公开(公告)号：US08907585B2

公开(公告)日：2014-12-09

申请号：US13241338

申请日：2011-09-23

申请人： Seung-Wan Kim ,  Won-Sik Oh ,  Young-Sup Kwon ,  Hwan-Woong Lee

发明人： Seung-Wan Kim ,  Won-Sik Oh ,  Young-Sup Kwon ,  Hwan-Woong Lee

IPC分类号： H05B37/02 ,  H05B33/08

CPC分类号： H05B33/0815 ,  H05B33/0842

摘要： A method of driving a light source includes receiving an alternating current (“AC”) voltage from outside, generating a first direct current (“DC”) voltage based on the AC voltage, generating a second DC voltage, corresponding to a difference between a driving voltage of a light source part and the first DC voltage, based on the first DC voltage, and outputting a sum of the first DC voltage and the second DC voltage to the light source part.

摘要翻译： 驱动光源的方法包括从外部接收交流（“AC”）电压，基于交流电压产生第一直流电压（“DC”），产生与第一直流电压 基于第一直流电压对光源部的驱动电压和第一直流电压进行输出，并将第一直流电压和第二直流电压之和输出到光源部。

公开(公告)号：US08704972B2

公开(公告)日：2014-04-22

申请号：US13181555

申请日：2011-07-13

申请人： Jin-Won Jang ,  Moon-Shik Kang ,  Young-Sup Kwon ,  Min-Soo Choi ,  Seung-Wan Kim

发明人： Jin-Won Jang ,  Moon-Shik Kang ,  Young-Sup Kwon ,  Min-Soo Choi ,  Seung-Wan Kim

IPC分类号： G02F1/1335

CPC分类号： H01R12/721 ,  G02F1/133603 ,  G02F2001/133612 ,  H01R12/737 ,  H01R13/74 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/10189

摘要： A connector for a light source module includes a body portion and a terminal portion. The body portion includes a first opening portion and a second opening portion. The first opening portion receives a portion of the light source module. The second opening portion receives a portion of a light source driver which drives the light source module. The terminal portion includes a first terminal and a second terminal. The first terminal is in the first opening portion of the body portion. The second terminal is connected to the first terminal. The second terminal is in the second opening portion of the body portion.

摘要翻译： 用于光源模块的连接器包括主体部分和端子部分。 主体部分包括第一开口部分和第二开口部分。 第一开口部分接收光源模块的一部分。 第二开口部分接收驱动光源模块的光源驱动器的一部分。 端子部分包括第一端子和第二端子。 第一端子位于主体部分的第一开口部分中。 第二终端连接到第一终端。 第二端子位于主体部分的第二开口部分中。

公开(公告)号：US08564211B2

公开(公告)日：2013-10-22

申请号：US12959247

申请日：2010-12-02

申请人： Seung-Wan Kim ,  Won-Sik Oh ,  Ja-Min Koo

发明人： Seung-Wan Kim ,  Won-Sik Oh ,  Ja-Min Koo

IPC分类号： H05B37/00

CPC分类号： H05B33/0887 ,  Y02B20/341

摘要： A light source apparatus includes a light source disposed adjacent to a side portion of a light guide plate and a light source driver driving the light source. The light source driver includes a booster and a protecting circuit. The booster boosts an input voltage to a driving voltage for driving the light source. The protecting circuit selectively cuts off the input voltage applied to the booster according to an output current of the booster, reducing the risk of damage to the driver due to shorts, overcurrents, or the like.

摘要翻译： 光源装置包括与导光板的侧部相邻设置的光源和驱动光源的光源驱动器。 光源驱动器包括升压器和保护电路。 升压器将输入电压升压至用于驱动光源的驱动电压。 保护电路根据增压器的输出电流选择性地切断施加到升压器的输入电压，从而减少由于短路，过电流等而对驾驶员造成损坏的风险。

公开(公告)号：US20100271792A1

公开(公告)日：2010-10-28

申请号：US12612158

申请日：2009-11-04

申请人： Jin-Won Choi ,  Soon-Jin Cho ,  Hueng-Jae Oh ,  Seung-Wan Kim ,  Seon-Jae Mun

发明人： Jin-Won Choi ,  Soon-Jin Cho ,  Hueng-Jae Oh ,  Seung-Wan Kim ,  Seon-Jae Mun

IPC分类号： H05K7/02 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B23K2101/42 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0989 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.

