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1.发明授权Printed wiring board having through-holes covered with ink layer and method of manufacture thereof 失效具有用油墨层覆盖的通孔的印刷电路板及其制造方法
公开(公告)号：US5266748A
公开(公告)日：1993-11-30
申请号：US670320
申请日：1991-03-15
CPC分类号： H05K3/0094 , H05K1/0218 , H05K3/3452 , H01L2924/15151 , H05K1/0266 , H05K2201/0715 , H05K2201/09072 , H05K2201/09936 , H05K2203/0577 , H05K2203/1394 , H05K3/42 , H05K3/4644
摘要： A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. The ink layer may be formed simultaneously with the printing of symbols of electronic parts to be mounted on the printed wiring board.
摘要翻译： 印刷布线板包括具有设置在基板的至少一侧上的导电图案的基板。 在基板上形成导电孔。 阻焊膜和电磁屏蔽层底涂层中的至少一个设置在导电图案之上，但不覆盖导电通孔。 在导电通孔的至少一端形成油墨层。 本发明实施的制造印刷电路板的方法包括提供具有导电通孔的基板。 在衬底的至少一侧上形成导电图案。 在导电图案上形成阻焊膜和电磁屏蔽层底涂膜中的至少一个，但不在导电通孔上。 在导电通孔的至少一端形成油墨层。 油墨层可以与印刷要印刷的电路板的电子部件的符号同时形成。
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公开(公告)号：US5262596A
公开(公告)日：1993-11-16
申请号：US776633
申请日：1991-10-15
CPC分类号： H05K1/0218 , H05K9/0039 , H05K2201/0715 , H05K3/4644
摘要： A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.
摘要翻译： 屏蔽电磁波辐射的印刷电路板具有形成在绝缘基板上的导电电路图案，设置在电路图案上的第一绝缘层，形成在第一绝缘层上方和导电图案的连接端子之间的跨接线，第二绝缘层 覆盖跨接线和第一绝缘层的绝缘层和设置在导电图案上的电磁波屏蔽层。 跳线通过使用含有诸如银，碳或铜等导电材料的导电膏进行印刷而形成。 屏蔽层通过使用诸如铜的导电金属树脂浆料进行印刷而形成。 将覆盖层施加在屏蔽层上以保护屏蔽层。
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公开(公告)号：US5195238A
公开(公告)日：1993-03-23
申请号：US841196
申请日：1992-02-24
CPC分类号： H05K1/0224 , H05K9/0039 , H05K1/0253 , H05K2201/0715 , H05K2201/09681 , H05K2201/09772 , H05K3/4644 , Y10T29/49155
摘要： A method of manufacturing a printed circuit board comprises the steps of providing an insulating substrate for the printed circuit board, forming circuit patterns made of a conductive material on at least one side of the insulating substrate, forming an insulating layer on the circuit patterns, and adhering a cross-mesh shield layer onto at least a portion of the insulating layer in such a manner that a margin is placed both on the outer periphery of the insulating layer itself and around electric contacts such as lands and through-holes.
摘要翻译： 制造印刷电路板的方法包括以下步骤：提供用于印刷电路板的绝缘基板，在绝缘基板的至少一侧上形成由导电材料制成的电路图案，在电路图案上形成绝缘层;以及 将绝缘层的至少一部分粘附到绝缘层的至少一部分上，使得在绝缘层本身的外周和电触点如焊盘和通孔两者之间设置边缘。
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公开(公告)号：US5112648A
公开(公告)日：1992-05-12
申请号：US682921
申请日：1991-04-09
CPC分类号： H05K9/0039 , H05K1/0218 , H05K1/167 , H05K1/095 , H05K2201/0323 , H05K2201/0715 , H05K2201/09563 , H05K3/4069 , H05K3/4664 , Y10T29/49099
摘要： A method of manufacturing a printed circuit board is disclosed. The method comprises steps of providing a substrate for the printed circuit board, forming circuit patterns on one or both sides of the substrate, and shielding the whole or a required part of the circuit patterns by using a shield layer in such a manner that the shield layer and a grounding circuit of the circuit patterns are connected through a resistor. This method of manufacturing a printed circuit board is improved so that adhesion between the shield layer and the junction land of the grounding circuit is enhanced by the joining of the shield layer to the junction land of the grounding circuit through the resistor, and that the noise preventive action of the shield layer is improved by the attenuating of electromagnetic-wave energy received by the shield layer which is to be discharged as electrical current to the grounding circuit. For example, such improvement is made by using a resistor having a resistance value higher than that of said shield layer and/or made of a conductive material mainly composed of carbon or copper or both.
摘要翻译： 公开了一种制造印刷电路板的方法。 该方法包括以下步骤：提供用于印刷电路板的基板，在基板的一侧或两侧上形成电路图案，并通过使用屏蔽层屏蔽整个或所需部分的电路图案，使得屏蔽 层和电路图案的接地电路通过电阻连接。 这种制造印刷电路板的方法得到改善，使得屏蔽层与接地电路的接合区之间的粘附通过电阻器将接地电路与接地电路的接合面接合而增强，噪声 通过将要作为电流放电的屏蔽层接收的电磁波能量衰减到接地电路来改善屏蔽层的预防作用。 例如，通过使用电阻值高于所述屏蔽层的电阻值和/或由主要由碳或铜或二者构成的导电材料制成的电阻器进行这种改进。
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公开(公告)号：US4900602A
公开(公告)日：1990-02-13
申请号：US192588
申请日：1988-05-09
CPC分类号： H05K1/167 , H01C1/084 , H01C7/003 , H05K1/0209 , H05K1/095 , H05K2201/0323 , H05K2201/035 , H05K2201/09781 , H05K2203/1453 , H05K3/28 , H05K3/4664 , Y10S428/901 , Y10T428/12014 , Y10T428/12181 , Y10T428/239 , Y10T428/24893 , Y10T428/24909 , Y10T428/24917 , Y10T428/256 , Y10T428/2991 , Y10T428/30
摘要： The invention relates to a printed wiring board (7) which includes at least one carbon resistor (3) formed across terminals (2a, 2b) of printed wiring circuit (2). A heat dissipating film layer (4) is formed at least on the carbon resistor (3). Thus, heat produced in the resistor (3) is effectively dissipated.
