公开(公告)号：US4298825A

公开(公告)日：1981-11-03

申请号：US48063

申请日：1979-06-13

申请人： Takahiro Daikoku ,  Tomokatsu Oguro

发明人： Takahiro Daikoku ,  Tomokatsu Oguro

IPC分类号： H01J7/24 ,  H01J23/00 ,  H01J23/033 ,  H01J25/50

CPC分类号： H01J23/005

摘要： In a forced air cooled type magnetron device having a plurality of cooling fins, the opposite ends of each fin are provided with a plurality of tongue shaped pieces and alternate pieces are bent in the opposite directions to enhance turbulence.

摘要翻译： 在具有多个冷却翅片的强制风冷型磁控管装置中，每个翅片的相对端设置有多个舌形片，并且交替片沿相反方向弯曲以增强湍流。

公开(公告)号：US07518233B1

公开(公告)日：2009-04-14

申请号：US09590897

申请日：2000-06-09

申请人： Kouichi Takahashi ,  Kenichi Kasai ,  Takahiro Daikoku ,  Takayuki Uda ,  Toshitada Netsu ,  Takeshi Yamaguchi ,  Takahiko Matsushita ,  Osamu Maruyama

发明人： Kouichi Takahashi ,  Kenichi Kasai ,  Takahiro Daikoku ,  Takayuki Uda ,  Toshitada Netsu ,  Takeshi Yamaguchi ,  Takahiko Matsushita ,  Osamu Maruyama

IPC分类号： H01L23/12 ,  H01L23/10 ,  H01L23/34 ,  H01L23/28 ,  H01L21/00

CPC分类号： H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/09701

摘要： A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in thermal expansion rate is fixed with solder 8 to the face of the wiring board 1 for mounting semiconductor devices 2; a rubber O-ring 15 is placed between the upper face of the frame 5 and the under face of the circumference of an air-cooled: heat sink 7; the plastic member 6 making possible relative sliding is placed between the upper face of the circumference of the heat sink 7 and the upper frame 10; the upper face of a plastic member 6 is restrained with the inside middle stage of an upper frame 10; and the lower part of the upper frame 10 and the frame 5 are fastened together with bolts 9.

摘要翻译： 提供一种用于具有稳定的冷却性能和优异的密封可靠性的多芯片模块的密封结构。 以热膨胀率与布线板1相容的框架5的底面用焊料8固定到布线板1的面上，用于安装半导体器件2; 橡胶O形环15放置在框架5的上表面和空气冷却：散热器7的圆周的下表面之间; 能够进行相对滑动的塑料构件6设置在散热器7的周边的上表面与上框架10之间; 塑料构件6的上表面被上框架10的内侧中间段限制; 并且上部框架10的下部和框架5用螺栓9紧固在一起。

公开(公告)号：US5276586A

公开(公告)日：1994-01-04

申请号：US872178

申请日：1992-04-22

申请人： Toshio Hatsuda ,  Takahiro Daikoku ,  Tetsuya Hayashida ,  Noriyuki Ashiwake ,  Fumiyuki Kobayashi ,  Keizou Kawamura ,  Sohji Sakata

发明人： Toshio Hatsuda ,  Takahiro Daikoku ,  Tetsuya Hayashida ,  Noriyuki Ashiwake ,  Fumiyuki Kobayashi ,  Keizou Kawamura ,  Sohji Sakata

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L24/33 ,  H01L23/433 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83051 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/16152

摘要： A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of semiconductor chips, respectively, and a cooling jacket, on which the plurality of heat conduction members are bonded with heat conductive bonding agent, sealed with the substrate, wherein, in a surface of each of the plurality of heat conduction members adjacent to the cooling jacket and in a surface of the cooling jacket adjacent to the heat conduction members, around a portion corresponding to the back surface of each of the semiconductor chip is formed a portion which has non-affinity for the heat conductive bonding agent. Further, it is preferred that a reservoir having an affinity for the heat conductive bonding agent and serving to receive an excessive bonding agent is formed around each of the non-affinity portions of the plurality of heat conduction members and the cooling jacket.

