Nanosensor and method of manufacturing same
    1.
    发明授权
    Nanosensor and method of manufacturing same 有权
    纳米传感器及其制造方法

    公开(公告)号:US09465007B2

    公开(公告)日:2016-10-11

    申请号:US14224770

    申请日:2014-03-25

    IPC分类号: G01N27/447 G01N33/487

    CPC分类号: G01N27/44791 G01N33/48721

    摘要: A nanosensor may include a substrate that has a hole formed therein, a first insulating layer that is disposed on the substrate and has a nanopore formed therein, first and second electrodes that are disposed on the first insulating layer and are spaced apart from each other, first and second electrode pads that are disposed on the first and second electrodes, respectively, and a protective layer disposed on the first and second electrode pads. A method of manufacturing a nanosensor may include forming a first insulating layer, graphene, and a metal layer on a substrate, patterning the metal layer and the graphene, forming a protective layer on a portion of the graphene and the metal layer, exposing a portion of the graphene by removing a portion of the protective layer, forming a hole in the substrate, and forming a nanopore in the first insulating layer and the graphene to be connected to the hole.

    摘要翻译: 纳米传感器可以包括其中形成有孔的基板,设置在基板上并且在其中形成有纳米孔的第一绝缘层,设置在第一绝缘层上并彼此间隔开的第一和第二电极, 分别设置在第一和第二电极上的第一和第二电极焊盘以及设置在第一和第二电极焊盘上的保护层。 制造纳米传感器的方法可以包括在基板上形成第一绝缘层,石墨烯和金属层,图案化金属层和石墨烯,在石墨烯和金属层的一部分上形成保护层,将部分 通过去除保护层的一部分,在衬底中形成孔,并在第一绝缘层中形成纳米孔和与孔连接的石墨烯。

    NANOSENSOR AND METHOD OF MANUFACTURING SAME
    3.
    发明申请
    NANOSENSOR AND METHOD OF MANUFACTURING SAME 有权
    纳米传感器及其制造方法

    公开(公告)号:US20140202866A1

    公开(公告)日:2014-07-24

    申请号:US14224770

    申请日:2014-03-25

    IPC分类号: G01N27/447

    CPC分类号: G01N27/44791 G01N33/48721

    摘要: A nanosensor may include a substrate that has a hole formed therein, a first insulating layer that is disposed on the substrate and has a nanopore formed therein, first and second electrodes that are disposed on the first insulating layer and are spaced apart from each other, first and second electrode pads that are disposed on the first and second electrodes, respectively, and a protective layer disposed on the first and second electrode pads. A method of manufacturing a nanosensor may include forming a first insulating layer, graphene, and a metal layer on a substrate, patterning the metal layer and the graphene, forming a protective layer on a portion of the graphene and the metal layer, exposing a portion of the graphene by removing a portion of the protective layer, forming a hole in the substrate, and forming a nanopore in the first insulating layer and the graphene to be connected to the hole.

    摘要翻译: 纳米传感器可以包括其中形成有孔的基板,设置在基板上并且在其中形成有纳米孔的第一绝缘层,设置在第一绝缘层上并彼此间隔开的第一和第二电极, 分别设置在第一和第二电极上的第一和第二电极焊盘以及设置在第一和第二电极焊盘上的保护层。 制造纳米传感器的方法可以包括在基板上形成第一绝缘层,石墨烯和金属层,图案化金属层和石墨烯,在石墨烯和金属层的一部分上形成保护层,将部分 通过去除保护层的一部分,在衬底中形成孔,并在第一绝缘层中形成纳米孔和与孔连接的石墨烯。

    Microarray having bright fiducial mark and method of obtaining optical data from the microarray
    6.
    发明授权
    Microarray having bright fiducial mark and method of obtaining optical data from the microarray 有权
    具有明亮基准标记的微阵列和从微阵列获得光学数据的方法

    公开(公告)号:US08333932B2

    公开(公告)日:2012-12-18

    申请号:US12704163

    申请日:2010-02-11

    IPC分类号: G01N33/48

    摘要: A substrate includes; a fiducial mark disposed on the substrate, an area on the substrate on which a probe material is configured to be immobilized, the area being separated from the fiducial mark, and a probe immobilization compound disposed on the area on the substrate on which the probe material is configured to be immobilized, wherein the fiducial mark has a structure which reflects irradiated light at a greater intensity than an intensity of reflected irradiated light form the area on the substrate not corresponding to the fiducial mark.

    摘要翻译: 基板包括: 设置在基板上的基准标记,基板上的被配置为固定的探针材料的区域,与基准标记分离的区域,以及设置在基板上的探针固定化合物上的探针固定化合物,探针材料 被配置为被固定,其中基准标记具有以比反射的照射光的强度更大的强度反射照射的光的结构,形成不对应于基准标记的基板上的区域。

    Integrated bio-chip, method of fabricating the integrated bio-chip, and apparatus for detecting bio-material
    7.
    发明授权
    Integrated bio-chip, method of fabricating the integrated bio-chip, and apparatus for detecting bio-material 有权
    集成生物芯片,制造集成生物芯片的方法,以及生物材料检测装置

    公开(公告)号:US08263001B2

    公开(公告)日:2012-09-11

    申请号:US12609253

    申请日:2009-10-30

    申请人: Seong-ho Cho

    发明人: Seong-ho Cho

    摘要: An integrated bio-chip includes a substrate and one or more excitation light absorbing waveguides disposed in the substrate. The substrate includes one or more reaction regions on which samples are disposed. An end portion of each of the one or more excitation light absorbing waveguides is exposed from the substrate at an upper surface thereof, another end portion of each of the one or more excitation light absorbing waveguides is exposed from the substrate at a lower surface thereof, and the one or more reaction regions are disposed at a upper surface of the substrate. The one or more excitation light absorbing waveguides absorbs excitation light incident to the samples, and transmits fluorescent light emitted from the samples.

