摘要:
A fused conductor includes a first conductor portion, a second conductor portion, and a fuse element in electrical communication with the first and second conductor portions via at least one dual metal wire, the fuse element protected by a glass body bonded chemically to the dual metal wire.
摘要:
Electrical fuse indicators which may be used to diagnose and identify a fault state or failure mode of the electrical fuse include in various exemplary embodiments, indicator materials such as a reactive material, which are incorporated into various fuse indicator devices to cooperate with a visually perceptible indicator portion or layer to indicate the failure mode or fault state if the electrical fuse.
摘要:
An integral circuit protection device includes a substrate disposed between first and second terminals. The substrate is composed of a resistive material. A first conductive layer is disposed on a first surface of the substrate and in electrical contact with the first terminal. A second conductive layer is disposed on a second surface of the substrate. A first electrically insulating layer is disposed on the second conductive layer and substantially covers the second conductive layer. The first electrically insulating layer includes an aperture. A fuse element is disposed on the first electrically insulating layer and is in electrical contact with the second conductive layer through the aperture and in electrical contact with the second terminal. The fuse element is in electrical series with the resistive material. A second electrically insulating layer is disposed over the fuse element.
摘要:
Electrostatic discharge protection, also known as ESD protection, is provided in the form of a discrete array with a voltage variable material (VVM) or a VVM device. The array is fabricated with a common electrode for connection to ground, and one or more electrodes configured for connection to an electrical component. The electrical component is a connector attached to an electrical circuit containing devices subject to damage by ESD events. The array is placed into a pocket or space on the connector and is held in place mechanically by spring force or by soldering to leads or electrodes of the connector. The array may be soldered to a ground connection or held in place by pressure, such as from a spring or from an outer housing or shell. In some embodiments, the array is removable from the component without affecting component circuits other than removal of ESD protection.
摘要:
The present invention provides connectors having circuit protection. Specifically, the present invention provides a device that operates with existing or new connectors to provide overvoltage protection to same. The device includes a strip of conductive material along which voltage variable material (“VVM”) is applied. The strip also includes an exposed portion not having the VVM deposition. The VVM contacts a plurality of signal conductors of the connector. The exposed portion contacts at least one ground conductor of the connector. When an overvoltage condition occurs along one of the signal conductors, the VVM switches from a high impedance to a low impedance state, allowing the transient threat to dissipate, at least in part, to one or more ground conductor.
摘要:
A fuse arrangement for use in a vehicle is provided having a configuration wherein a common bus terminal connected to a voltage supply is connected to terminals of one or more axial fuses. The other fuse terminals are, in turn, connected to a wiring harness that is located on an opposite side of the fuse box from the common bus terminal in a base of a fuse box. Additionally, the present invention includes a fuse array including a planar substrate with fuses constructed on the substrate by film metallization. Furthermore, the invention includes a carrier strip used for packaging automotive fuses that is made of a flexible material capable of being rolled into a package for shipping to an end user. The invention also includes a mini fuse having reduced terminal spacing for use in vehicles with mixed voltage systems wherein the reduced terminal spacing fuse is used for a particular voltage.
摘要:
A surface mount fuse in one embodiment includes an insulative body, first and second conductive and caps attached to the insulative body, each end cap defining an aperture, and a fuse element extending (i) through the insulative body and the apertures and (ii) along outside surfaces of the first and second conductive end caps in such a way that solder used to attach the first and second conductive end caps to an external medium also fastens the fuse element to the first and second end caps.
摘要:
A fuse in one embodiment includes first and second leads. A fuse element provides electrical communication between the first and second leads. The fuse element includes a material with a melting point of less than 250.degree. C. and acts as both an overcurrent fuse and a thermal fuse by melting when subjected to a predetermined current or upon reaching a predetermined temperature. A body houses the fuse element and portions of the first and second leads
摘要:
An integral circuit protection device includes a substrate disposed between first and second terminals. The substrate is composed of a resistive material. A first conductive layer is disposed on a first surface of the substrate and in electrical contact with the first terminal. A second conductive layer is disposed on a second surface of the substrate. A first electrically insulating layer is disposed on the second conductive layer and substantially covers the second conductive layer. The first electrically insulating layer includes an aperture. A fuse element is disposed on the first electrically insulating layer and is in electrical contact with the second conductive layer through the aperture and in electrical contact with the second terminal. The fuse element is in electrical series with the resistive material. A second electrically insulating layer is disposed over the fuse element.
摘要:
A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.