摘要翻译： 半导体模块包括基板，安装在基板上的多个半导体芯片，分别安装在多个半导体芯片的背面上的多个导热部件和冷却套，多个导热部件 与导热接合剂接合，用基板密封，其中，在与冷却套相邻的多个热传导构件的每一个的表面中以及在与热传导构件相邻的冷却套的表面中， 对应于每个半导体芯片的背表面形成对于导热粘合剂具有非亲和性的部分。 此外，优选在多个导热构件和冷却套中的每个非亲合部分周围形成对导热粘合剂具有亲和力并用于接收过量粘合剂的储存器。

公开(公告)号：US5126829A

公开(公告)日：1992-06-30

申请号：US412130

申请日：1989-09-25

申请人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

发明人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

IPC分类号： H01L23/433 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.

摘要翻译： 一种用于电子设备的冷却装置使冷却固体与电子设备接触，以冷却电子设备。 该设备具有设置在电子设备的传热部分上的高粘性导热流体和通过导电流体与电子设备的传热部分紧密接触的冷却固体。 冷却固体和电子装置中的至少一个的紧密接触部分具有向冷却固体和电子装置之一的外部开口的多个凹槽。

公开(公告)号：US5089936A

公开(公告)日：1992-02-18

申请号：US404341

申请日：1989-09-07

申请人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

发明人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

IPC分类号： H01L23/40 ,  H01L23/473

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253

摘要： In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.

摘要翻译： 在包括具有电连接在其上的一个或多个半导体器件的布线基板的半导体模块中，由密封框架和顶板组成的壳体以封装其中的半导体器件，以及用于冷却半导体器件的冷却套。 半导体模块包括放置在冷却套上的弹性臂，用于施加压力以使冷却套与壳体天花板均匀地接触，并且夹具通过弹性臂挤压冷却套和顶板，使得夹紧 夹具可以用于通过弹性臂挤压冷却套的四个侧面的相应中间位置，或者可以在弹性臂上设置螺钉紧固件以控制位移和按压力。

公开(公告)号：US4872606A

公开(公告)日：1989-10-10

申请号：US940490

申请日：1986-12-10

申请人： Motohiro Satoh ,  Toshihiro Yamada ,  Akiomi Kohono ,  Akihiko Yamamoto ,  Keiji Taguchi ,  Takahiro Daikoku ,  Fumiuki Kobayashi

发明人： Motohiro Satoh ,  Toshihiro Yamada ,  Akiomi Kohono ,  Akihiko Yamamoto ,  Keiji Taguchi ,  Takahiro Daikoku ,  Fumiuki Kobayashi

IPC分类号： C04B37/00

CPC分类号： C04B37/026 ,  C04B37/006 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/401 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/80

摘要： In a sealed structure consisting of ceramic members opposing each other and a frame coupled to the ceramic members and defining an He-tight chamber with the ceramic members, the melting point of a joint member for bonding one of the ceramic members to the frame is lower than the melting point of another joint member for bonding the other of the ceramic members to the frame so that rebonding can be made.

摘要翻译： 在由彼此相对的陶瓷构件组成的密封结构中，和耦合到陶瓷构件并且与陶瓷构件形成He-密封室的框架之间，用于将陶瓷构件中的一个结合到框架的接合构件的熔点较低 比用于将另一个陶瓷构件接合到框架的另一个接头构件的熔点，使得可以进行重新接合。

公开(公告)号：US4602681A

公开(公告)日：1986-07-29

申请号：US545644

申请日：1983-10-26

申请人： Takahiro Daikoku ,  Wataru Nakayama ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hiromichi Yoshida

发明人： Takahiro Daikoku ,  Wataru Nakayama ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hiromichi Yoshida

IPC分类号： F28F13/02 ,  B01D1/22 ,  F28F1/10 ,  F28F13/18 ,  F28F13/00 ,  F25B39/02

CPC分类号： F28F13/187 ,  B01D1/22

摘要： In a heat transfer wall provided with a plurality of cells and restricted holes, the cells are formed in a plurality of laminated layers in a direction from an outer surface of the heat transfer wall to an inside thereof, and the cells of the upper and lower layers and the outside of the outer surface are communicated to one another through the holes.

