公开(公告)号：US07622799B2

公开(公告)日：2009-11-24

申请号：US11617239

申请日：2006-12-28

申请人： Soshi Kuroda ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Akira Yamazaki ,  Koji Bando

发明人： Soshi Kuroda ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Akira Yamazaki ,  Koji Bando

IPC分类号： H01L23/02

CPC分类号： H01L23/5386 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/544 ,  H01L23/552 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/13144 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48478 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/20752 ,  H01L2224/4554

摘要： A semiconductor device in which memory chips are stacked on the surface of a wiring substrate has a microcomputer chip and an interposer chip arranged on the surface of the memory chip. The pads of the microcomputer chip and the pads of the interposer chip are arranged almost circularly and are connected by bonding wires.

摘要翻译： 其中存储芯片堆叠在布线基板的表面上的半导体器件具有布置在存储器芯片的表面上的微计算机芯片和插入器芯片。 微型计算机芯片的焊盘和插入器芯片的焊盘几乎圆形地布置，并通过接合线连接。

公开(公告)号：US20070170573A1

公开(公告)日：2007-07-26

申请号：US11617239

申请日：2006-12-28

申请人： Soshi KURODA ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Akira Yamazaki ,  Koji Bando

发明人： Soshi KURODA ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Akira Yamazaki ,  Koji Bando

IPC分类号： H01L23/02

CPC分类号： H01L23/5386 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/544 ,  H01L23/552 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/13144 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48478 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/20752 ,  H01L2224/4554

摘要： The semiconductor device with which bonding wires cannot contact easily is offered.In this semiconductor device, memory chips are stacked on the surface of a wiring substrate, a microcomputer chip and an interposer chip are arranged on the surface of the memory chip, and the pad of a microcomputer chip and the pad of an interposer chip arranged almost circularly are connected by a bonding wire. Therefore, since the transfer pressure of liquid resin for sealing can be weakened with a wire, contact of the wires by deformation of a wire can be prevented.

摘要翻译： 提供接合线不容易接触的半导体器件。 在该半导体装置中，将存储芯片层叠在布线基板的表面上，在存储芯片的表面配置有微型计算机芯片和插入式芯片，微型计算机芯片的焊盘和插入器芯片的焊盘几乎布置 圆形通过接合线连接。 因此，由于可以用线弱化用于密封的液态树脂的转印压力，因此可以防止由于电线的变形引起的电线的接触。

公开(公告)号：US20080217750A1

公开(公告)日：2008-09-11

申请号：US12073384

申请日：2008-03-05

申请人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

发明人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49558 ,  H01L23/60 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6638 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00

摘要： A plurality of inner leads 14 are provided around a die pad 13. A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14. A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21. The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22. The GND wires 22 are disposed between a plurality of wires 21. The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.

摘要翻译： 多个内引线14设置在管芯焊盘13周围。 接地GND引线16设置在管芯焊盘13和多个内引线14之间的区域中。 半导体芯片17和多个内部引线14通过多个导线21彼此连接。 半导体芯片17和GND引线16通过GND线22彼此连接。 GND布线22设置在多个布线21之间。 每个相邻的一对内引线14的端部之间的距离为0.2mm以下。

公开(公告)号：US07763966B2

公开(公告)日：2010-07-27

申请号：US12073384

申请日：2008-03-05

申请人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

发明人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

IPC分类号： H01L23/495 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49541 ,  H01L23/49558 ,  H01L23/60 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6638 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00

摘要： A plurality of inner leads 14 are provided around a die pad 13. A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14. A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21. The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22. The GND wires 22 are disposed between a plurality of wires 21. The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.

摘要翻译： 多个内引线14设置在管芯焊盘13周围。接地GND引线16设置在管芯焊盘13和多个内引线14之间的区域中。半导体芯片17和多个内引线14被连接 通过多个导线21彼此连接。半导体芯片17和GND引线16通过GND线22彼此连接。GND线22设置在多条导线21之间。每个相邻对的端部之间的距离 的内引线14为0.2mm以下。

公开(公告)号：US06713882B2

公开(公告)日：2004-03-30

申请号：US10091303

申请日：2002-03-06

申请人： Naoya Yasuda

发明人： Naoya Yasuda

IPC分类号： H01L2328

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： The resin sealing apparatus includes a mold that has a main cavity into which a portion of a semiconductor device to be sealed with a resin is disposed. Furthermore, an external-shape regulating member is detachably accommodated in the main cavity of the mold to form a new cavity inside the main cavity.

摘要翻译： 树脂密封装置包括具有主空腔的模具，其中设置有用树脂密封的半导体器件的一部分。 此外，外形调节构件可拆卸地容纳在模具的主腔中，以在主腔内形成新的空腔。