公开(公告)号：US5121268A

公开(公告)日：1992-06-09

申请号：US557610

申请日：1990-07-24

申请人： Shigeru Nakayama ,  Makoto Tani

发明人： Shigeru Nakayama ,  Makoto Tani

IPC分类号： G11B15/68 ,  G11B15/17 ,  G11B15/675 ,  G11B33/02

CPC分类号： G11B33/027 ,  G11B15/17 ,  G11B15/67549

摘要： An apparatus for recording and/or providing with a lid for protecting the recording medium and a recording medium loading/ejecting mechanism that includes a housing, an inlet provided on a wall of the housing, a cassette which is loaded in and ejected from the housing through the inlet. The lid member is capable of being opened and closed and covers the inlet when it is closed. The apparatus includes a mechanism for loading the cassette inserted in the inlet to a loading position and ejecting the cassette from the loaded position to an ejection position. A detector detects whether the lid member is opened or closed. In addition, there is a controller for controlling the mechanism. The controller includes a loading controller for controlling the mechanism when the cassette is inserted in the inlet and is loaded in the loaded position. There is an ejecting controller for controlling the mechanism so that the cassette loaded in the loaded position is ejected to the ejection position when the detection system detects that the lid member is opened after detecting that the lid member has been closed.

摘要翻译： 一种用于记录和/或提供具有用于保护记录介质的盖的装置和包括壳体的记录介质装载/排出机构，设置在壳体的壁上的入口，装在壳体中并从壳体中弹出的盒 通过入口。 盖构件能够被打开和关闭，并且在关闭时覆盖入口。 该装置包括用于将插入到入口中的盒装载到装载位置并将盒从装载位置弹出到排出位置的机构。 检测器检测盖构件是否打开或关闭。 另外还有一个用于控制机构的控制器。 该控制器包括一个装载控制器，用于当盒式磁带插入入口并控制装载位置时控制机构。 存在用于控制机构的排出控制器，使得当检测到盖构件已经关闭时检测系统检测到盖构件被打开时，装载在装载位置的盒被弹出到排出位置。

公开(公告)号：US06529374B2

公开(公告)日：2003-03-04

申请号：US09794897

申请日：2001-02-26

申请人： Norio Yamashita ,  Makoto Tani ,  Frank J. McNeal ,  Douglas R. Philips ,  Ron Holder

发明人： Norio Yamashita ,  Makoto Tani ,  Frank J. McNeal ,  Douglas R. Philips ,  Ron Holder

IPC分类号： H05K720

CPC分类号： H05K7/20145

摘要： An electronic apparatus of the present invention has an electric fan in a casing. This electric fan generates air current between circuit substrates. The air current passes through the left-side gaps between the circuit substrates, and reaches the backside face of the electronic apparatus. The air current then passes through a power source substrate attached to a backside panel, and moves to the right. The air current then moves along the right-side inner surface and returns to the front side. The returned air is guided by a plurality of inner fins and then supplied to the electric fan. The heat generated in the casing is cooled by the air current circulating in the casing, and then conducted to the entire inner wall of the casing. The heat of the casing is then released into the atmospheric air through radiation fins arranged on the front face of the casing, the left and right side faces of the casing, and the front face of an open-close cover.

公开(公告)号：USD325905S

公开(公告)日：1992-05-05

申请号：US609459

申请日：1990-11-05

申请人： Makoto Tani

设计人： Makoto Tani

公开(公告)号：US08536766B2

公开(公告)日：2013-09-17

申请号：US13069566

申请日：2011-03-23

申请人： Masayuki Uetani ,  Makoto Tani

发明人： Masayuki Uetani ,  Makoto Tani

IPC分类号： H01L41/08 ,  H01L41/083

CPC分类号： H01L41/083 ,  H01L41/313

摘要： A device using a piezoelectric element includes a layered piezoelectric element and a driven member. The layered piezoelectric element includes an active portion formed of stacked piezoelectric layers each being sandwiched between a first internal electrode layer and a second internal electrode layer, and an inactive portion (first end inactive portion) formed of a first end piezoelectric layer stacked on the active portion. The driven member is bonded to the top surface of the first end piezoelectric layer by means of an adhesive. The piezoelectric layers and the first end piezoelectric layer are formed such that the porosity of the inactive portion is greater than that of the active portion. Therefore, since numerous open pores are emerged on the top surface of the first end piezoelectric layer, the adhesive enters into the open pores to have the driven member be strongly bonded to the top surface.