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6.发明授权Method for connecting an electromagnetic wave shielding layer with a ground circuit in a printed circuit board 失效将电磁波屏蔽层与印刷电路板中的接地电路连接的方法
公开(公告)号：US5196230A
公开(公告)日：1993-03-23
申请号：US657456
申请日：1991-02-19
CPC分类号： H05K1/0218 , H05K9/0039 , H05K2201/0715 , H05K3/4644 , Y10T29/49018
摘要： A method for connecting a ground circuit and an electromagnetic wave shielding layer for a printed wiring circuit in a printed circuit board is disclosed. The method comprising the steps of forming said insulating layer by a plurality of insulating layers and gradually increasing from the printed wiring circuit side to the electromagnetic wave shielding layer side, a diameter of an aperture of the ground circuit of each insulating layer in the process for forming the insulating layer.
摘要翻译： 公开了一种用于连接印刷电路板中印刷布线电路的接地电路和电磁波屏蔽层的方法。 该方法包括以下步骤：通过多个绝缘层形成所述绝缘层，并且从印刷布线电路侧逐渐增加到电磁波屏蔽层侧，在每个绝缘层的接地电路的孔径的直径 形成绝缘层。
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公开(公告)号：US5210379A
公开(公告)日：1993-05-11
申请号：US841195
申请日：1992-02-24
CPC分类号： H05K9/0039 , H05K1/0218 , H05K2201/0715 , H05K3/4644 , Y10T29/49139
摘要： A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.
摘要翻译： 印刷电路板具有电磁波屏蔽层。 印刷电路板包括形成在基板上的印刷电路。 分层的绝缘层形成在印刷电路上。 绝缘层被设置成形成碗形连接区域。 可以在形成电磁波屏蔽层的同时形成端子，以提供电磁屏蔽层和印刷电路之间的连接。 碗形连接区域在例如丝印印刷过程中不会发生发泡或模糊的情况，提供用导体糊料平滑地填充端子。
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公开(公告)号：US5416667A
公开(公告)日：1995-05-16
申请号：US87848
申请日：1993-07-02
CPC分类号： H05K9/0039 , F42B3/18 , H01Q17/00 , H05K1/0269 , H05K1/0218 , H05K2201/0715 , H05K2203/161 , H05K3/28 , Y10T29/49126
摘要： A printed wiring board comprises a substrate, a printed wiring circuit formed on the substrate, and insulating layer formed on the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer, and an overcoat layer provided on the electromagnetic shielding layer. The electromagnetic shielding layer has a first color, and the overcoat layer has a second color different from the first color. The color of the overcoat layer may be any color which is easily visually distinguishable from the color of the electromagnetic wave shielding layer so that visual inspection of the working condition of the overcoat layer is facilitated.
摘要翻译： 印刷布线板包括基板，形成在基板上的印刷布线电路和形成在印刷布线电路上的绝缘层，设置在绝缘层上的电磁波屏蔽层和设置在电磁屏蔽层上的外涂层。 电磁屏蔽层具有第一颜色，并且外涂层具有与第一颜色不同的第二颜色。 外涂层的颜色可以是易于视觉上与电磁波屏蔽层的颜色区分的任何颜色，从而便于对外涂层的工作状态的目视检查。
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公开(公告)号：US5025116A
公开(公告)日：1991-06-18
申请号：US470881
申请日：1990-01-26
摘要： A printed wiring board having electromagnetic wave shielding layer for use in the integrated semiconductor circuit is disclosed. The printed wiring board comprises an insulating sheet, printed wiring circuits and grounded wiring circuit which are provided on one surface of the insulating sheet, an insulating layer provided on the surface of the insulating sheet, the printed wiring circuit and the grounded wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer and having a portion contacted to the ground wiring circuit directly, and an over-coating layer provided on the electromagnetic wave shielding layer and having exposed portions placed over the contacted portion of the shielding layer.
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公开(公告)号：US5240737A
公开(公告)日：1993-08-31
申请号：US734254
申请日：1991-07-22
CPC分类号： H05K3/3452 , H05K1/0266 , H05K2201/0108 , H05K2201/09936 , H05K2203/122 , H05K2203/161 , H05K3/3447 , H05K3/3489
摘要： In a method of manufacturing printed circuit boards by coating a flux preventive film for preventing a flux from rising on a component surface of an insulation board, the method of manufacturing printed circuit boards according to the present invention is characterized in that said method comprises the steps of printing white blank marks, white blank symbols and white blank letters corresponding to symbol marks, other symbols and letters on the component side surface of said insulation board before coating said flux preventive film, and then coating said flux preventive film of a transparent or translucent material on the printed surface.
摘要翻译： 在通过涂布用于防止焊剂在绝缘板的部件表面上升的助熔剂的制造印刷电路板的方法中，根据本发明的印刷电路板的制造方法的特征在于所述方法包括以下步骤 在涂布所述防磁膜之前，在所述绝缘板的组件侧表面上印刷白色空白符号，白色空白符号和对应于符号标记，其他符号和字母的白色空白字母，然后涂覆透明或半透明的防磁膜 印刷表面上的材料。
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