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1.发明授权Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate 有权具有优异介电特性的树脂组合物，用于制备树脂组合物的方法，由其制备的清漆，其制备方法，用它们制备的预制物和覆金属层压板公开(公告)号：US07157506B2
公开(公告)日：2007-01-02
申请号：US10221171
申请日：2001-03-21
IPC分类号： C08K9/06
CPC分类号： B32B15/14 , B32B27/18 , B32B2311/12 , C08G73/0655 , C08K5/13 , C08K5/315 , C08K5/5419 , C08L79/04 , C08L83/04 , H05K1/0353 , Y10T428/31663 , C08L2666/02
摘要： A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
摘要翻译： 一种树脂组合物，其包含分子中具有2个以上的氰基的氰酸酯化合物（A） 苯酚化合物（B）; 具有选自由式RSiO 3/2 2表示的三官能硅氧烷单元和由SiO
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2.发明申请Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish 审中-公开介电性能优异的树脂组合物，其制造方法，使用该树脂组合物的清漆，使用该树脂组合物和清漆的预浸料坯和覆金属层压板公开(公告)号：US20070207326A1
公开(公告)日：2007-09-06
申请号：US11647598
申请日：2006-12-29
CPC分类号： B32B15/14 , B32B27/18 , B32B2311/12 , C08G73/0655 , C08K5/13 , C08K5/315 , C08K5/5419 , C08L79/04 , C08L83/04 , H05K1/0353 , Y10T428/31663 , C08L2666/02
摘要： A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
摘要翻译： 一种树脂组合物，其包含分子中具有2个以上的氰基的氰酸酯化合物（A） 苯酚化合物（B）; 具有选自由式RSiO 3/2 2表示的三官能硅氧烷单元和由SiO
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公开(公告)号：US06667107B2
公开(公告)日：2003-12-23
申请号：US10058919
申请日：2002-01-30
IPC分类号： B32B2730
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R2 represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译： 一种热固性树脂组合物，其包含（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1表示氢，卤素 ，或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数，（2）每分子具有至少2个氰酸酯基的氰酸酯树脂。 提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。
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公开(公告)号：US07078106B2
公开(公告)日：2006-07-18
申请号：US10697116
申请日：2003-10-31
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1–C5 hydrocarbon group; R2 represents a halogen or a C1–C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译： 一种热固性树脂组合物，其包含：（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1， >表示氢，卤素或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数; 和（2）每分子具有至少两个氰酸酯基团的氰酸酯树脂; 用于提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。
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5.发明授权Epoxy resin compositions for printed circuit board and printed circuit board using the same 有权用于印刷电路板的环氧树脂组合物和使用其的印刷电路板公开(公告)号：US06462147B1
公开(公告)日：2002-10-08
申请号：US09274100
申请日：1999-03-23
申请人： Michitoshi Arata , Nozomu Takano , Tomio Fukuda , Kenichi Tomioka
发明人： Michitoshi Arata , Nozomu Takano , Tomio Fukuda , Kenichi Tomioka
IPC分类号： C08F28300
CPC分类号： H05K1/0326 , C08G59/4028 , C08G59/5086 , C08G59/621 , C08L63/00 , Y10S428/901 , Y10T428/31511 , Y10T428/31522 , C08L2666/16 , C08L2666/20
摘要： An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.
