公开(公告)号：US08779562B2

公开(公告)日：2014-07-15

申请号：US13071228

申请日：2011-03-24

申请人： SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

发明人： SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L25/10

CPC分类号： H01L23/3128 ,  H01L23/552 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供底部基板; 将第一集成电路管芯附接到底部基板; 形成中间层，包括：形成中间基板; 在中间基板上形成屏蔽; 以及将膜线胶粘剂施加到所述护罩上; 以及用所述线内胶粘剂将所述插入件附接到所述第一集成电路模具。

公开(公告)号：US20120241921A1

公开(公告)日：2012-09-27

申请号：US13071228

申请日：2011-03-24

申请人： SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

发明人： SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

IPC分类号： H01L23/488 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L23/552 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供底部基板; 将第一集成电路管芯附接到底部基板; 形成中间层，包括：形成中间基板; 在中间基板上形成屏蔽; 以及将膜线胶粘剂施加到所述护罩上; 以及用所述线内胶粘剂将所述插入件附接到所述第一集成电路模具。

公开(公告)号：US08130512B2

公开(公告)日：2012-03-06

申请号：US12273541

申请日：2008-11-18

申请人： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

发明人： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

IPC分类号： H01R9/00

CPC分类号： H05K1/144 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供其上具有互连的电路板; 在电路板上安装第一设备偏移; 以及在所述第一装置上施加第一厚度的第一密封剂，所述第一密封剂的第二厚度比所述电路板的剩余部分薄于所述第一厚度，所述第一厚度在所述第一装置上暴露，或者在第二装置上具有第三厚度的第二密封剂 在电路板的相对表面上，并且与第一器件不同地偏移。

公开(公告)号：US20070194423A1

公开(公告)日：2007-08-23

申请号：US11307722

申请日：2006-02-17

申请人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

发明人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/01005 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

摘要翻译： 提供一种堆叠式集成电路封装封装系统，其形成第一集成电路间隔件封装，其包括设置在其中的凹部的模具化合物，其中第一集成电路间隔件封装在基板上的集成电路管芯上，凹部位于其间， 以及附接从所述凹部延伸并连接在所述集成电路管芯和所述衬底之间的第一电互连。

公开(公告)号：US08124451B2

公开(公告)日：2012-02-28

申请号：US11859359

申请日：2007-09-21

申请人： Sungmin Song ,  SeongMin Lee ,  WonJun Ko

发明人： Sungmin Song ,  SeongMin Lee ,  WonJun Ko

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3185 ,  H01L21/565 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3511 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.

摘要翻译： 一种集成电路封装系统，包括：制造具有进入开口的插入器阵列; 制造基底包装基片; 将第一集成电路管芯安装在所述基底封装基板上; 将所述插入器阵列安装在所述第一集成电路管芯上; 以及通过大致穿过所述中心切割所述通路开口，从所述基底封装基板和所述插入器阵列分割基底封装。

公开(公告)号：US20090079091A1

公开(公告)日：2009-03-26

申请号：US11859359

申请日：2007-09-21

申请人： Sungmin Song ,  SeongMin Lee ,  WonJun Ko

发明人： Sungmin Song ,  SeongMin Lee ,  WonJun Ko

IPC分类号： H01L23/488 ,  H01L21/56

CPC分类号： H01L23/3185 ,  H01L21/565 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3511 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.

摘要翻译： 一种集成电路封装系统，包括：制造具有入口的插入器阵列; 制造基底包装基片; 将第一集成电路管芯安装在所述基底封装基板上; 将所述插入器阵列安装在所述第一集成电路管芯上; 以及通过大致穿过所述中心切割所述通路开口，从所述基底封装基板和所述插入器阵列分割基底封装。

公开(公告)号：US07298037B2

公开(公告)日：2007-11-20

申请号：US11307722

申请日：2006-02-17

申请人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

发明人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/01005 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

摘要翻译： 提供一种堆叠式集成电路封装封装系统，其形成第一集成电路间隔件封装，其包括设置在其中的凹部的模具化合物，其中第一集成电路间隔件封装在基板上的集成电路管芯上，凹部位于其间， 以及附接从所述凹部延伸并连接在所述集成电路管芯和所述衬底之间的第一电互连。

公开(公告)号：US07482203B2

公开(公告)日：2009-01-27

申请号：US12005499

申请日：2007-12-26

申请人： Sungmin Song ,  Choong Bin Yim ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

发明人： Sungmin Song ,  Choong Bin Yim ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

摘要翻译： 提供了一种堆叠式集成电路封装封装系统，其形成具有第一集成电路封装的第一器件，其包括在其上形成具有第一集成电路的第一衬底，电连接第一集成电路和第一集成电路的顶侧之间的第一电互连 第一基板，封装第一顶部模制化合物以覆盖第一电气互连和第一基板的顶侧的一部分，并且封装第一底部模制化合物以覆盖第一集成电路，底侧覆盖第一基板，并且堆叠 第二装置，具有第二集成电路封装，在第一装置下方具有第二装置的第二顶部模制化合物，其在第一装置和第二装置之间提供空间，其中第二装置包括第二顶部模塑料和第二装置 底部模塑料与第一装置类似。

公开(公告)号：US07312519B2

公开(公告)日：2007-12-25

申请号：US11331564

申请日：2006-01-12

申请人： Sungmin Song ,  Choong Bin Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

发明人： Sungmin Song ,  Choong Bin Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

公开(公告)号：US20070158810A1

公开(公告)日：2007-07-12

申请号：US11331564

申请日：2006-01-12

申请人： Sungmin Song ,  Choong Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

发明人： Sungmin Song ,  Choong Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

摘要翻译： 提供了一种堆叠式集成电路封装封装系统，其形成具有第一集成电路封装的第一器件，其包括在其上形成具有第一集成电路的第一衬底，电连接第一集成电路与第一集成电路的顶侧之间的第一电互连 第一基板，封装第一顶部模制化合物以覆盖第一电气互连和第一基板的顶侧的一部分，并且封装第一底部模制化合物以覆盖第一集成电路，底侧覆盖第一基板，并且堆叠 第二装置，具有第二集成电路封装，在第一装置下方具有第二装置的第二顶部模制化合物，其在第一装置和第二装置之间提供空间，其中第二装置包括第二顶部模塑料和第二装置 底部模塑料与第一装置类似。