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1.发明授权Printed wiring board having through-holes covered with ink layer and method of manufacture thereof 失效具有用油墨层覆盖的通孔的印刷电路板及其制造方法
公开(公告)号：US5266748A
公开(公告)日：1993-11-30
申请号：US670320
申请日：1991-03-15
CPC分类号： H05K3/0094 , H05K1/0218 , H05K3/3452 , H01L2924/15151 , H05K1/0266 , H05K2201/0715 , H05K2201/09072 , H05K2201/09936 , H05K2203/0577 , H05K2203/1394 , H05K3/42 , H05K3/4644
摘要： A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. The ink layer may be formed simultaneously with the printing of symbols of electronic parts to be mounted on the printed wiring board.
摘要翻译： 印刷布线板包括具有设置在基板的至少一侧上的导电图案的基板。 在基板上形成导电孔。 阻焊膜和电磁屏蔽层底涂层中的至少一个设置在导电图案之上，但不覆盖导电通孔。 在导电通孔的至少一端形成油墨层。 本发明实施的制造印刷电路板的方法包括提供具有导电通孔的基板。 在衬底的至少一侧上形成导电图案。 在导电图案上形成阻焊膜和电磁屏蔽层底涂膜中的至少一个，但不在导电通孔上。 在导电通孔的至少一端形成油墨层。 油墨层可以与印刷要印刷的电路板的电子部件的符号同时形成。
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2.发明授权
公开(公告)号：US5236736A
公开(公告)日：1993-08-17
申请号：US775827
申请日：1991-10-11
CPC分类号： H05K9/0039 , H05K3/4685
摘要： A printed-wiring board shielded from electromagnetic wave radiation is made by forming a conductive circuit pattern on an insulating substrate, disposing a first insulating layer over the circuit pattern, forming a jumper wire over the first insulating layer and between connecting terminals of the conductive pattern, forming a second insulating layer covering the jumper wire and the first insulating layer, and disposing an electromagnetic wave shielding layer over the conductive pattern. The jumper wire is formed by a printing process using a conductive paste containing a conductive metal such as silver, carbon or copper. The shield layer is formed by a printing process using a conductive metal resin paste such as copper. The shield layer is protected by providing an overcoat layer over the shield layer.
摘要翻译： 通过在绝缘基板上形成导电电路图案，在电路图案上设置第一绝缘层，在第一绝缘层上方和导电图案的连接端子之间形成跨接线，制成屏蔽电磁波辐射的印刷电路板 形成覆盖所述跨接线和所述第一绝缘层的第二绝缘层，以及在所述导电图案上设置电磁波屏蔽层。 跳线通过使用含有导电金属如银，碳或铜的导电糊的印刷方法形成。 屏蔽层通过使用诸如铜的导电金属树脂浆料的印刷方法形成。 通过在屏蔽层上设置覆盖层来保护屏蔽层。
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公开(公告)号：US5262596A
公开(公告)日：1993-11-16
申请号：US776633
申请日：1991-10-15
CPC分类号： H05K1/0218 , H05K9/0039 , H05K2201/0715 , H05K3/4644
摘要： A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.
摘要翻译： 屏蔽电磁波辐射的印刷电路板具有形成在绝缘基板上的导电电路图案，设置在电路图案上的第一绝缘层，形成在第一绝缘层上方和导电图案的连接端子之间的跨接线，第二绝缘层 覆盖跨接线和第一绝缘层的绝缘层和设置在导电图案上的电磁波屏蔽层。 跳线通过使用含有诸如银，碳或铜等导电材料的导电膏进行印刷而形成。 屏蔽层通过使用诸如铜的导电金属树脂浆料进行印刷而形成。 将覆盖层施加在屏蔽层上以保护屏蔽层。
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公开(公告)号：US5195238A
公开(公告)日：1993-03-23
申请号：US841196
申请日：1992-02-24
CPC分类号： H05K1/0224 , H05K9/0039 , H05K1/0253 , H05K2201/0715 , H05K2201/09681 , H05K2201/09772 , H05K3/4644 , Y10T29/49155
摘要： A method of manufacturing a printed circuit board comprises the steps of providing an insulating substrate for the printed circuit board, forming circuit patterns made of a conductive material on at least one side of the insulating substrate, forming an insulating layer on the circuit patterns, and adhering a cross-mesh shield layer onto at least a portion of the insulating layer in such a manner that a margin is placed both on the outer periphery of the insulating layer itself and around electric contacts such as lands and through-holes.
摘要翻译： 制造印刷电路板的方法包括以下步骤：提供用于印刷电路板的绝缘基板，在绝缘基板的至少一侧上形成由导电材料制成的电路图案，在电路图案上形成绝缘层;以及 将绝缘层的至少一部分粘附到绝缘层的至少一部分上，使得在绝缘层本身的外周和电触点如焊盘和通孔两者之间设置边缘。
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公开(公告)号：US5112648A
公开(公告)日：1992-05-12
申请号：US682921
申请日：1991-04-09
CPC分类号： H05K9/0039 , H05K1/0218 , H05K1/167 , H05K1/095 , H05K2201/0323 , H05K2201/0715 , H05K2201/09563 , H05K3/4069 , H05K3/4664 , Y10T29/49099
摘要： A method of manufacturing a printed circuit board is disclosed. The method comprises steps of providing a substrate for the printed circuit board, forming circuit patterns on one or both sides of the substrate, and shielding the whole or a required part of the circuit patterns by using a shield layer in such a manner that the shield layer and a grounding circuit of the circuit patterns are connected through a resistor. This method of manufacturing a printed circuit board is improved so that adhesion between the shield layer and the junction land of the grounding circuit is enhanced by the joining of the shield layer to the junction land of the grounding circuit through the resistor, and that the noise preventive action of the shield layer is improved by the attenuating of electromagnetic-wave energy received by the shield layer which is to be discharged as electrical current to the grounding circuit. For example, such improvement is made by using a resistor having a resistance value higher than that of said shield layer and/or made of a conductive material mainly composed of carbon or copper or both.