摘要翻译： 在设置有多个电池和限制孔的传热壁中，电池在从传热壁的外表面到其内部的方向上形成多个层叠层，并且上下电池 层和外表面的外部通过孔彼此连通。

公开(公告)号：US4587399A

公开(公告)日：1986-05-06

申请号：US683499

申请日：1984-12-19

申请人： Kazuya Higeta ,  Kazumasa Fujioka ,  Takeo Nemoto ,  Takahiro Daikoku ,  Isao Nakajima

发明人： Kazuya Higeta ,  Kazumasa Fujioka ,  Takeo Nemoto ,  Takahiro Daikoku ,  Isao Nakajima

IPC分类号： B41J2/335 ,  B41J2/345 ,  G01D15/10

CPC分类号： B41J2/345

摘要： A thermal head is provided with a heat accumulating member disposed on a substrate, a plurality of heating resistors juxtaposed on the heat accumulating member in a manner to be spaced from each other, electrodes for supplying electric power to the heating resistors, and a protective member for preventing oxidation and wear of the heating resistors and the electrodes, these constituents being formed as layers. When the electric power is supplied to the electrodes, heat is generated by a heating portion of the heating resistor corresponding to the electrodes, and it is transmitted to a head surface via a thermally conductive member disposed in a printing dot portion of the protective member. The heat from the printing dot portion is used for effecting printing on a medium to-be-recorded through a thermosensitive sheet which lies in contact with the head surface.

摘要翻译： 热敏头设置有设置在基板上的蓄热构件，以与彼此间隔开的方式并置在蓄热构件上的多个加热电阻器，用于向加热电阻器供电的电极和保护构件 为了防止加热电阻器和电极的氧化和磨损，这些成分被形成为层。 当向电极提供电力时，由对应于电极的加热电阻器的加热部分产生热量，并且通过设置在保护部件的印刷点部分中的导热部件将其传递到头部表面。 来自打印点部分的热量用于通过与头表面接触的热敏片在要记录的介质上进行印刷。

公开(公告)号：US06711017B2

公开(公告)日：2004-03-23

申请号：US10196284

申请日：2002-07-17

申请人： Tateki Kurokawa ,  Akira Saito ,  Toshio Fukukawa ,  Mikio Harada ,  Takahiro Daikoku ,  Hideo Yazawa

发明人： Tateki Kurokawa ,  Akira Saito ,  Toshio Fukukawa ,  Mikio Harada ,  Takahiro Daikoku ,  Hideo Yazawa

IPC分类号： H05K720

CPC分类号： H05K7/20254

摘要： Provided is a cooling apparatus for feeding liquid coolant to electronic elements as heat generating elements in an electronic system through a cooling pipe. The cooling pipe is in part flattened so as to form flattened portion which is made into contact with the electronic parts for cooling the latter. With this arrangement, the pipe line working is simplified while the number of joint parts in the pipe line is decreased so as to prevent leakage of the liquid coolant. Further, the heat-exchange capacity of a heat-exchanger unit is controlled in accordance with an atmospheric temperature, a temperature in the electronic system and a temperature of the liquid coolant in order to aim at preventing occurrence of freezing or dewing while enhancing the operating efficiency. Further, in an electronic apparatus having two electronic systems, a liquid coolant tank is commonly used for two electronic systems in order to prevent occurrence of dewing or freezing in a cooling system for the electronic system on resting.

摘要翻译： 提供了一种用于通过冷却管将液体冷却剂供给到作为电子系统中的发热元件的电子元件的冷却装置。 冷却管部分变平，以形成与电子部件接触以冷却后者的平坦部分。 利用这种布置，简化了管线加工，同时管道中的接头部件的数量减少，以防止液体冷却剂的泄漏。 此外，根据大气温度，电子系统中的温度和液体冷却剂的温度来控制热交换器单元的热交换能力，以便在加强操作的同时防止冷冻或除冰的发生 效率。 此外，在具有两个电子系统的电子设备中，为了防止电子系统在休息时的冷却系统中发生脱落或冻结，两个电子系统通常使用液体冷却剂箱。

公开(公告)号：US06528878B1

公开(公告)日：2003-03-04

申请号：US09631889

申请日：2000-08-04

申请人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

发明人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

IPC分类号： H01L2334

CPC分类号： H01L23/10 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1626

摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

摘要翻译： 根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。 覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。 密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。 提供具有低热阻的导热护套。 多芯片模块密封框架焊接到密封顶板的边缘。 此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架 对彼此。