Self-isolated and self-aligned 4F-square vertical fet-trench dram cells
    1.
    发明授权
    Self-isolated and self-aligned 4F-square vertical fet-trench dram cells 失效
    自分离和自对准4F方形垂直胎面沟槽细胞

    公开(公告)号:US6137128A

    公开(公告)日:2000-10-24

    申请号:US94383

    申请日:1998-06-09

    摘要: A densely packed array of vertical semiconductor devices, having pillars, deep trench capacitors, vertical transistors, and methods of making thereof are disclosed. The pillars act as transistor channels, and may be formed utilizing the application of hybrid resist over a block of semiconductor material. Drain doped regions are formed on the top of each pillar. The source doped regions and the plate doped regions are self-aligned and are created by diffusion in the trenches surrounding the pillars. The array has columns of bitlines and rows of wordlines. The capacitors are formed by isolating n.sup.+ polysilicon in trenches separating said pillars. The array is suitable for GBit DRAM applications because the deep trench capacitors do not increase array area. The array may have an open bitline architecture, where the plate region is common to all the storage nodes or a folded architecture with two wordlines that pass through each cell having stacked transistors, where one wordline is active and the other is passing for each cell.

    摘要翻译: 公开了一种密集堆叠的垂直半导体器件阵列,具有支柱,深沟槽电容器,垂直晶体管及其制造方法。 支柱用作晶体管通道,并且可以利用在半导体材料块上施加混合抗蚀剂来形成。 在每个支柱的顶部形成漏极掺杂区域。 源掺杂区域和板掺杂区域是自对准的,并且通过在柱子周围的沟槽中的扩散而产生。 该阵列具有位线和字线行。 通过在分离所述柱的沟槽中隔离n +多晶硅来形成电容器。 该阵列适用于GBit DRAM应用,因为深沟槽电容器不增加阵列面积。 阵列可以具有开放的位线架构,其中板区域对于所有存储节点是公共的,或者具有两个字线的折叠结构,其中两个字线通过具有堆叠晶体管的每个单元,其中一个字线是活动的,而另一个字线通过每个单元。

    Method of forming self-isolated and self-aligned 4F-square vertical FET-trench DRAM cells
    2.
    发明授权
    Method of forming self-isolated and self-aligned 4F-square vertical FET-trench DRAM cells 失效
    形成自隔离和自对准4F方形垂直FET沟槽DRAM单元的方法

    公开(公告)号:US06316309B1

    公开(公告)日:2001-11-13

    申请号:US09626332

    申请日:2000-07-26

    IPC分类号: H01L218242

    摘要: A densely packed array of vertical semiconductor devices, having pillars, deep trench capacitors, vertical transistors, and methods of making thereof are disclosed. The pillars act as transistor channels, and may be formed utilizing the application of hybrid resist over a block of semiconductor material. Drain doped regions are formed on the top of each pillar. The source doped regions and the plate doped regions are self-aligned and are created by diffusion in the trenches surrounding the pillars. The array has columns of bitlines and rows of wordlines. The capacitors are formed by isolating n+ polysilicon in trenches separating said pillars. The array is suitable for GBit DRAM applications because the deep trench capacitors do not increase array area. The array may have an open bitline architecture, where the plate region is common to all the storage nodes or a folded architecture with two wordlines that pass through each cell having stacked transistors, where one wordline is active and the other is passing for each cell.

    摘要翻译: 公开了一种密集堆叠的垂直半导体器件阵列,具有支柱,深沟槽电容器,垂直晶体管及其制造方法。 支柱用作晶体管通道,并且可以利用在半导体材料块上施加混合抗蚀剂来形成。 在每个支柱的顶部形成漏极掺杂区域。 源掺杂区域和板掺杂区域是自对准的,并且通过在柱子周围的沟槽中的扩散而产生。 该阵列具有位线和字线行。 通过在分离所述柱的沟槽中隔离n +多晶硅来形成电容器。 该阵列适用于GBit DRAM应用,因为深沟槽电容器不增加阵列面积。 阵列可以具有开放的位线架构,其中板区域对于所有存储节点是公共的,或者具有两个字线的折叠结构,其中两个字线通过具有堆叠晶体管的每个单元,其中一个字线是活动的,而另一个字线通过每个单元。

    Vertical DRAM having metallic node conductor
    3.
    发明授权
    Vertical DRAM having metallic node conductor 有权
    具有金属节点导体的垂直DRAM

    公开(公告)号:US06583462B1

    公开(公告)日:2003-06-24

    申请号:US09702338

    申请日:2000-10-31

    IPC分类号: H01L27108

    摘要: A dynamic random access memory device formed in a substrate having a trench. The trench has a side wall, a top, a lower portion, and a circumference. The device includes a signal storage node including a metallic storage node conductor formed in the lower portion of the trench and isolated from the side wall by a node dielectric and a collar oxide above the node dielectric. Preferably, the trench has an aspect ratio of greater than 50. A buried strap is coupled to the storage node conductor and contacts a portion of the side wall of the trench above the collar oxide. A trench-top dielectric which is formed upon the buried strap has a trench-top dielectric thickness. A signal transfer device includes a first diffusion region extending into the substrate adjacent the portion of the trench side wall contacted by the buried strap, a gate insulator having a gate insulator thickness formed on the trench side wall above the first buried strap, wherein the gate insulator thickness is less than the trench-top dielectric thickness, and a gate conductor formed within the trench upon the trench-top dielectric and adjacent the gate insulator.

