公开(公告)号：US20130168353A1

公开(公告)日：2013-07-04

申请号：US13823955

申请日：2011-09-29

申请人： Shogo Okita ,  Ryota Furukawa ,  Yoshimasa Inamoto ,  Tatsuhiro Mizukami

发明人： Shogo Okita ,  Ryota Furukawa ,  Yoshimasa Inamoto ,  Tatsuhiro Mizukami

IPC分类号： B44C1/22

CPC分类号： B44C1/227 ,  H01L21/67069 ,  H01L21/68742 ,  H01L21/68771 ,  H01L33/005

摘要： A process for, with use of a tray in which substrate receiving holes are provided and which has substrate support portions protruding from inner walls of the substrate receiving holes, placing the tray onto a tray support portion of a substrate stage and placing substrates onto the substrate holding portions, so that edge portions of the substrates projected out of end edges of the substrate holding portions and the substrate support portions are separated; a process for reducing pressure in a chamber and supplying a process gas thereto to fulfill plasma processing for the substrates; and a process for, with the tray and the substrates placed on the substrate stage, reducing the pressure in the chamber and supplying a process gas to fulfill plasma processing so that by-products stuck to edge portions of the substrates and the substrate support portions are removed.

摘要翻译： 一种使用托盘的方法，其中设置有基板接收孔，并且具有从基板接收孔的内壁突出的基板支撑部分，将托盘放置在基板台的托盘支撑部分上并将基板放置在基板上 保持部分，使得从基板保持部分和基板支撑部分的端部边缘突出的基板的边缘部分被分离; 用于减小腔室中的压力并向其提供处理气体以实现基底的等离子体处理的方法; 以及用于将托盘和基板放置在基板台上的方法，减小了室中的压力并提供处理气体以实现等离子体处理，使得粘附到基板和基板支撑部分的边缘部分的副产物是 删除。

公开(公告)号：US09073385B2

公开(公告)日：2015-07-07

申请号：US13823955

申请日：2011-09-29

申请人： Shogo Okita ,  Ryota Furukawa ,  Yoshimasa Inamoto ,  Tatsuhiro Mizukami

发明人： Shogo Okita ,  Ryota Furukawa ,  Yoshimasa Inamoto ,  Tatsuhiro Mizukami

IPC分类号： H01L21/67 ,  B44C1/22 ,  H01L21/687 ,  H01L33/00

CPC分类号： B44C1/227 ,  H01L21/67069 ,  H01L21/68742 ,  H01L21/68771 ,  H01L33/005

摘要： A substrate placement process uses a tray in which a plurality of substrate receiving holes are provided to receive substrates and which has substrate support portions protruding from inner walls of the substrate receiving holes. The tray is placed onto a tray support portion of a substrate stage and places substrates onto substrate holding portions, respectively, so that edge portions of the substrates projected beyond end edges of the substrate holding portions and are apart from the substrate support portions. The first plasma processing process reduces internal pressure of a chamber and supplies a process gas thereto to fulfill plasma processing for the individual substrates. A second plasma processing process with the tray and the individual substrates placed on the substrate stage, reduces the internal pressure of the chamber and supplies a process gas to fulfill plasma processing so that by-products stuck to edge portions of the substrates and the substrate support portions due to the first plasma processing process are removed. By the removal of by-products stuck to the edge portions of the substrates and the tray during plasma processing, product quality is improved.

摘要翻译： 衬底放置过程使用其中设置有多个衬底接收孔的托盘来接收衬底，并且具有从衬底接收孔的内壁突出的衬底支撑部分。 托盘被放置在基板台的托盘支撑部分上，并且将基板分别放置在基板保持部分上，使得基板的边缘部分突出超过基板保持部分的端部边缘并且离开基板支撑部分。 第一等离子体处理工艺降低了室的内部压力，并向其提供工艺气体以实现各个衬底的等离子体处理。 第二等离子体处理工艺，其中托盘和单独的基板放置在基板台上，降低了室的内部压力，并提供了处理气体以实现等离子体处理，使得副产物粘附到基板的边缘部分和基板支撑 去除由于第一等离子体处理过程引起的部分。 通过在等离子体处理期间去除粘附到基板和托盘的边缘部分的副产物，提高了产品质量。