摘要翻译： 使用压电元件的器件包括分层压电元件和从动元件。 层叠型压电元件包括​​由堆叠在第一内部电极层和第二内部电极层之间的堆叠的压电层形成的有源部分和由堆叠在活性物质上的第一端部压电层形成的非活性部分（第一末端非活性部分） 一部分。 被驱动构件通过粘合剂结合到第一端压电层的顶表面。 压电层和第一端压电层形成为使得非活性部分的孔隙率大于活性部分的孔隙率。 因此，由于在第一端压电体层的顶表面上出现许多开放的孔，所以粘合剂进入开孔，以使被驱动构件牢固地结合到顶表面。

公开(公告)号：US08308262B2

公开(公告)日：2012-11-13

申请号：US12574339

申请日：2009-10-06

申请人： Minoru Yoshida ,  Hiroshi Hashidume ,  Makoto Tani ,  Osamu Takagi ,  Takahisa Hirano

发明人： Minoru Yoshida ,  Hiroshi Hashidume ,  Makoto Tani ,  Osamu Takagi ,  Takahisa Hirano

IPC分类号： B41J29/38 ,  B41J2/01 ,  B41J11/00 ,  B41J15/10

CPC分类号： B41J29/393 ,  B41J11/0015 ,  B41J11/008

摘要： An image forming apparatus includes an image forming portion to form an image on a sheet using an erasable ink, a sheet supply tray to load the sheet on which the image was formed using the erasable ink, a mark detecting portion to detect a mark indicating that the image formed on the sheet conveyed from the sheet supply tray includes a confidential information, and an overwriting portion to overwrite so as not to make recognizable the image of at least an area including the confidential information out of the image formed on the sheet, in case that the mark is detected by the mark detecting portion.

摘要翻译： 图像形成装置包括使用可擦除墨水在片材上形成图像的图像形成部分，使用可擦除墨水对其上形成有图像的片材进行加载的片材供给托盘;标记检测部分，用于检测指示 形成在从供纸托盘输送的纸张上的图像包括机密信息和覆盖部分，以覆盖以至于不能将形成在纸张上的图像中的至少包括机密信息的区域的图像识别为 标记被标记检测部分检测到的情况。

公开(公告)号：US20070220724A1

公开(公告)日：2007-09-27

申请号：US11725289

申请日：2007-03-19

申请人： Takao Ohnishi ,  Makoto Tani ,  Takashi Wada ,  Takaaki Koizumi

发明人： Takao Ohnishi ,  Makoto Tani ,  Takashi Wada ,  Takaaki Koizumi

IPC分类号： H04R17/00 ,  C23C22/00

CPC分类号： H04R17/00 ,  H01L41/1873 ,  H01L41/1878 ,  H01L41/319 ,  Y10T29/42

摘要： A method is provided for manufacturing a piezoelectric/electrostrictive element that includes a piezoelectric/electrostrictive body containing an alkali metal or alkaline-earth metal and that exhibits stable electrical characteristics without variation. The method includes the step of firing the piezoelectric/electrostrictive body and the step of washing a piezoelectric/electrostrictive element including the piezoelectric/electrostrictive body with an acidic solution or pure water. The step of washing is performed at least once after the step of firing.

摘要翻译： 提供一种用于制造压电/电致伸缩元件的方法，该压电/电致伸缩元件包括含有碱金属或碱土金属的压电/电致伸缩体，并且具有稳定的电气特性而不变化。 该方法包括烧制压电/电致伸缩体的步骤和用酸性溶液或纯水清洗包括压电/电致伸缩体的压电/电致伸缩元件的步骤。 在烧制步骤后至少进行一次洗涤步骤。

公开(公告)号：US5345427A

公开(公告)日：1994-09-06

申请号：US37457

申请日：1993-03-26

申请人： Yoshihiko Ishida ,  Yuji Asai ,  Makoto Tani

发明人： Yoshihiko Ishida ,  Yuji Asai ,  Makoto Tani

IPC分类号： G01N29/24 ,  B06B1/06 ,  G01S7/521 ,  H01L41/08 ,  H01L41/18 ,  H04R17/00

CPC分类号： B06B1/0644

摘要： A phase-insensitive ultrasonic transducer has a zinc oxide single crystal as a piezoelectric semiconducting acoustoelectric element, providing high sensitivity and operable over a range of wavelengths of the ultrasonic waves. The electrical conductivity of said zinc oxide single crystal may be selected in the range 10.sup.-8 to 10.sup.-2 .OMEGA..sup.-1.cm.sup.-1. The single crystal can have an attenuation rate for ultrasonic waves of 10 MHz of at least 0.8 cm.sup.-1.

