摘要:
A circuit body includes a flexible insulation sheet with an electric circuit pattern having wiring patterns and a temperature sensor arranged in the electric circuit pattern. The electric circuit pattern has a temperature-sensor connecting portion and a heat-concentrating pattern formed integrally with the temperature-sensor connecting portion so as to have a larger width than that of the wiring pattern. The temperature sensor is touched through the heat-concentrating pattern to an object to be measured. The wiring patterns and the heat-concentrating pattern are formed integrally on a primary surface of the insulation sheet by printing. An additional heat-concentrating pattern is further formed on a secondary surface of the insulation sheet at a position corresponding to the temperature-sensor connecting portion. The heat-concentrating patterns are bent integrally with the insulation sheet and touched to the object to be measured.
摘要:
An image forming apparatus includes an image supporting member for forming a developer image; a developing unit for forming a developer layer and forming the developer image on the image supporting member using developer of the developer layer; a developer supplying unit for supplying the developer to the developing unit; an image density detection unit for detecting an image density of the developer image; and a control unit for controlling a voltage applied to the developing unit and the developer supplying unit. The control unit corrects the voltage applied to at least one of the developing unit and the developer supplying unit according to the image density detected with the image density detection unit.
摘要:
An aqueous dispersion for chemical mechanical polishing is provided, which includes water and a resin particle. The resin particles accompany with a projection having a curvature radius ranging from 10 nm to 1.65 μm on a surface. The maximum length of the resin particles is not more than 5 μm and is 2.5 to 25 times as large as the curvature radius.
摘要:
Disclosed is a semiconductor device comprising a semiconductor substrate, a first insulating film formed above the semiconductor substrate, Cu wiring buried in the first insulating film, a second insulating film formed above the Cu wiring, and a discontinuous film made of at least one metal selected from the group consisting of Ti, Al, W, Pd, Sn, Ni, Mg and Zn, or a metal oxide thereof and interposed at an interface between the Cu wiring and the second insulating film.
摘要:
A nitrogen-containing bicyclic compound of formula (I) or a pharmaceutically acceptable salt thereof (wherein the symbols have the same meanings as described in the specification). The compound of formula (I) has an inhibitory activity against PDE7 and it is useful for the prevention and/or treatment of various diseases, i.e. autoimmune diseases (ulcerative colitis, Crohn's disease, rheumatism, psoriasis, multiple sclerosis, collagenosis, etc.), inflammatory diseases (obstructive pulmonary disease, sepsis, pancreatitis, sarcoidosis, nephritis, hepatitis, enteritis, etc.), allergic diseases (asthma, allergic rhinitis, allergic conjunctivitis, seasonal conjunctivitis, atopic dermatitis, etc.), rejection of organ transplants, serious graft versus host disease (GVHD), diabetic disease, osteoporosis, bone fracture, restenosis, atherosclerosis, obesity, ischemic reperfusion injury, depression, Parkinson's disease, dementia, leukemia, etc.
摘要:
The power window system moves a window glass in opening and closing directions in response to operation of an opening and closing instruction switch. The power window system includes a measurement device for obtaining an open degree of the window glass and a control device for controlling movement of the window glass in response to operation of the switch. The control device moves the window glass in the closing direction when an open degree obtained by the measurement device is not less than a predetermined degree and in the opening direction when the open degree is less than the predetermined degree.
摘要:
An aqueous dispersion for chemical mechanical polishing is provided, which includes water and a resin particle. The resin particles accompany with a projection having a curvature radius ranging from 10 nm to 1.65 μm on a surface. The maximum length of the resin particles is not more than 5 μm and is 2.5 to 25 times as large as the curvature radius.
摘要:
A current sensing circuit includes; a shunt resistor, on which a motor current is flown; a reference resistor which has a resistance value that is n times the shunt resistor; and a current following circuit. The current following circuit includes: a following current control circuit, which controls the following current and generates a first reference voltage; and a capacitor which generates a second reference voltage indicating an average value of the first reference voltage. A first comparator compares a third reference voltage higher than the first reference voltage with the second reference voltage, and outputs the current limitation control signal. A motor current sensing range expanding circuit expands a motor current sensing range by increasing a ratio of the current sensing circuit having the shunt resistor and the reference resistor.
摘要:
A current sensing circuit includes; a shunt resistor, on which a motor current is flown; a reference resistor which has a resistance value that is n times the shunt resistor; and a current following circuit. The current following circuit includes: a following current control circuit, which controls the following current and generates a first reference voltage; and a capacitor which generates a second reference voltage indicating an average value of the first reference voltage. A first comparator compares a third reference voltage higher than the first reference voltage with the second reference voltage, and outputs the current limitation control signal. A motor current sensing range expanding circuit expands a motor current sensing range by increasing a ratio of the current sensing circuit having the shunt resistor and the reference resistor.
摘要:
A stainless steel wire is plated with nickel (Ni) to a thickness of from not less than 1 .mu.m to not more than 5 .mu.m. An inorganic salt coat film mainly composed of at least one of potassium sulfate and borax (borate) and free from fluorine (F) or chlorine (Cl) is then deposited on the nickel (Ni) plate 2 as the substrate. The steel wire is then drawn to a reduction of area of not less than 60% to adjust the surface roughness thereof to a range of from 0.80 to 12.5 .mu.mRz, preferably from 1.0 to 10.0 .mu.mRz.