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    Positive Tone Bi-Layer Imprint Lithography Method
    1.
    发明申请
    Positive Tone Bi-Layer Imprint Lithography Method 有权
    正音双层印记平版印刷方法

    公开(公告)号：US20070099337A1

    公开(公告)日：2007-05-03

    申请号：US11560928

    申请日：2006-11-17

    申请人： Sidlgata Sreenivasan

    发明人： Sidlgata Sreenivasan

    IPC分类号： H01L51/40 ,  H01L21/00

    CPC分类号： B81C1/0046 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/76802

    摘要： The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.

    摘要翻译： 本发明提供一种通过在衬底上形成具有突起和凹陷的图案化层来形成特征为产生多层结构的衬底的方法。 形成在图案层上的是保形层，多层结构具有背离衬底的表冠表面。 去除多层结构的部分以暴露与突起叠加的衬底的区域，同时在与凹部重叠的冠表面的区域中形成硬掩模。

    Method of planarizing a semiconductor substrate
    5.
    发明申请
    Method of planarizing a semiconductor substrate 有权
    平面化半导体衬底的方法

    公开(公告)号：US20060035464A1

    公开(公告)日：2006-02-16

    申请号：US10917563

    申请日：2004-08-13

    申请人： Sidlgata Sreenivasan

    发明人： Sidlgata Sreenivasan

    IPC分类号： H01L21/302

    CPC分类号： B29C43/003 ,  B29C2043/025 ,  H01L21/0334 ,  H01L21/30604 ,  H01L21/31051 ,  H01L21/32115

    摘要： The present invention provides a method of planarizing a substrate, the method including, forming, on the substrate, a patterned layer having a first shape associated therewith; and processing the patterned layer, with the first shape compensating for variations in the processing such that upon processing the patterned layer, the patterned layer comprises a substantially planar shape.

    摘要翻译： 本发明提供一种平面化基板的方法，所述方法包括在基板上形成与其相关联的具有第一形状的图案化层; 并且处理图案化层，其中第一形状补偿了处理中的变化，使得在处理图案化层时，图案化层包括基本上平面的形状。

    Compliant device for nano-scale manufacturing
    6.
    发明申请
    Compliant device for nano-scale manufacturing 有权
    符合纳米级制造的器件

    公开(公告)号：US20050275251A1

    公开(公告)日：2005-12-15

    申请号：US11142838

    申请日：2005-06-01

    申请人： Byung-Jin Choi ,  Sidlgata Sreenivasan

    发明人： Byung-Jin Choi ,  Sidlgata Sreenivasan

    IPC分类号： A47C1/024 ,  A47C1/0355 ,  A47C3/00 ,  A47D1/02 ,  B60N2/02 ,  G03F7/00 ,  A47C1/038

    CPC分类号： G03F7/0002 ,  B29C43/021 ,  B29C2043/025 ,  B29C2043/5858 ,  B82Y10/00 ,  B82Y40/00 ,  Y10S977/887

    摘要： The present invention is directed to a compliant device comprising a support body, a floating body, and a plurality of flexure arms. Each of the plurality of flexure arms is connected between the support body and the floating body to transfer a load therebetween in parallel. To that end, the flexure arms have first and second sets of flexure joints. The first set of flexure joints facilitate rotational movement of said flexure arm about a first axis extending along a first direction. The second set of flexure joints are arranged to facilitate rotational movement of the flexure arm about a second axis, extending along a second direction that is transverse to the first direction. The flexure joints are revolute joints.

    摘要翻译： 本发明涉及一种包括支撑体，浮体和多个弯曲臂的柔性装置。 多个挠曲臂中的每一个连接在支撑体和浮体之间，以在它们之间平行地传送负载。 为此，弯曲臂具有第一组和第二组挠曲接头。 第一组弯曲接头便于围绕围绕第一方向延伸的第一轴线的所述弯曲臂的旋转运动。 第二组弯曲接头被布置成便于弯曲臂围绕第二轴线的旋转运动，第二轴线沿着横向于第一方向的第二方向延伸。 挠性接头是旋转接头。

    Adaptive shape substrate support method
    7.
    发明申请
    Adaptive shape substrate support method 失效
    自适应形状衬底支持方法

    公开(公告)号：US20050263077A1

    公开(公告)日：2005-12-01

    申请号：US11136892

    申请日：2005-05-25

    申请人： Mahadevan GanapathiSubramanian ,  Sidlgata Sreenivasan

    发明人： Mahadevan GanapathiSubramanian ,  Sidlgata Sreenivasan

    IPC分类号： G03F7/00 ,  G03F7/20 ,  H01L21/302 ,  H01L41/08

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/707

    摘要： The present method features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the method includes creating a point contact on the first surface to generate a change in shape of the second surface to obtain a desired shape of the second surface. The desired shape may be smooth, if not substantially planar or any other shape desired within the operational parameters of the chuck and the substrate. For example, the method may compensate for non-planarity due to particulate matter on the first surface and substrate topography. These and other embodiments are discussed more fully below.