摘要翻译： 相位不敏感的超声换能器具有氧化锌单晶作为压电半导体声电元件，提供高灵敏度并且可在超声波的波长范围内操作。 所述氧化锌单晶的电导率可以在10-8至10-2欧米加-1.cm-1的范围内选择。 单晶可以具有至少0.8cm -1的10MHz的超声波的衰减率。

公开(公告)号：US08487439B2

公开(公告)日：2013-07-16

申请号：US13237259

申请日：2011-09-20

申请人： Makoto Tani ,  Takami Hirai ,  Shinsuke Yano ,  Tsutomu Nanataki

发明人： Makoto Tani ,  Takami Hirai ,  Shinsuke Yano ,  Tsutomu Nanataki

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L23/49822 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4629 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09672 ,  H01L2924/00

摘要： A circuit board that can decrease thermal stress acting between a semiconductor element and a board in association with temperature alteration and has high mechanical strength (rigidity) as a whole board (including a multilayer wiring layer) is provided. Ceramic base material having a coefficient of thermal expansion close to that of a semiconductor element and inner layer wiring are integrally sintered, and the circuit board is configured so that fine-lined conductor structure corresponding to a multilayer wiring layer in the inner layer wiring has predetermined width, intralayer interval and interlayer interval. Thereby, thermal stress acting between a semiconductor element and the board when the board is exposed to temperature alteration in a condition where it is joined with the semiconductor element is suppressed, rigidity of the board is maintained, and its reliability against temperature cycle is increased.

摘要翻译： 提供了可以降低与温度变化相关联地在半导体元件和板之间作用的热应力并且具有作为整个板（包括多层布线层）的高机械强度（刚性）的电路板。 具有与半导体元件和内层布线接近的热膨胀系数的陶瓷基材一体烧结，并且电路板被构造成使得与内层布线中的多层布线层相对应的细线导体结构具有预定的 宽度，内膜间隔和层间间隔。 因此，抑制了在与半导体元件接合的状态下板暴露于温度变化时半导体元件与基板之间的热应力，保持板的刚性，并且提高其对温度循环的可靠性。

公开(公告)号：US08421215B2

公开(公告)日：2013-04-16

申请号：US13331253

申请日：2011-12-20

申请人： Makoto Tani ,  Takami Hirai ,  Shinsuke Yano ,  Daishi Tanabe

发明人： Makoto Tani ,  Takami Hirai ,  Shinsuke Yano ,  Daishi Tanabe

IPC分类号： H01L23/12 ,  H01L23/053 ,  H01L23/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/00

CPC分类号： H05K3/4629 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5283 ,  H01L2924/0002 ,  H05K1/0242 ,  H05K3/4623 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09827 ,  H01L2924/00

摘要： In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined, such that the shape of the cross-section surface of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section surfaces, and the interval (b) between the lower bases of the trapezoidal cross-section surfaces of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation. This provides a laminated ceramic circuit board with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity in a downsized and short-in-height (thin) semiconductor package.

摘要翻译： 在根据本发明的层压和烧结陶瓷电路板中，面内导体的至少一部分被精细地排列，使得细衬面内导体的横截面的形状是梯形，并且高度 （a）中，梯形截面的下基部的长度（c）和上基部的长度（d）以及梯形截面的梯形截面的下基座之间的间隔（b） 在与板的主表面平行的平面中相邻的面内导体满足一定关系。 这提供了在小型化和短路（薄）半导体封装中具有低开路故障率，短路故障率和高温和高湿度的高可靠性的层压陶瓷电路板。

公开(公告)号：US07148609B2

公开(公告)日：2006-12-12

申请号：US10842250

申请日：2004-05-10

申请人： Seiji Ishikawa ,  Makoto Tani ,  Shigeki Hayashi

发明人： Seiji Ishikawa ,  Makoto Tani ,  Shigeki Hayashi

IPC分类号： H01L41/08

CPC分类号： H01L24/85 ,  B23K20/004 ,  G01C19/56 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： An object of the present invention is to provide a novel structure of supporting a vibrator having a terminal for electrical connection so that the vibrator can be miniaturized, and the driving impedance can be made constant in a wide temperature range to reduce the temperature drift. The structure has a substrate and bonding wires 45, 46 supported on the surface of the substrate and to be connected with the vibrator. The vibrator is supported with the bonding wire so that the vibrator is not directly contacted with the substrate. The bonding wire is electrically connected with the terminal. The resonance frequency “fr” of the supporting structure, the driving frequency “fd” for the vibrator and the detuning “Δf” satisfy the following formula 1.1·Δf≦fr≦0.9·fd.

摘要翻译： 本发明的目的是提供一种支撑具有用于电连接的端子的振动器的新型结构，使得振动器可以小型化，并且可以在宽的温度范围内使驱动阻抗恒定以减小温度漂移。 该结构具有基板和支撑在基板的表面上并与振动器连接的接合线45,46。 振动器由接合线支撑，使得振动器不直接与衬底接触。 接合线与端子电连接。 支撑结构的谐振频率“fr”，振动器的驱动频率“fd”和失谐“Deltaf”满足下列公式：<？in-line-formula description =“In-line Formulas”end =“lead” ？> 1.1.Deltaf <= FR <= 0.9.fd。 <？in-line-formula description =“In-line Formulas”end =“tail”？>