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    Thermosetting resin composition and use thereof
    2.
    发明授权
    Thermosetting resin composition and use thereof 失效
    热固性树脂组合物及其用途

    公开(公告)号：US06667107B2

    公开(公告)日：2003-12-23

    申请号：US10058919

    申请日：2002-01-30

    申请人： Shinji Tsuchikawa ,  Kazuhito Kobayashi ,  Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Nozomu Takano

    发明人： Shinji Tsuchikawa ,  Kazuhito Kobayashi ,  Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Nozomu Takano

    IPC分类号： B32B2730

    CPC分类号： C08L79/04 ,  C08L35/06 ,  C08L63/00 ,  H05K1/0353 ,  Y10T428/31855 ,  Y10T428/31938 ,  C08L2666/02 ,  C08L2666/20 ,  C08L35/00

    摘要： A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R2 represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

    摘要翻译： 一种热固性树脂组合物，其包含（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1表示氢，卤素 ，或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数，（2）每分子具有至少2个氰酸酯基的氰酸酯树脂。 提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。

    THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME.
    6.
    发明申请
    THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME. 审中-公开
    热固性树脂组合物及其制备和层压体与其相同。

    公开(公告)号：US20100279129A1

    公开(公告)日：2010-11-04

    申请号：US12810387

    申请日：2008-06-19

    申请人： Shinji Tsuchikawa ,  Masanori Akiyama ,  Tomohiko Kotake

    发明人： Shinji Tsuchikawa ,  Masanori Akiyama ,  Tomohiko Kotake

    IPC分类号： B32B15/08 ,  C08K5/3492

    CPC分类号： C08K5/5333 ,  B32B5/02 ,  B32B15/092 ,  B32B15/20 ,  B32B2457/08 ,  C08G59/56 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/04 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08K2003/2227 ,  C08L63/00 ,  C08L63/04 ,  C08L2201/02 ,  C09J163/00 ,  C09J163/04 ,  C09J2205/102 ,  H05K1/0353 ,  Y10T428/31678

    摘要： The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

    摘要翻译： 本发明提供一种热固性树脂组合物，其包含（A）二取代次膦酸的金属盐，（B）分子中具有N-取代的马来酰亚胺基的马来酰亚胺化合物，（C）6-取代的胍胺化合物或双氰胺和（ D）在分子中具有至少两个环氧基的环氧树脂和通过使用它们制备的预浸料和层压板。 通过用本发明的热固性树脂组合物浸渍或涂覆基材获得的预浸料和通过层压和模塑上述预浸料制成的层压板均具有铜箔粘合性，玻璃化转变温度，焊料热 电阻，吸湿性，阻燃性，相对介电常数和介电损耗角正切，并且它们可用作电子仪器的印刷线路板。

    Process for preparing printed circuit board
    7.
    发明授权
    Process for preparing printed circuit board 失效
    印刷电路板的制作工艺

    公开(公告)号：US5476690A

    公开(公告)日：1995-12-19

    申请号：US253561

    申请日：1994-06-03

    申请人： Fumihiko Ohta ,  Takeshi Nojiri ,  Shinji Tsuchikawa ,  Akio Nakano ,  Toshiaki Ishimaru ,  Hiroshi Yamazaki ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi

    发明人： Fumihiko Ohta ,  Takeshi Nojiri ,  Shinji Tsuchikawa ,  Akio Nakano ,  Toshiaki Ishimaru ,  Hiroshi Yamazaki ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi

    IPC分类号： G03F7/027 ,  C23C18/16 ,  G03F7/028 ,  G03F7/033 ,  H05K3/00 ,  H05K3/18 ,  B05D5/12

    CPC分类号： G03F7/033 ,  C23C18/1605 ,  C23C18/405 ,  H05K3/184 ,  C23C18/2013 ,  C23C18/2033 ,  C23C18/24 ,  C23C18/30 ,  H05K2203/0793 ,  H05K3/0076

    摘要： Disclosed is a process for preparing a printed circuit board, which comprises the steps of:(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b);(2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and(3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.

    摘要翻译： 公开了一种制备印刷电路板的方法，其包括以下步骤：（1）在绝缘基板的表面上，在要沉积无电镀铜的必需部分上形成光敏层 树脂组合物，其包含（a）40至80重量份的酸值为10至46mgKOH / g的乙烯基聚合的高分子量粘合剂，（b）20至60重量份具有至少两个可聚合的 不饱和双键，组分（a）和（b）的总量为100重量份，和（c）光聚合引发剂通过以0.1〜10重量份的量的活性光照射而产生自由基 基于100重量份的组分（a）和（b）的重量; （2）通过成像地照射活性光并用半显影液显影来在感光树脂组合物的表面上形成负型图案; 和（3）通过使用感光性树脂组合物的负图案作为电镀抗蚀剂的基板表面，通过化学镀铜形成电路图案。

    METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNSATURATED MALEIMIDE GROUP, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE
    8.
    发明申请
    METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNSATURATED MALEIMIDE GROUP, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE 有权
    制备具有酸性取代基和不饱和马来酰亚胺基的固化剂，热固性树脂组合物，PREPREG和层压体的方法

    公开(公告)号：US20100173163A1

    公开(公告)日：2010-07-08

    申请号：US12303627

    申请日：2007-06-01

    申请人： Shinji Tsuchikawa ,  Masanori Akiyama ,  Hikari Murai

    发明人： Shinji Tsuchikawa ,  Masanori Akiyama ,  Hikari Murai

    IPC分类号： B32B27/38 ,  B32B27/00 ,  C07D403/02 ,  C08G73/02 ,  C08G59/14 ,  C08L79/02

    CPC分类号： C08L79/085 ,  B32B27/12 ,  B32B27/28 ,  B32B27/42 ,  B32B2307/3065 ,  B32B2457/00 ,  C07D207/452 ,  C08G59/46 ,  C08G73/12 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/40 ,  C08K5/18 ,  C08K5/3492 ,  C09D163/00 ,  Y10T428/31504 ,  Y10T428/31511

    摘要： The invention provides a method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I)); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The curing agent produced through the method of the present invention has good solubility in an organic solvent and can provide a thermosetting resin composition exhibiting excellent adhesion-to-metal foil property, heat resistance, moisture resistance, flame retardancy, and copper cladding heat resistance, and low dielectric properties and low dielectric loss tangent. Therefore, the thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.

    摘要翻译： 本发明提供一种具有酸性取代基和不饱和马来酰亚胺基的固化剂的制备方法，包括在有机溶剂中使分子中具有至少两个N-取代的马来酰亚胺基的马来酰亚胺化合物（a）与胺 具有酸性取代基的化合物（b）（由式（I）表示））; 含有通过该方法制备的固化剂（A）和用固化剂固化的化合物（B）的热固性树脂组合物，其中组合物的固化产物的玻璃化转变温度为200℃以上; 和由其制成的预浸料和层压片。 通过本发明的方法制备的固化剂在有机溶剂中具有良好的溶解性，并且可以提供表现出优异的粘合性 - 金属箔性，耐热性，耐湿性，阻燃性和铜包层耐热性的热固性树脂组合物， 低介电特性和低介电损耗角正切。 因此，热固性树脂组合物可以制造出适用于电子设备和类似装置的印刷线路板的表现出优异性能的预浸料或层压片。