摘要翻译： 公开了一种制造印刷电路板的方法。 该方法包括以下步骤：提供用于印刷电路板的基板，在基板的一侧或两侧上形成电路图案，并通过使用屏蔽层屏蔽整个或所需部分的电路图案，使得屏蔽 层和电路图案的接地电路通过电阻连接。 这种制造印刷电路板的方法得到改善，使得屏蔽层与接地电路的接合区之间的粘附通过电阻器将接地电路与接地电路的接合面接合而增强，噪声 通过将要作为电流放电的屏蔽层接收的电磁波能量衰减到接地电路来改善屏蔽层的预防作用。 例如，通过使用电阻值高于所述屏蔽层的电阻值和/或由主要由碳或铜或二者构成的导电材料制成的电阻器进行这种改进。
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公开(公告)号：US4900602A
公开(公告)日：1990-02-13
申请号：US192588
申请日：1988-05-09
CPC分类号： H05K1/167 , H01C1/084 , H01C7/003 , H05K1/0209 , H05K1/095 , H05K2201/0323 , H05K2201/035 , H05K2201/09781 , H05K2203/1453 , H05K3/28 , H05K3/4664 , Y10S428/901 , Y10T428/12014 , Y10T428/12181 , Y10T428/239 , Y10T428/24893 , Y10T428/24909 , Y10T428/24917 , Y10T428/256 , Y10T428/2991 , Y10T428/30
摘要： The invention relates to a printed wiring board (7) which includes at least one carbon resistor (3) formed across terminals (2a, 2b) of printed wiring circuit (2). A heat dissipating film layer (4) is formed at least on the carbon resistor (3). Thus, heat produced in the resistor (3) is effectively dissipated.
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公开(公告)号：US5210379A
公开(公告)日：1993-05-11
申请号：US841195
申请日：1992-02-24
CPC分类号： H05K9/0039 , H05K1/0218 , H05K2201/0715 , H05K3/4644 , Y10T29/49139
摘要： A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.
摘要翻译： 印刷电路板具有电磁波屏蔽层。 印刷电路板包括形成在基板上的印刷电路。 分层的绝缘层形成在印刷电路上。 绝缘层被设置成形成碗形连接区域。 可以在形成电磁波屏蔽层的同时形成端子，以提供电磁屏蔽层和印刷电路之间的连接。 碗形连接区域在例如丝印印刷过程中不会发生发泡或模糊的情况，提供用导体糊料平滑地填充端子。
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8.发明授权Method for connecting an electromagnetic wave shielding layer with a ground circuit in a printed circuit board 失效将电磁波屏蔽层与印刷电路板中的接地电路连接的方法
公开(公告)号：US5196230A
公开(公告)日：1993-03-23
申请号：US657456
申请日：1991-02-19
CPC分类号： H05K1/0218 , H05K9/0039 , H05K2201/0715 , H05K3/4644 , Y10T29/49018
摘要： A method for connecting a ground circuit and an electromagnetic wave shielding layer for a printed wiring circuit in a printed circuit board is disclosed. The method comprising the steps of forming said insulating layer by a plurality of insulating layers and gradually increasing from the printed wiring circuit side to the electromagnetic wave shielding layer side, a diameter of an aperture of the ground circuit of each insulating layer in the process for forming the insulating layer.
摘要翻译： 公开了一种用于连接印刷电路板中印刷布线电路的接地电路和电磁波屏蔽层的方法。 该方法包括以下步骤：通过多个绝缘层形成所述绝缘层，并且从印刷布线电路侧逐渐增加到电磁波屏蔽层侧，在每个绝缘层的接地电路的孔径的直径 形成绝缘层。
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公开(公告)号：US5308644A
公开(公告)日：1994-05-03
申请号：US739708
申请日：1991-08-02
CPC分类号： H05K3/1233 , H05K9/0039 , H05K1/095 , H05K2201/0715 , H05K2203/0126 , H05K3/4644
摘要： The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.
摘要翻译： 制造具有本发明的屏蔽层的印刷电路板的方法的特征在于，在印刷布线板的制造方法中，其中印刷布线电路设置在绝缘板的一侧或两侧以及屏蔽层 通过绝缘层设置在印刷布线电路上，在绝缘层上形成屏蔽层和接地电路，同时在加压下通过掩模从填充喷嘴注入屏蔽涂层。
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公开(公告)号：US5219607A
公开(公告)日：1993-06-15
申请号：US717870
申请日：1991-06-12
CPC分类号： H05K3/4685 , H05K3/245 , H05K1/095 , H05K2201/0373
摘要： A method of manufacturing a printed circuit comprising the following steps: in a connection portion of a printed circuit formed on an insulating substrate, another circuit portion such as a jumper circuit is applied with resin ink; and a connection circuit for the circuit terminal portion of said printed circuit is formed by applying electroconductive ink.
摘要翻译： 一种制造印刷电路的方法，包括以下步骤：在形成在绝缘基板上的印刷电路的连接部分中，使用树脂墨水等其他电路部分，例如跳线电路; 并且通过施加导电油墨形成用于所述印刷电路的电路端子部分的连接电路。
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