公开(公告)号：US06551444B2

公开(公告)日：2003-04-22

申请号：US10118244

申请日：2002-04-09

申请人： Tetsuhiro Iwai ,  Ryota Furukawa

发明人： Tetsuhiro Iwai ,  Ryota Furukawa

IPC分类号： H01L2100

CPC分类号： C23C16/50 ,  C23C16/455 ,  C23C16/52 ,  H01J37/3244 ,  H01J37/3299

摘要： A plasma processing apparatus and a method of plasma processing using the same obviate a problem in which an excessive amount of processing gas is supplied momentarily during an initial stage of the gas supply. In the process of supplying gas, a main controller outputs to a mass flow controller a flow-rate setting command signal preset for “zero flow” prior to opening a gas shut-off valve, which opens/closes a gas supply passage, and another flow-rate setting command signal set for “a specific flow rate” only after the gas shut-off valve is opened.

公开(公告)号：US5906700A

公开(公告)日：1999-05-25

申请号：US790453

申请日：1997-01-29

申请人： Ryota Furukawa

发明人： Ryota Furukawa

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/64 ,  H01L25/16 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34

CPC分类号： H05K3/284 ,  H01L23/3121 ,  H01L23/64 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85013 ,  H01L2224/92247 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/3431

摘要： A bare chip is mounted on a land of a substrate, and electrodes on an upper surface of the bare chip are connected with pads by means of wires. The pads are formed in lines so as to face the land, and electrodes for the soldering of electrodes of rectangular electronic parts are formed in the empty spaces between the vertical and horizontal lines of pads. After soldering the rectangular electronic parts, the bare chip is mounted and then sealed with resin. The rectangular electronic parts soldered between the lines of pads are entirely or partly sealed with the resin as well as the bare chip. The rectangular electronic parts are mounted in the spaces between the lines of pads, and therefore the bare chip and the rectangular electronic parts can be mounted at a higher density so that the substrate can be made smaller and more compact.

摘要翻译： 裸芯片安装在基板的台面上，裸芯片的上表面上的电极通过电线与焊盘连接。 焊盘形成为面对面的线，并且用于焊接矩形电子部件的电极的电极形成在焊盘的垂直和水平线之间的空的空间中。 在焊接矩形电子部件之后，裸芯片被安装，然后用树脂密封。 焊接在焊盘之间的矩形电子部件用树脂以及裸芯片完全或部分地密封。 矩形电子部件安装在焊盘之间的空间中，因此裸芯片和矩形电子部件可以以更高的密度安装，使得可以使基板更小更紧凑。

公开(公告)号：US06576500B2

公开(公告)日：2003-06-10

申请号：US09948098

申请日：2001-09-07

申请人： Ryota Furukawa ,  Ryuji Nagadome

发明人： Ryota Furukawa ,  Ryuji Nagadome

IPC分类号： H01L2144

CPC分类号： H01L24/85 ,  H01L21/4864 ,  H01L21/67028 ,  H01L24/48 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/85013 ,  H01L2224/85181 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/181 ,  H05K3/26 ,  Y10S438/906 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A plasma-processing apparatus providing a resin mold domed enough to allow no bonding wires to be exposed is presented. The plasma-processing apparatus cleans a board including a chip mounted thereon and a disposing area for a pad formed around the chip. The apparatus includes a chamber for accommodating the board; an electrode mounted to the chamber for generating plasma in the chamber with a voltage applied thereto, a table for supporting the board in the chamber, and a masking member which is provided above the board. The masking member has an opening for exposing the chip and the disposing area to the plasma.

摘要翻译： 提供了一种提供足以允许没有接合线暴露的树脂模具的等离子体处理设备。 等离子体处理装置清洗包括安装在其上的芯片的板和用于在芯片周围形成的焊盘的布置区域。 该装置包括容纳该板的腔室; 电极，其安装到所述室中，用于在所述室中产生施加电压的等离子体，用于在所述室中支撑所述板的台，以及设置在所述板上方的掩模构件。 掩模构件具有用于将芯片暴露和等离子体的布置区域的开口。