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1.发明授权Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei 有权使用导电颗粒作为核的倒装芯片安装工艺和凸块形成工艺公开(公告)号：US07726545B2
公开(公告)日：2010-06-01
申请号：US11886311
申请日：2006-03-13
申请人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
发明人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
CPC分类号： H05K3/3436 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/11524 , H01L2224/16 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83886 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , Y10T29/49126 , H01L2224/13099 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
摘要翻译： 根据本发明的倒装芯片安装工艺或凸块形成工艺的特征在于，导电颗粒固定在形成在电子部件上的电极上。 将包含焊料粉末，对流添加剂和树脂组分的组合物供应到电子部件的表面上，该表面设置有电极。 将所提供的组合物加热到使焊料粉末熔化的温度。 结果，对流添加剂沸腾或分解以产生气体。 所产生的气体在所提供的组合物内产生对流现象。 由于对流现象促使焊料粉末的移动，焊料粉末可以在组合物内自由移动。 导电颗粒用作焊料粉末的自组装和生长的核。 结果，允许熔融焊料粉末在导电颗粒附近自组装和生长，这导致连接或凸块的形成。
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2.发明申请Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles 有权使用导电颗粒的翻转夹安装工艺和凸起成型工艺公开(公告)号：US20080165518A1
公开(公告)日：2008-07-10
申请号：US11886311
申请日：2006-03-13
申请人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
发明人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
IPC分类号： H01L23/498 , H05K3/36 , B23K1/20 , H01L21/60
CPC分类号： H05K3/3436 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/11524 , H01L2224/16 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83886 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , Y10T29/49126 , H01L2224/13099 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
摘要翻译： 根据本发明的倒装芯片安装工艺或凸块形成工艺的特征在于，导电颗粒固定在形成在电子部件上的电极上。 将包含焊料粉末，对流添加剂和树脂组分的组合物供应到电子部件的表面上，该表面设置有电极。 将所提供的组合物加热到使焊料粉末熔化的温度。 结果，对流添加剂沸腾或分解以产生气体。 所产生的气体在所提供的组合物内产生对流现象。 由于对流现象促使焊料粉末的移动，焊料粉末可以在组合物内自由移动。 导电颗粒用作焊料粉末的自组装和生长的核。 结果，允许熔融焊料粉末在导电颗粒附近自组装和生长，这导致连接或凸块的形成。
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公开(公告)号：US07927997B2
公开(公告)日：2011-04-19
申请号：US11579299
申请日：2006-03-07
IPC分类号： H01L21/445
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability.A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： 提供适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，并且在该状态下将半导体芯片20和电路板21浸入 浸渍浴40含有包含熔融的焊料颗粒的熔融树脂14一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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公开(公告)号：US20110162578A1
公开(公告)日：2011-07-07
申请号：US13046151
申请日：2011-03-11
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability.[Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： [问题]提供一种适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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公开(公告)号：US20070243664A1
公开(公告)日：2007-10-18
申请号：US11579299
申请日：2006-03-07
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： [问题]提供一种适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，并且半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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公开(公告)号：US08691683B2
公开(公告)日：2014-04-08
申请号：US13046151
申请日：2011-03-11
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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7.发明授权Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method 有权倒装芯片安装体和安装这种倒装芯片安装体和凸块成型方法公开(公告)号：US07754529B2
公开(公告)日：2010-07-13
申请号：US11814337
申请日：2006-02-02
IPC分类号： H01L21/00
CPC分类号： H05K3/3436 , H01L21/565 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/13099 , H01L2224/16238 , H01L2224/83205 , H01L2224/83801 , H01L2224/83886 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0285 , Y02P70/613 , H01L2224/05599
摘要： In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.
摘要翻译： 在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接 端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供包含导电颗粒（12）的树脂（13），导电颗粒（12） ）和树脂（13）被加热和熔化，并且施加振动以使其流动。 允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。 树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成 用于以均匀的方式在这些端子之间建立电连接的连接器。
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8.发明申请FLIP CHIP MOUNTING BODY AND METHOD FOR MOUNTING SUCH FLIP CHIP MOUNTING BODY AND BUMP FORMING METHOD 有权滑动芯片安装体和安装这种切片芯片安装体和形成方法的方法公开(公告)号：US20090203169A1
公开(公告)日：2009-08-13
申请号：US11814337
申请日：2006-02-02
IPC分类号： H01L21/60 , H01L21/768
CPC分类号： H05K3/3436 , H01L21/565 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/13099 , H01L2224/16238 , H01L2224/83205 , H01L2224/83801 , H01L2224/83886 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0285 , Y02P70/613 , H01L2224/05599
摘要： In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.