摘要翻译： 用于印刷电路板的环氧树脂组合物包括环氧树脂; 多功能酚基; 硬化促进剂; 和具有三嗪或异氰脲酸酯环的化合物和含有少于60重量％的氮但不含脲衍生物的化合物中的至少一种。 包含该环氧树脂组合物的印刷电路板具有低吸水性，优异的耐热性和与铜箔的良好粘合性。
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6.发明申请PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD 审中-公开PREGREG，带树脂的薄膜，带树脂的金属箔，金属层压板和印刷线路板公开(公告)号：US20110272185A1
公开(公告)日：2011-11-10
申请号：US13145840
申请日：2010-01-28
申请人： Akiko Kawaguchi , Nozomu Takano , Yasuyuki Mizuno , Kazumasa Takeuchi , Shigeru Haeno , Yoshinori Nagai , Masato Fukui
发明人： Akiko Kawaguchi , Nozomu Takano , Yasuyuki Mizuno , Kazumasa Takeuchi , Shigeru Haeno , Yoshinori Nagai , Masato Fukui
IPC分类号： H05K1/03 , B32B27/00 , B32B15/08 , C09D163/00
CPC分类号： H05K1/0326 , C08F220/18 , C08F2220/1808 , C08F2220/1891 , H01L23/145 , H01L2924/0002 , H05K3/427 , Y10T428/31692 , Y10T428/31855 , H01L2924/00
摘要： The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
摘要翻译： 本发明提供了通过用树脂组合物浸渍纤维基材而形成的预浸料，并且该树脂组合物包含丙烯酸树脂，其中由于腈基（PCN）而导致的2240cm -1附近的峰高相对于 固化树脂组合物（PCN / PCO）的红外光谱中由于羰基（PCO）1730cm -1附近的峰高不大于0.001等，以提供预浸料，具有树脂的膜， 具有树脂的金属箔和覆金属层压板，其表现出优异的抗弯曲性，同时还防止离子迁移，并且在制造印刷线路板时具有优异的绝缘可靠性，以及使用该箔的印刷线路板。
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7.发明授权Production of insulating varnishes and multilayer printed circuit boards using these varnishes 失效使用这些清漆生产绝缘清漆和多层印刷电路板公开(公告)号：US06197149B1
公开(公告)日：2001-03-06
申请号：US09057522
申请日：1998-04-09
申请人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
发明人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
IPC分类号： C09J500
CPC分类号： H05K3/4655 , C09D5/00 , H05K1/0373 , H05K3/4652 , H05K2201/0209 , H05K2201/0239 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , Y10T428/24994 , Y10T428/249944 , Y10T428/249946 , Y10T428/249952
摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.
摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。
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公开(公告)号：US08664534B2
公开(公告)日：2014-03-04
申请号：US11915097
申请日：2006-05-19
IPC分类号： H05K1/00
CPC分类号： H05K1/0281 , H05K1/0265 , H05K1/056 , H05K2201/0352 , H05K2201/09736
摘要： It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 μm, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 μm.
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的印刷电路板。 根据本发明的优选实施例的印刷电路板（40）具有基底（1），形成在柔性区域（36）中的导体（7）和形成为非柔性的导体（8,9）的结构 地区（46）。 形成在柔性区域（36）中的导体（7）具有1-30μm的总厚度，并且形成在非柔性区域（46）中的导体（8,9）的总厚度为30-150μm 。
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公开(公告)号：US20120285732A1
公开(公告)日：2012-11-15
申请号：US13550347
申请日：2012-07-16
CPC分类号： H05K3/4691 , H05K1/0278 , H05K1/0366 , H05K3/281 , H05K3/4611 , H05K3/4626 , H05K3/4688 , H05K2203/0571 , H05K2203/063
摘要： It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的多层电路板。 根据本发明的优选实施例，多层电路板（12）具有其中非柔性印刷电路板（6）通过盖板（10）层叠到柔性印刷电路板（1）的两侧上的结构。 在多层电路板（12）中，盖板（10）保护印刷电路板（6）不在其上的印刷电路板（1）的区域，同时还用作粘合层（11），用于与 印刷电路板（6）。 换句话说，相同的层用作多层电路板（12）中的覆盖层（10）和粘合剂层（11）。
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10.发明授权Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances 有权用于印刷线路板的预浸料，树脂清漆，树脂组合物和使用这些物质制造的印刷线路板的层压材料公开(公告)号：US06692792B2
公开(公告)日：2004-02-17
申请号：US10425623
申请日：2003-04-30
申请人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
发明人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
IPC分类号： B05D136
CPC分类号： B32B27/04 , C03C25/40 , C08J5/06 , C08J5/08 , C08J5/24 , H05K1/0353 , Y02P20/582 , Y10S428/901 , Y10T428/24917 , Y10T428/2962 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
摘要翻译： 通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板， 具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。
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