摘要翻译： 公开了一种电子部件封装及其制造方法。 该方法可以包括：提供一个板，其上形成多个焊盘; 形成阻焊层，其中在所述板上形成叠加在所有焊盘上的开口; 分别在焊盘上形成金属柱; 通过将电极粘合到金属柱上来将电子部件安装在电路板上; 并且在开口中形成底部填充树脂层，使得底部填充树脂层插入在电子部件和板之间。 阻焊层可以用作防止底部填充树脂层在随后的底部填充过程中在侧向泄漏的坝，从而可以省略形成单独的坝所需的附加过程，例如分配等， 并且可以减少处理时间和成本。

公开(公告)号：US20100270067A1

公开(公告)日：2010-10-28

申请号：US12611558

申请日：2009-11-03

申请人： Jin-Won CHOI ,  Tae-Joon Chung ,  Dong-Gyu Lee ,  Seok-Hwan Ahn ,  Seung-Wan Kim

发明人： Jin-Won CHOI ,  Tae-Joon Chung ,  Dong-Gyu Lee ,  Seok-Hwan Ahn ,  Seung-Wan Kim

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/243 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13022 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/245 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  Y10T29/49155 ,  H01L2224/05552

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 根据本发明的一个实施方案，该方法包括提供一种其上形成有垫的衬底，在衬底上形成抗蚀剂，其中抗蚀剂具有形成在其中的开口，使得衬垫暴露，在其内形成金属柱 所述开口使得所述金属柱电连接到所述焊盘，通过去除所述抗蚀剂的一部分使得所述通孔围绕所述金属柱而在所述抗蚀剂中形成通孔，并且在所述通孔内部形成焊料层 并且在金属柱的上表面上，以覆盖金属柱的暴露表面。

公开(公告)号：US20110012261A1

公开(公告)日：2011-01-20

申请号：US12923453

申请日：2010-09-22

申请人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

发明人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

IPC分类号： H01L23/48

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.

摘要翻译： 在用于电连接到外部装置的基板的电极焊盘上形成的凸块，所述柱凸起包括形成在所述电极焊盘上的金属柱; 以及形成在所述金属柱上并形成为圆顶的焊料，所述圆顶占据由沿所述金属柱的轴向方向从所述金属柱的周边延伸的假想线限定的空间。

公开(公告)号：US20090184420A1

公开(公告)日：2009-07-23

申请号：US12213466

申请日：2008-06-19

申请人： Jin-Won Choi ,  Chang-Sup Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

发明人： Jin-Won Choi ,  Chang-Sup Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

IPC分类号： H01L23/488 ,  H01L21/44 ,  H05K3/00 ,  H05K1/00

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A post bump and a method of forming the post bump are disclosed. The method of forming the post bump can include: forming a resist layer, in which an aperture is formed in correspondence to a position of an electrode pad, over a substrate, on which the electrode pad is formed; forming a metal post by filling a part of the aperture with a metallic material; filling a remaining part of the aperture with solder; reflowing the solder by applying heat; and removing the resist layer. This method can be utilized to prevent deviations in the plated solder and prevent the unnecessary flowing of the solder over the sides of the metal post during reflowing, so that the amount of solder used can be minimized.

摘要翻译： 公开了一种后凸块和形成凸块的方法。 形成后凸块的方法可以包括：在其上形成有电极焊盘的基板上形成抗蚀剂层，其中形成有孔对应于电极焊盘的位置; 通过用金属材料填充孔的一部分来形成金属柱; 用焊料填充孔的剩余部分; 通过加热回流焊料; 并除去抗蚀剂层。 该方法可以用于防止电镀焊料中的偏差，并且防止在回流期间焊料在金属柱的侧面上不必要的流动，使得可以使所使用的焊料的量最小化。