摘要翻译： 在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接 端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供含有导电颗粒（12）的树脂（13），导电颗粒（12） ）和树脂（13）被加热和熔化，并且施加振动以使其流动。 允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。 树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成 用于以均匀的方式在这些端子之间建立电连接的连接器。
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9.发明授权Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same 有权金属颗粒分散组合物和倒装芯片安装工艺以及使用其的凸块形成工艺公开(公告)号：US07910403B2
公开(公告)日：2011-03-22
申请号：US11885562
申请日：2006-03-06
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , H01L21/6835 , H01L23/49883 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1141 , H01L2224/1152 , H01L2224/11524 , H01L2224/13099 , H01L2224/16 , H01L2224/293 , H01L2224/294 , H01L2224/73104 , H01L2224/83886 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0425 , H05K2203/087 , H05K2203/1178 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process wherein a semiconductor chip and a circuit substrate are electrically interconnected. The process includes the steps of preparing a semiconductor chip on which a first plurality of electrodes are formed and a circuit substrate on which a second plurality of electrodes are formed; supplying a composition onto a surface of the circuit substrate, such surface being provided with second plurality of electrodes; bringing the semiconductor chip into contact with a surface of said composition such that the first plurality of electrodes are opposed to the second plurality of electrodes; and heating the circuit substrate, and thereby electrical connections including a metal component constituting the metal particles dispersed in the composition are formed between the first plurality of electrodes and the second plurality of electrodes. Also, a thermoset resin layer is formed between the semiconductor chip and the circuit substrate.
摘要翻译： 一种倒装芯片安装工艺，其中半导体芯片和电路基板电连接。 该方法包括制备其上形成有第一多个电极的半导体芯片和形成有第二多个电极的电路基板的步骤; 在电路基板的表面上提供组合物，该表面设置有第二多个电极; 使所述半导体芯片与所述组合物的表面接触，使得所述第一多个电极与所述第二多个电极相对; 并且加热电路基板，从而在第一多个电极和第二多个电极之间形成包括构成分散在组合物中的金属颗粒的金属组分的电连接。 此外，在半导体芯片和电路基板之间形成热固性树脂层。
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10.发明申请METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME 审中-公开金属颗粒分散组合物和浮选芯片安装工艺和使用其的成型工艺公开(公告)号：US20110133137A1
公开(公告)日：2011-06-09
申请号：US13027498
申请日：2011-02-15
IPC分类号： H01B1/22
CPC分类号： H01L24/81 , H01L21/6835 , H01L23/49883 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1141 , H01L2224/1152 , H01L2224/11524 , H01L2224/13099 , H01L2224/16 , H01L2224/293 , H01L2224/294 , H01L2224/73104 , H01L2224/83886 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0425 , H05K2203/087 , H05K2203/1178 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process wherein a semiconductor chip and a circuit substrate are electrically interconnected. The process includes the steps of preparing a semiconductor chip on which a first plurality of electrodes are formed and a circuit substrate on which a second plurality of electrodes are formed; supplying a composition onto a surface of the circuit substrate, such surface being provided with second plurality of electrodes; bringing the semiconductor chip into contact with a surface of said composition such that the first plurality of electrodes are opposed to the second plurality of electrodes; and heating the circuit substrate, and thereby electrical connections including a metal component constituting the metal particles dispersed in the composition are formed between the first plurality of electrodes and the second plurality of electrodes. Also, a thermoset resin layer is formed between the semiconductor chip and the circuit substrate.
摘要翻译： 一种倒装芯片安装工艺，其中半导体芯片和电路基板电连接。 该方法包括制备其上形成有第一多个电极的半导体芯片和形成有第二多个电极的电路基板的步骤; 在电路基板的表面上提供组合物，该表面设置有第二多个电极; 使所述半导体芯片与所述组合物的表面接触，使得所述第一多个电极与所述第二多个电极相对; 并且加热电路基板，从而在第一多个电极和第二多个电极之间形成包括构成分散在组合物中的金属颗粒的金属组分的电连接。 此外，在半导体芯片和电路基板之间形成热固性树脂层。
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