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公开(公告)号：US06667107B2
公开(公告)日：2003-12-23
申请号：US10058919
申请日：2002-01-30
IPC分类号： B32B2730
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R2 represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译： 一种热固性树脂组合物，其包含（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1表示氢，卤素 ，或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数，（2）每分子具有至少2个氰酸酯基的氰酸酯树脂。 提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。
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公开(公告)号：US07078106B2
公开(公告)日：2006-07-18
申请号：US10697116
申请日：2003-10-31
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1–C5 hydrocarbon group; R2 represents a halogen or a C1–C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译： 一种热固性树脂组合物，其包含：（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1， >表示氢，卤素或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数; 和（2）每分子具有至少两个氰酸酯基团的氰酸酯树脂; 用于提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。
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3.发明授权Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate 有权具有优异介电特性的树脂组合物，用于制备树脂组合物的方法，由其制备的清漆，其制备方法，用它们制备的预制物和覆金属层压板公开(公告)号：US07157506B2
公开(公告)日：2007-01-02
申请号：US10221171
申请日：2001-03-21
IPC分类号： C08K9/06
CPC分类号： B32B15/14 , B32B27/18 , B32B2311/12 , C08G73/0655 , C08K5/13 , C08K5/315 , C08K5/5419 , C08L79/04 , C08L83/04 , H05K1/0353 , Y10T428/31663 , C08L2666/02
摘要： A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
摘要翻译： 一种树脂组合物，其包含分子中具有2个以上的氰基的氰酸酯化合物（A） 苯酚化合物（B）; 具有选自由式RSiO 3/2 2表示的三官能硅氧烷单元和由SiO
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4.发明申请Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish 审中-公开介电性能优异的树脂组合物，其制造方法，使用该树脂组合物的清漆，使用该树脂组合物和清漆的预浸料坯和覆金属层压板公开(公告)号：US20070207326A1
公开(公告)日：2007-09-06
申请号：US11647598
申请日：2006-12-29
CPC分类号： B32B15/14 , B32B27/18 , B32B2311/12 , C08G73/0655 , C08K5/13 , C08K5/315 , C08K5/5419 , C08L79/04 , C08L83/04 , H05K1/0353 , Y10T428/31663 , C08L2666/02
摘要： A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
摘要翻译： 一种树脂组合物，其包含分子中具有2个以上的氰基的氰酸酯化合物（A） 苯酚化合物（B）; 具有选自由式RSiO 3/2 2表示的三官能硅氧烷单元和由SiO
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5.发明授权Production of insulating varnishes and multilayer printed circuit boards using these varnishes 失效使用这些清漆生产绝缘清漆和多层印刷电路板公开(公告)号：US06197149B1
公开(公告)日：2001-03-06
申请号：US09057522
申请日：1998-04-09
申请人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
发明人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
IPC分类号： C09J500
CPC分类号： H05K3/4655 , C09D5/00 , H05K1/0373 , H05K3/4652 , H05K2201/0209 , H05K2201/0239 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , Y10T428/24994 , Y10T428/249944 , Y10T428/249946 , Y10T428/249952
摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.
摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。
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6.发明授权
公开(公告)号：US5391687A
公开(公告)日：1995-02-21
申请号：US137229
申请日：1993-10-18
申请人： Katsuji Shibata , Kazuhito Kobayashi , Nozomu Takano , Masami Arai , Ikuo Hoshi
发明人： Katsuji Shibata , Kazuhito Kobayashi , Nozomu Takano , Masami Arai , Ikuo Hoshi
CPC分类号： C08J3/096 , C08G59/066 , C08G59/621 , C08G59/68 , C08J2363/00
摘要： Ultra high molecular weight epoxy resins are produced in a short time by polymerizing a difunctional epoxy resin having two epoxy group per molecule and a dihydric phenol by heating the difunctional epoxy resin and the dihydric phenol which are present in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1, in an amide solvent, in the presence of a polymerization catalyst, and the ultra high molecular weight epoxy resins are linearly polymerized so highly as to have the capability of being formed into films having high strength.