    摘要翻译： 本发明的方法具有主动柔性销卡盘以保持具有相对的第一和第二表面的基板，并且补偿基板的一个表面中的非平面性。 为此，该方法包括在第一表面上产生点接触以产生第二表面的形状变化以获得第二表面的期望形状。 所需的形状可以是平滑的，如果不是基本平坦的或在卡盘和基底的操作参数内所需的任何其它形状。 例如，该方法可以补偿由于第一表面上的颗粒物质和基底形貌引起的非平面性。 以下将更全面地讨论这些和其它实施例。

    METHOD FOR OBTAINING FORCE COMBINATIONS FOR TEMPLATE DEFORMATION USING NULLSPACE AND METHODS OPTIMIZATION TECHNIQUES
    8.
    发明申请
    METHOD FOR OBTAINING FORCE COMBINATIONS FOR TEMPLATE DEFORMATION USING NULLSPACE AND METHODS OPTIMIZATION TECHNIQUES 有权
    使用空位获取模板变形的力组合的方法和方法优化技术

    公开(公告)号：US20070287081A1

    公开(公告)日：2007-12-13

    申请号：US11695469

    申请日：2007-04-02

    申请人： Anshuman Cherala ,  Sidlgata Sreenivasan ,  Byung-Jin Choi ,  Ecron Thompson

    发明人： Anshuman Cherala ,  Sidlgata Sreenivasan ,  Byung-Jin Choi ,  Ecron Thompson

    IPC分类号： G03F9/00

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/703 ,  G03F7/70633 ,  G03F7/70783 ,  G03F9/7003 ,  G03F9/7092

    摘要： The present invention is directed towards a method for determining deformation parameters that a patterned device would undergo to minimize dimensional variations between a recorded pattern thereon and a reference pattern, the method including, inter alia, comparing spatial variation between features of the recorded pattern with respect to corresponding features of the reference pattern; and determining deformation forces to apply to the patterned device to attenuate the dimensional variations, with the forces having predetermined constraints, wherein a summation of a magnitude of the forces is substantially zero and a summation of moment of the forces is substantially zero.

    摘要翻译： 本发明涉及一种用于确定图案化装置将经历以使其上的记录图案与参考图案之间的尺寸变化最小化的变形参数的方法，该方法尤其包括将记录图案的特征与相对于 参考图案的相应特征; 以及确定施加到所述图案化装置上的变形力以衰减所述尺寸变化，其中所述力具有预定的约束，其中所述力的大小的总和基本上为零，并且所述力的力矩的总和基本上为零。

    Conforming Template for Patterning Liquids Disposed on Substrates
    10.
    发明申请
    Conforming Template for Patterning Liquids Disposed on Substrates 有权
    符合基板上图案化液体的模板

    公开(公告)号：US20070122942A1

    公开(公告)日：2007-05-31

    申请号：US11669569

    申请日：2007-01-31

    申请人： Sidlgata Sreenivasan ,  Byung Choi ,  Ronald Voisin

    发明人： Sidlgata Sreenivasan ,  Byung Choi ,  Ronald Voisin

    IPC分类号： H01L21/00 ,  B28B11/08

    CPC分类号： B29C43/003 ,  B29C2043/025 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10S977/887

    摘要： The present invention includes a conforming template for patterning liquids disposed on substrates. The template includes a body having opposed first and second surfaces. The first surface includes a plurality of recessed regions with a patterning region being disposed between adjacent recessed regions. Specifically, the recessed regions define flexure regions about which each patterning region may move independent of the remaining patterning regions of the template. In one embodiment the template is mounted to a fluid chamber having an inlet and a throughway. The template is connected to the throughway and the inlet is connected to a fluid source to facilitate deformation of the template to conform to a profile of a surface adjacent thereto.

    摘要翻译： 本发明包括用于图案化液体配置在基板上的一致性模板。 模板包括具有相对的第一和第二表面的主体。 第一表面包括多个凹陷区域，其中图案化区域设置在相邻的凹陷区域之间。 具体地，凹陷区域限定挠曲区域，每个图案化区域围绕该弯曲区域可独立于模板的剩余图案形成区域移动。 在一个实施例中，模板安装到具有入口和通道的流体室。 模板连接到通道，并且入口连接到流体源以便于模板的变形以符合与其相邻的表面的轮廓。