Method for working ceramic material
    1.
    发明授权
    Method for working ceramic material 失效
    陶瓷材料工作方法

    公开(公告)号:US5178725A

    公开(公告)日:1993-01-12

    申请号:US673652

    申请日:1991-03-21

    摘要: A process is provided for working a base material which essentially consists of a ceramic material. The process includes an irradiation process of irradiating a laser beam or an electron beam to the base material in order to form an affected portion having cracks in the base material and a removing process for removing the affected portion. The ceramic material includes an oxide ceramic material (for example, alumina and forsterite) and a carbide ceramic material. The shape and the depth of the portion to be worked are controlled by the scanning of the laser beam or the electron beam. The removing process can include any one of the processes of vibrating the base material, applying a thermal shock to the base material and etching the base material. In accordance with the present invention, a base material which essentially consists of an oxide ceramic material or a carbide ceramic material can be worked with high aspect ratio and in a shorter period of time than in a conventional process.

    摘要翻译: 提供了一种用于加工基本上由陶瓷材料组成的基材的方法。 该方法包括将激光束或电子束照射到基材上以形成在基材中具有裂纹的受影响部分和去除受影响部分的去除工艺的照射过程。 陶瓷材料包括氧化物陶瓷材料(例如氧化铝和镁橄榄石)和碳化物陶瓷材料。 被加工部分的形状和深度通过激光束或电子束的扫描来控制。 除去过程可以包括使基材振动的过程中的任何一种,对基材进行热冲击并蚀刻基材。 根据本发明,基本上由氧化物陶瓷材料或碳化物陶瓷材料组成的基材可以以高的纵横比和比常规方法更短的时间段进行加工。

    Apparatus for inspecting a printed circuit board
    3.
    发明授权
    Apparatus for inspecting a printed circuit board 失效
    用于检查印刷电路板的装置

    公开(公告)号:US06633376B1

    公开(公告)日:2003-10-14

    申请号:US09719610

    申请日:2000-12-12

    IPC分类号: G01N2158

    摘要: As a scanning device for positioning the irradiation position of the laser beam emitted from a laser oscillator at a position of arbitrary coordinates in the commanded mutually orthogonal X-axis direction and Y-axis direction, two galvanomirrors having mutually orthogonal rotary axes and a scan lens are provided, and the light generated from a printed circuit board irradiated with laser beam is detected by a detector, and approval or rejection of inspection result at each position of coordinates is judged on the basis of the output signal of the detector.

    摘要翻译: 作为用于将从激光振荡器发射的激光束的照射位置定位在指令的相互正交的X轴方向和Y轴方向上的任意坐标的位置的扫描装置,具有相互正交的旋转轴的两个电流计镜和扫描透镜 并且由检测器检测从用激光束照射的印刷电路板产生的光,并且基于检测器的输出信号来判断在坐标的每个位置处的检查结果的批准或拒绝。

    Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations
    4.
    发明申请
    Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations 审中-公开
    脉冲激光束加工方法和装置,用于在多个位置加工布线板

    公开(公告)号:US20050184035A1

    公开(公告)日:2005-08-25

    申请号:US11087568

    申请日:2005-03-24

    IPC分类号: B23K26/38 H05K3/00

    摘要: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to 200 μs and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape. The laser beam operates at a frequency of more than 67 Hz, and the spot of the laser beam is sequentially moved to different drilling positions for each pulse. After all of many drilling positions in the range of a scan vision are irradiated with the laser beam pulse by pulse, or after the elapse of a time of 15 ms or more from irradiation of the first drilling position, the laser spot is returned to the first drilling position. The spot is sequentially moved once again, and the movement is repeated several times. A pause of 15 ms or more is required between pulses directed to the same drilling position to avoid formation of a thick char layer and projection of glass cloth into the hole.

    摘要翻译: 在布线基板的激光加工方法中,对于线束板的加工部照射约10〜200μm的束照射时间的脉冲激光束,能量密度约为20J / 2以上,从而对布线板进行加工,例如钻孔,通孔和盲孔,切槽和切割成外形。 激光束以大于67Hz的频率工作,并且激光束的光点顺序地移动到每个脉冲的不同的钻孔位置。 在扫描视野范围内的所有许多钻孔位置用脉冲照射激光束脉冲之后,或者在从第一钻孔位置照射经过15ms以上的时间之后,激光点返回到 第一钻孔位置。 点再次依次移动,运动重复多次。 在指向相同钻孔位置的脉冲之间需要15ms或更长的暂停,以避免形成厚的炭层并将玻璃布投射到孔中。

    Control apparatus for energy beam hardening
    7.
    发明授权
    Control apparatus for energy beam hardening 失效
    能量束硬化控制装置

    公开(公告)号:US4825035A

    公开(公告)日:1989-04-25

    申请号:US93270

    申请日:1987-09-04

    摘要: A control apparatus for energy beam hardening which has an electromagnetic wave detector for detecting an electromagnetic wave irradiated from the surface of a hardened portion to which an energy beam is being emitted, a temperature converter for converting a detection signal from the electromagnetic wave detector to a temperature, hardening characteristics presuming means for presuming hardening characteristics by processing temperature distribution data from the temperature converter, energy beam deciding means for deciding the output and moving velocity of the energy beam emitted to obtain desired hardening characteristics and according to hardening characteristics to be presumed, and energy beam control means for controlling at least one of the output and moving velocity of the energy beam according to the output of the energy beam deciding means to thus suppress the irregularities in the hardening characteristics, thereby obtaining hardening characteristics of the hardened material as desired even if pretreating conditions and beam output of the material to be hardened are varied.

    摘要翻译: 一种用于能量束硬化的控制装置,具有电磁波检测器,用于检测从发射能量束的硬化部分的表面照射的电磁波;温度转换器,用于将来自电磁波检测器的检测信号转换为 温度,硬化特性设定装置,用于通过处理来自温度转换器的温度分布数据来设定硬化特性,能量束决定装置,用于确定发射的能量束的输出和移动速度以获得期望的硬化特性,并根据要推定的硬化特性, 以及能量束控制装置,用于根据能量束决定装置的输出来控制能量束的输出和移动速度中的至少一个,从而抑制硬化特性的不规则性,从而获得硬化材料的硬化特性 即使要硬化的材料的预处理条件和光束输出变化也是如此。

    Semiconductor device having a fuse layer
    10.
    发明授权
    Semiconductor device having a fuse layer 失效
    具有熔丝层的半导体器件

    公开(公告)号:US5872389A

    公开(公告)日:1999-02-16

    申请号:US672867

    申请日:1996-06-28

    CPC分类号: H01L23/5258 H01L2924/0002

    摘要: Burst pressure P of an insulating layer positioned immediately on a fuse layer is defined by using planar width W of fuse layer and thickness t of insulating layer. The value of the planar width W of fuse layer and the value of the thickness t of insulating layer are set such that the value of burst pressure P is at most about 1000 kg/cm.sup.2. The value of the thickness t and the value of the planar width W are set such that the value t/W is at least 0.45 and at most 0.91. Consequently, stable fuse blowing becomes possible while reducing manufacturing cost.

    摘要翻译: 通过使用熔丝层的平面宽度W和绝缘层的厚度t来定义紧靠在熔丝层上的绝缘层的爆破压力P. 熔丝层的平面宽度W的值和绝缘层的厚度t的值被设定为使得爆破压力P的值为至多约1000kg / cm 2。 厚度t的值和平面宽度W的值被设定为使得值t / W为至少0.45且至多为0.91。 因此,可以在降低制造成本的同时实现稳定的熔断器熔断。