摘要翻译： 通过加热双官能环氧树脂和二元酚，以提供酚羟基比例的量，通过聚合每分子具有两个环氧基的双官能环氧树脂和二元酚来在短时间内生产超高分子量环氧树脂 在酰胺溶剂中，在聚合催化剂的存在下，以1:0.9至1:1.1的环氧基团组合，并且超高分子量环氧树脂被线性聚合，从而具有形成膜的能力 具有高强度。
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7.发明申请PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD 审中-公开PREGREG，带树脂的薄膜，带树脂的金属箔，金属层压板和印刷线路板公开(公告)号：US20110272185A1
公开(公告)日：2011-11-10
申请号：US13145840
申请日：2010-01-28
申请人： Akiko Kawaguchi , Nozomu Takano , Yasuyuki Mizuno , Kazumasa Takeuchi , Shigeru Haeno , Yoshinori Nagai , Masato Fukui
发明人： Akiko Kawaguchi , Nozomu Takano , Yasuyuki Mizuno , Kazumasa Takeuchi , Shigeru Haeno , Yoshinori Nagai , Masato Fukui
IPC分类号： H05K1/03 , B32B27/00 , B32B15/08 , C09D163/00
CPC分类号： H05K1/0326 , C08F220/18 , C08F2220/1808 , C08F2220/1891 , H01L23/145 , H01L2924/0002 , H05K3/427 , Y10T428/31692 , Y10T428/31855 , H01L2924/00
摘要： The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
摘要翻译： 本发明提供了通过用树脂组合物浸渍纤维基材而形成的预浸料，并且该树脂组合物包含丙烯酸树脂，其中由于腈基（PCN）而导致的2240cm -1附近的峰高相对于 固化树脂组合物（PCN / PCO）的红外光谱中由于羰基（PCO）1730cm -1附近的峰高不大于0.001等，以提供预浸料，具有树脂的膜， 具有树脂的金属箔和覆金属层压板，其表现出优异的抗弯曲性，同时还防止离子迁移，并且在制造印刷线路板时具有优异的绝缘可靠性，以及使用该箔的印刷线路板。
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公开(公告)号：US5304399A
公开(公告)日：1994-04-19
申请号：US22271
申请日：1993-02-25
申请人： Katsuji Shibata , Kazuhito Kobayashi , Nozomu Takano , Masami Arai , Ikuo Hoshi
发明人： Katsuji Shibata , Kazuhito Kobayashi , Nozomu Takano , Masami Arai , Ikuo Hoshi
CPC分类号： C08J5/18 , C08G59/066 , C08J7/047 , C08J2363/00 , C08J2463/00 , H05K1/0326 , H05K3/386 , H05K3/4676 , Y10T428/258 , Y10T428/269 , Y10T428/31511
摘要： An epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80.degree. to 130.degree. C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.
摘要翻译： 通过使用基本上线性的高分子量环氧树脂，形成强度为拉伸强度为10MPa以上，伸长率为5％以上的环氧树脂膜，该环氧树脂通过使双官能环氧树脂 在非质子传递极性溶剂中，在溶剂存在下，在80-130℃的反应温度下，分子中具有两个环氧基，二元酚，二官能环氧树脂和二元酚的用量为 提供酚羟基与环氧基的比例为1:0.9至1:1.1，并且它们的总量相对于它们的总量和非质子极性溶剂的比例为至多50重量％。
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9.发明授权Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same 失效粘合剂涂覆的铜箔和覆铜层压板以及印刷电路板均采用相同的方法公开(公告)号：US06558797B1
公开(公告)日：2003-05-06
申请号：US09869050
申请日：2001-06-22
IPC分类号： B32B2738
CPC分类号： H05K3/4655 , C08G59/621 , C08L61/04 , C08L2666/36 , C09J7/28 , C09J163/00 , C09J2463/00 , H05K3/386 , H05K3/4652 , H05K2201/0355 , H05K2201/0358 , H05K2203/124 , Y10S428/901 , Y10T428/24331 , Y10T428/31511 , Y10T428/31529 , Y10T428/31547
摘要： An adhesive-coated copper foil which comprises a copper foil and disposed on one side thereof a layer of an adhesive composition comprising (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as an optional ingredient, and (d) a compound having a triazine ring or isocyanuric ring. The adhesive layer has low hygroscopicity, excellent heat resistance, and satisfactory adhesion to copper foils. By using the adhesive-coated copper foil, a copper-clad laminate and a printed circuit board both having excellent properties can be obtained.
摘要翻译： 一种粘合剂涂覆的铜箔，其包括铜箔，并且在其一侧上设置一层粘合剂组合物，所述粘合剂组合物包含（a）环氧树脂，（b）多官能酚，（c）作为任选成分的固化促进剂和 （d）具有三嗪环或异氰脲酸环的化合物。 粘合剂层具有低吸湿性，优异的耐热性和对铜箔的令人满意的粘合性。 通过使用粘合剂涂覆的铜箔，可以获得具有优异性能的覆铜层压板和印刷电路板。
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公开(公告)号：US5225268A
公开(公告)日：1993-07-06
申请号：US757587
申请日：1991-09-11
申请人： Katsuji Shibata , Kazuhito Kobayashi , Nozomu Takano , Masami Arai , Ikuo Hoshi
发明人： Katsuji Shibata , Kazuhito Kobayashi , Nozomu Takano , Masami Arai , Ikuo Hoshi
CPC分类号： C08J5/18 , C08G59/066 , C08J7/047 , C08J2363/00 , C08J2463/00 , H05K1/0326 , H05K3/386 , H05K3/4676 , Y10T428/258 , Y10T428/269 , Y10T428/31511
摘要： An epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80.degree. to 130.degree. C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.
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