公开(公告)号：US20150325516A1

公开(公告)日：2015-11-12

申请号：US14464051

申请日：2014-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chun- Hsien Lin ,  Shih-Chao Chiu ,  Yu-cheng Pai ,  Tzu-Chieh Shen ,  Ming-Chen Sun

IPC: H01L23/522 ,  H01L21/56 ,  H01L23/482 ,  H01L23/31 ,  H01L23/498 ,  H01L21/768

CPC classification number: H01L21/48 ,  H01L21/56 ,  H01L21/76897 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/4824 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5226 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00

Abstract: A method for fabricating a coreless packaging substrate is provided, which includes: forming a dielectric layer on a conductive plate having a plurality of conductive pads; forming a circuit layer on the dielectric layer and forming in the dielectric layer a plurality of conductive vias that electrically connect the circuit layer and the conductive pads; and removing a portion of the conductive plate so as to cause the remaining portion of the conductive plate to form a plurality of conductive elements, thereby dispensing with a core layer and reducing the material and fabrication cost.

Abstract translation: 提供了一种无芯封装基板的制造方法，其包括：在具有多个导电焊盘的导电板上形成电介质层; 在电介质层上形成电路层，并在电介质层中形成电连接电路层和导电焊盘的多个导电通孔; 并且去除导电板的一部分以使导电板的剩余部分形成多个导电元件，由此分配芯层并减少材料和制造成本。

公开(公告)号：US20150348929A1

公开(公告)日：2015-12-03

申请号：US14452731

申请日：2014-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wei-Chung Hsiao ,  Chun- Hsien Lin ,  Yu-cheng Pai ,  Ming-Chen Sun ,  Shih-Chao Chiu

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure is provided, which includes: a substrate having opposite top and bottom surfaces and a plurality of conductive pads and a plurality of conductive posts formed therein, wherein the conductive pads are exposed from the bottom surface of the substrate, and the conductive posts are electrically connected to the conductive pads and each of the conductive posts has an end surface exposed from the top surface of the substrate; a plurality of first conductive bumps formed on the end surfaces of the conductive posts; a plurality of second conductive bumps formed on the top surface of the substrate, wherein the second conductive bumps are higher than the first conductive bumps; and at least a first electronic element disposed on and electrically connected to the first conductive bumps, thereby increasing the wiring flexibility and facilitating subsequent disposing of electronic elements without changing existing machines.

Abstract translation: 提供了一种封装结构，其包括：具有相对的顶表面和底表面的衬底和形成在其中的多个导电焊盘和多个导电柱，其中，导电焊盘从衬底的底表面露出，导电柱 电连接到导电焊盘，并且每个导电柱具有从衬底的顶表面暴露的端表面; 形成在所述导电柱的端面上的多个第一导电凸块; 形成在所述基板的上表面上的多个第二导电凸块，其中所述第二导电凸块高于所述第一导电凸块; 以及至少第一电子元件，其设置在第一导电凸块上并与之电连接，从而增加布线灵活性，并且便于随后处理电子元件而不改变现有机器。

公开(公告)号：US09490225B2

公开(公告)日：2016-11-08

申请号：US14452731

申请日：2014-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wei-Chung Hsiao ,  Chun-Hsien Lin ,  Yu-cheng Pai ,  Ming-Chen Sun ,  Shih-Chao Chiu

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L24/17 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure is provided, which includes: a substrate having opposite top and bottom surfaces and a plurality of conductive pads and a plurality of conductive posts formed therein, wherein the conductive pads are exposed from the bottom surface of the substrate, and the conductive posts are electrically connected to the conductive pads and each of the conductive posts has an end surface exposed from the top surface of the substrate; a plurality of first conductive bumps formed on the end surfaces of the conductive posts; a plurality of second conductive bumps formed on the top surface of the substrate, wherein the second conductive bumps are higher than the first conductive bumps; and at least a first electronic element disposed on and electrically connected to the first conductive bumps, thereby increasing the wiring flexibility and facilitating subsequent disposing of electronic elements without changing existing machines.

Abstract translation: 提供了一种封装结构，其包括：具有相对的顶表面和底表面的衬底和形成在其中的多个导电焊盘和多个导电柱，其中，导电焊盘从衬底的底表面露出，导电柱 电连接到导电焊盘，并且每个导电柱具有从衬底的顶表面暴露的端表面; 形成在所述导电柱的端面上的多个第一导电凸块; 形成在所述基板的上表面上的多个第二导电凸块，其中所述第二导电凸块高于所述第一导电凸块; 以及至少第一电子元件，其设置在第一导电凸块上并与之电连接，从而增加布线灵活性，并且便于随后处理电子元件而不改变现有机器。

公开(公告)号：US20150333029A1

公开(公告)日：2015-11-19

申请号：US14459713

申请日：2014-08-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-cheng Pai ,  Chun- Hsien Lin ,  Shih-Chao Chiu ,  Wei-Chung Hsiao ,  Ming-Chen Sun ,  Tzu-Chieh Shen ,  Chia-Cheng Chen

IPC: H01L23/00 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/09 ,  H01L24/11 ,  H01L24/17 ,  H01L2224/02185 ,  H01L2224/0219 ,  H01L2924/0002

Abstract: A package substrate and a method of fabricating the same are provided. The method includes providing a substrate body having a first surface, a second surface opposing the first surface, a plurality of first electrical connecting pads disposed on the first surface; mounting a metal board on the first electrical connecting pads; and patterning the metal board so as to define a plurality of metal pillars corresponding to the first electrical connecting pads. Therefore, drawbacks of raw edges and unequal heights of the metal pillars can be obviated.

Abstract translation: 提供封装基板及其制造方法。 该方法包括提供具有第一表面，与第一表面相对的第二表面的衬底主体，设置在第一表面上的多个第一电连接焊盘; 将金属板安装在第一电连接垫上; 以及图案化所述金属板以限定对应于所述第一电连接焊盘的多个金属柱。 因此，可以消除金属柱的原始边缘和不等高度的缺点。

公开(公告)号：US20150102484A1

公开(公告)日：2015-04-16

申请号：US14136238

申请日：2013-12-20

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD

Inventor： Chia-Cheng Chen ,  Ming-Chen Sun ,  Tzu-Chieh Shen ,  Liang-yi Hung ,  Wei-chung Hsiao ,  Yu-cheng Pai ,  Shih-Chao Chiu ,  Don-Son Jiang ,  Yi-Feng Chang ,  Lung-Yuan Wang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/535

CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1011 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/181 ,  H05K1/183 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A package structure is disclosed, which includes: a first substrate; a build-up layer formed on and electrically connected to the first substrate and having a cavity; at least an electronic element disposed in the cavity and electrically connected to the first substrate; a stack member disposed on the build-up layer so as to be stacked on the first substrate; and an encapsulant formed between the build-up layer and the stack member. The build-up layer facilitates to achieve a stand-off effect and prevent solder bridging.

Abstract translation: 公开了一种封装结构，其包括：第一基板; 形成在第一基板上并电连接到第一基板并具有空腔的积聚层; 至少电子元件设置在所述空腔中并电连接到所述第一基板; 堆叠构件，其设置在堆积层上以堆叠在第一基板上; 以及形成在堆积层和堆叠构件之间的密封剂。 堆积层有助于实现隔离效应并防止焊料桥接。