    摘要翻译: 集成生物芯片包括衬底和设置在衬底中的一个或多个激发光吸收波导。 底物包括其上设置样品的一个或多个反应区域。 一个或多个激发光吸收波导中的每一个的端部在其上表面从基板露出,所述一个或多个激发光吸收波导中的每一个的另一端部在其下表面从基板露出, 并且一个或多个反应区域设置在基板的上表面。 一个或多个激发光吸收波导吸收入射到样品的激发光,并且透射从样品发射的荧光。

    Optical detecting apparatus for a bio-chip
    8.
    发明授权
    Optical detecting apparatus for a bio-chip 有权
    用于生物芯片的光学检测装置

    公开(公告)号:US08246912B2

    公开(公告)日:2012-08-21

    申请号:US12533560

    申请日:2009-07-31

    申请人: Seong-ho Cho

    发明人: Seong-ho Cho

    CPC分类号: G01N21/6456 G01N21/6428

    摘要: An optical detecting apparatus for a bio-chip, the optical detecting apparatus including: a light source system for illuminating a bio-chip with an excitation light; a fluorescent light detecting system for detecting a fluorescent light emitted by the bio-chip; and a light path altering unit for directing the excitation light emitted by the light source system to a bio-chip and directing the fluorescent light emitted by the bio-chip to the fluorescent light detecting system, wherein a cross-sectional area of the excitation light irradiated by the light source system onto the bio-chip is greater than an area of the bio-chip, and the fluorescent light detecting system detects a fluorescent image of the entire bio-chip with a single illumination of excitation light.

    摘要翻译: 一种用于生物芯片的光学检测装置,所述光学检测装置包括:用激发光照射生物芯片的光源系统; 荧光检测系统,用于检测由生物芯片发射的荧光; 以及光路改变单元,用于将由光源系统发射的激发光引导到生物芯片并将生物芯片发射的荧光指向荧光检测系统,其中激发光的横截面积 由光源系统照射在生物芯片上的面积大于生物芯片的面积,并且荧光检测系统利用激发光的单次照明来检测整个生物芯片的荧光图像。

    CMOS IMAGE SENSORS INCLUDING BACKSIDE ILLUMINATION STRUCTURE AND METHOD OF MANUFACTURING IMAGE SENSOR
    9.
    发明申请
    CMOS IMAGE SENSORS INCLUDING BACKSIDE ILLUMINATION STRUCTURE AND METHOD OF MANUFACTURING IMAGE SENSOR 有权
    CMOS图像传感器,包括背光照明结构和制造图像传感器的方法

    公开(公告)号:US20120187463A1

    公开(公告)日:2012-07-26

    申请号:US13438340

    申请日:2012-04-03

    IPC分类号: H01L27/146

    摘要: An image sensor having a backside illumination structure can include a photo diode unit in a first wafer, where the photo diode unit includes photo diodes and transfer gate transistors coupled to respective ones of the photo diodes. A wiring line unit can be included on a second wafer that is bonded to the photo diode unit, where the wiring line unit includes wiring lines and transistors configured to process signals provided by the photo diode unit and configured to control the photo diode unit. A supporting substrate is bonded to the wiring line unit and a filter unit is located under the first wafer.

    摘要翻译: 具有背面照明结构的图像传感器可以包括第一晶片中的光电二极管单元,其中光电二极管单元包括耦合到相应的光电二极管的光电二极管和传输栅极晶体管。 布线线单元可以包括在结合到光电二极管单元的第二晶片上,其中布线单元包括布线和晶体管,其被配置为处理由光电二极管单元提供并被配置为控制光电二极管单元的信号。 支撑基板被接合到布线单元,并且滤波单元位于第一晶片下方。

    CMOS image sensors including backside illumination structure
    10.
    发明授权
    CMOS image sensors including backside illumination structure 有权
    CMOS图像传感器包括背面照明结构

    公开(公告)号:US08164126B2

    公开(公告)日:2012-04-24

    申请号:US12037691

    申请日:2008-02-26

    IPC分类号: H01L31/062

    摘要: An image sensor having a backside illumination structure can include a photo diode unit in a first wafer, where the photo diode unit includes photo diodes and transfer gate transistors coupled to respective ones of the photo diodes. A wiring line unit can be included on a second wafer that is bonded to the photo diode unit, where the wiring line unit includes wiring lines and transistors configured to process signals provided by the photo diode unit and configured to control the photo diode unit. A supporting substrate is bonded to the wiring line unit and a filter unit is located under the first wafer.

    摘要翻译: 具有背面照明结构的图像传感器可以包括第一晶片中的光电二极管单元,其中光电二极管单元包括耦合到相应的光电二极管的光电二极管和传输栅极晶体管。 布线线单元可以包括在结合到光电二极管单元的第二晶片上,其中布线单元包括布线和晶体管,其被配置为处理由光电二极管单元提供并被配置为控制光电二极管单元的信号。 支撑基板被接合到布线单元,并且滤波单元位于第一晶片下方。