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    Integrated microchip design
    9.
    发明申请
    Integrated microchip design 审中-公开
    集成微芯片设计

    公开(公告)号：US20050150765A1

    公开(公告)日：2005-07-14

    申请号：US11076571

    申请日：2005-03-09

    申请人： David Roach ,  Jing Ni ,  Iuliu-Ioan Blaga ,  Owe Salven ,  Stevan Bogdan Jovanovich

    发明人： David Roach ,  Jing Ni ,  Iuliu-Ioan Blaga ,  Owe Salven ,  Stevan Bogdan Jovanovich

    IPC分类号： B01L3/00 ,  C02F1/469 ,  H01L23/58

    CPC分类号： B01L3/502738 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/10 ,  B01L2300/0861 ,  B01L2400/0487 ,  B01L2400/0622 ,  B01L2400/0644 ,  B01L2400/065 ,  G01N27/44743 ,  G01N27/44791

    摘要： Structures and methods that facilitate integration and/or isolation of various functions in a microchip system are disclosed. In one embodiment, the integration of the functions is by a multi-chip, sliding linear valve approach. The chips are in continued physical contact. In a second embodiment, the chips are separated and rejoined when they are moved to the preferred position. Surface coating of the joining edges helps prevent leakage and keeps liquid in the capillary channels for both embodiments. Another embodiment relates to miniature valves. Several designs were disclosed, including the linear, edge-contact sliding valve approach. Method to fabricate very small, high aspect ratio holes in glass was also disclosed, which facilitates the above embodiments.

    摘要翻译： 公开了促进微芯片系统中各种功能的集成和/或隔离的结构和方法。 在一个实施例中，功能的集成是通过多芯片滑动线性阀方法。 这些芯片是持续的身体接触。 在第二实施例中，当芯片移动到优选位置时，芯片被分离并重新接合。 对于两个实施例，接合边缘的表面涂层有助于防止泄漏并将液体保持在毛细通道中。 另一实施例涉及微型阀。 公开了几种设计，包括线性边缘接触滑阀方法。 还公开了在玻璃中制造非常小的高纵横比孔的方法，这有助于上述实施例。