    摘要翻译: 形成在具有沟槽的衬底中的动态随机存取存储器件。 沟槽具有侧壁,顶部,下部和圆周。 该装置包括信号存储节点,该信号存储节点包括形成在沟槽下部的金属存储节点导体,并通过节点电介质和节点电介质上方的环形氧化物与侧壁隔离。 优选地,沟槽具有大于50的纵横比。掩埋带耦合到存储节点导体并且接触环形氧化物上方的沟槽的侧壁的一部分。 形成在掩埋带上的沟槽电介质具有沟槽顶部的电介质厚度。 信号传送装置包括:第一扩散区域,其延伸到与所述掩埋带接触的所述沟槽侧壁的所述部分相邻的所述衬底;门绝缘体,其具有形成在所述第一掩埋带的上方的所述沟槽侧壁上的栅绝缘体厚度, 绝缘体厚度小于沟槽顶部电介质厚度,以及形成在沟槽顶部电介质并且邻近栅极绝缘体的沟槽内的栅极导体。

    Chemical trim of photoresist lines by means of a tuned overcoat
    4.
    发明授权
    Chemical trim of photoresist lines by means of a tuned overcoat 有权
    通过调整的外涂层对光致抗蚀剂线进行化学修饰

    公开(公告)号:US08137893B2

    公开(公告)日:2012-03-20

    申请号:US12983297

    申请日:2011-01-01

    IPC分类号: G03F7/00 G03F7/004 G03F7/40

    CPC分类号: G03F7/40 Y10T428/24802

    摘要: A new lithographic process comprises reducing the linewidth of an image while maintaining the lithographic process window, and using this process to fabricate pitch split structures comprising nm order (e.g., about 22 nm) node semiconductor devices. The process comprises applying a lithographic resist layer on a surface of a substrate and patterning and developing the lithographic resist layer to form a nm order node image having an initial line width. Overcoating the nm order node image with an acidic polymer produces an acidic polymer coated image. Heating the acidic polymer coated image gives a heat treated coating on the image, the heating being conducted at a temperature and for a time sufficient to reduce the initial linewidth to a subsequent narrowed linewidth. Developing the heated treated coating removes it from the image resulting in a free-standing trimmed lithographic feature on the substrate. Optionally repeating the foregoing steps further reduces the linewidth of the narrowed line. The invention also comprises a product produced by this process.

    摘要翻译: 新的光刻工艺包括在保持光刻工艺窗口的同时降低图像的线宽,并且使用该工艺来制造包括nm阶(例如约22nm)的节点半导体器件的间距分裂结构。 该方法包括在基片的表面上施加平版印刷抗蚀剂层,并对平版印刷抗蚀剂层进行图形化和显影,以形成具有初始线宽的nm阶节点图像。 用酸性聚合物覆盖nm阶节点图像产生酸性聚合物涂层图像。 加热酸性聚合物涂覆的图像给图像上的热处理涂层,加热在足以将初始线宽降低到随后变窄的线宽的温度和时间内进行。 显影加热处理的涂层将其从图像中去除,从而在基底上产生独立的修整光刻特征。 可选地,重复前述步骤进一步减小了变窄线的线宽。 本发明还包括通过该方法生产的产品。

    Chemical trim of photoresist lines by means of a tuned overcoat material
    5.
    发明授权
    Chemical trim of photoresist lines by means of a tuned overcoat material 有权
    通过调谐的外涂层材料对光致抗蚀剂线进行化学修饰

    公开(公告)号:US07862982B2

    公开(公告)日:2011-01-04

    申请号:US12137743

    申请日:2008-06-12

    IPC分类号: G03F7/00 G03F7/004 G03F7/40

    CPC分类号: G03F7/40 Y10T428/24802

    摘要: A new lithographic process comprises reducing the linewidth of an image while maintaining the lithographic process window, and using this process to fabricate pitch split structures comprising nm order (e.g., about 22 nm) node semiconductor devices. The process comprises applying a lithographic resist layer on a surface of a substrate and patterning and developing the lithographic resist layer to form a nm order node image having an initial line width. Overcoating the nm order node image with an acidic polymer produces an acidic polymer coated image. Heating the acidic polymer coated image gives a heat treated coating on the image, the heating being conducted at a temperature and for a time sufficient to reduce the initial linewidth to a subsequent narrowed linewidth. Developing the heated treated coating removes it from the image resulting in a free-standing trimmed lithographic feature on the substrate. Optionally repeating the foregoing steps further reduces the linewidth of the narrowed line. The invention also comprises a product produced by this process.

    摘要翻译: 新的光刻工艺包括在保持光刻工艺窗口的同时降低图像的线宽,并且使用该工艺来制造包括nm阶(例如约22nm)的节点半导体器件的间距分裂结构。 该方法包括在基片的表面上施加平版印刷抗蚀剂层,并对平版印刷抗蚀剂层进行图形化和显影以形成具有初始线宽的nm阶节点图像。 用酸性聚合物覆盖nm阶节点图像产生酸性聚合物涂层图像。 加热酸性聚合物涂覆的图像给图像上的热处理涂层,加热在足以将初始线宽降低到随后变窄的线宽的温度和时间内进行。 显影加热处理的涂层将其从图像中去除,从而在基底上产生独立的修整光刻特征。 可选地,重复前述步骤进一步减小了变窄线的线宽。 本发明还包括通过该方法生产的产品。