,  Kyung-Lae Rho ,  Hyo-Hwi Choi ,  Ju-Yong Kim ,  Dong-Ha Lee

发明人： Seong-Yong Hwang ,  An-Na Park ,  Weon-Sik Oh ,  Jin-Kwan Kim ,  Sung-Lak Choi ,  Kyung-Lae Rho ,  Hyo-Hwi Choi ,  Ju-Yong Kim ,  Dong-Ha Lee

IPC分类号： G02F1/1345 ,  G09G3/36

CPC分类号： G02F1/136286 ,  G02F1/13452 ,  G02F2202/28 ,  G09G3/3648 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09663 ,  H05K2201/0969

摘要： A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.

摘要翻译： 一种显示装置，包括显示面板，包括像素电极和向像素电极传输驱动信号的多个第一信号线，第一信号线上的导电部件，具有树脂的导电部件和第二信号线 第二信号线具有开口，树脂通过该开口将第二信号线与第一信号线之一耦合。

公开(公告)号：US20050157244A1

公开(公告)日：2005-07-21

申请号：US10881156

申请日：2004-06-30

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

IPC分类号： H01L21/60 ,  G02F1/13 ,  G02F1/133 ,  G02F1/1345 ,  H01L23/48 ,  H01L23/482

CPC分类号： H01L24/17 ,  G02F1/13452 ,  H01L23/4824 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/3011 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps.

摘要翻译： 驱动器芯片包括其中形成有驱动电路的基体。 多个导电凸块设置在基体的顶面之上，多个导电凸块沿着基体的纵向排列成多列。 在基体的顶面上形成有多个导电布线，其将驱动电路电连接到多个导电凸块。

公开(公告)号：US07486284B2

公开(公告)日：2009-02-03

申请号：US11011746

申请日：2004-12-15

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

IPC分类号： G09G5/00

CPC分类号： H01L24/10 ,  G02F1/13452 ,  G02F2001/13456 ,  H01L24/06 ,  H01L24/13 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/00014

摘要： A driver chip includes a base body, an input terminal section and a first output terminal section. The base body includes a face having a long side and a short side. The input terminal section is formed at a first edge portion of the face along the long side. The first output terminal section is formed at a second edge portion that is opposite to the first edge portion. The input terminal section and the first output terminal section are disposed within about 9d/10 from a center of the long side toward the short side, wherein ‘d’ represents a distance between the center of the long side and the short side.

摘要翻译： 驱动器芯片包括基体，输入端子部分和第一输出端子部分。 基体包括具有长边和短边的面。 输入端子部分沿着长边形成在面部的第一边缘部分处。 第一输出端子部分形成在与第一边缘部分相对的第二边缘部分处。 输入端子部分和第一输出端子部分从长边的中心朝向短边设置在约9d / 10内，其中“d”表示长边的中心和短边之间的距离。

公开(公告)号：US07450393B2

公开(公告)日：2008-11-11

申请号：US10881156

申请日：2004-06-30

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

IPC分类号： H05K7/00

CPC分类号： H01L24/17 ,  G02F1/13452 ,  H01L23/4824 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/3011 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps.

摘要翻译： 驱动器芯片包括其中形成有驱动电路的基体。 多个导电凸块设置在基体的顶面之上，多个导电凸块沿着基体的纵向排列成多列。 在基体的顶面上形成有多个导电布线，其将驱动电路电连接到多个导电凸块。

公开(公告)号：US20060163724A1

公开(公告)日：2006-07-27

申请号：US11202464

申请日：2005-08-11

申请人： Seong-Yong Hwang ,  Weon-Sik Oh

发明人： Seong-Yong Hwang ,  Weon-Sik Oh

IPC分类号： H01L21/50 ,  G02F1/1345 ,  H01L23/48

CPC分类号： H01L24/17 ,  G02F1/13452 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/127 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a display apparatus, a display panel receives a driving signal from a driving chip through a pad and displays an image in response to the driving signal. The driving chip includes a terminal outputting the driving signal. The driving chip is mounted on the display panel using the anisotropic conductive film and electrically connected to the display panel. A lubricant layer is formed on a surface of the anisotropic conductive film to prevent an electrical defect in the connection between the driving chip and the display panel. Thus, the display apparatus may have improved yield.

摘要翻译： 在显示装置中，显示面板通过焊盘从驱动芯片接收驱动信号，并根据驱动信号显示图像。 驱动芯片包括输出驱动信号的端子。 使用各向异性导电膜将驱动芯片安装在显示面板上并电连接到显示面板。 在各向异性导电膜的表面上形成润滑剂层，以防止驱动芯片和显示面板之间的连接中的电气缺陷。 因此，显示装置可以具有提高的产量。

公开(公告)号：US20060146214A1

公开(公告)日：2006-07-06

申请号：US10534983

申请日：2003-12-05

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Chul Kang

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Chul Kang

IPC分类号： G02F1/136

CPC分类号： G02F1/13454 ,  G02F1/13452 ,  G02F1/13458 ,  G02F2202/022 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L27/1203 ,  H01L27/124 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13012 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2224/05599

摘要： A conductive bump including a plurality of protrusion members (251) and a conductive layer (252) formed on the protrusion members is disposed on a TFT substrate (200). Each of the protrusion members is disposed on an electrode pad (270y, b, 280c, b) in a pad region (292, 293) of the TFT substrate, and the conductive layer is electrically connected to the electrode pad. A non-conductive resin (600) is disposed on the conductive bump, and a driving IC (500) is thermally compressed on the conductive bump. Therefore, the electrical contact characteristic between the driving IC and the electrode pad is improved.

摘要翻译： 在TFT基板（200）上设置包括形成在突出部件上的多个突起部件（251）和导电层（252）的导电性凸块。 每个突起构件设置在TFT基板的焊盘区域（292,293）中的电极焊盘（270y，b，280c，b）上，并且导电层电连接到电极焊盘。 在导电凸块上设置非导电树脂（600），驱动IC（500）在导电凸块上被热压缩。 因此，提高了驱动IC和电极焊盘之间的电接触特性。