公开(公告)号：US07108406B2

公开(公告)日：2006-09-19

申请号：US10914076

申请日：2004-08-10

申请人： Takashi Moriyasu ,  Akihiro Suzuki ,  Takashi Saijo

发明人： Takashi Moriyasu ,  Akihiro Suzuki ,  Takashi Saijo

IPC分类号： F21V21/00

CPC分类号： G03B21/18

摘要： A retainer includes: a connecting piece; one or more retaining parts provided at either end of the connecting piece and having a hole into which a terminal of an electrical component fits; an arm piece extending from near the hole; and a washer that is formed on the fore-end of the arm piece and is for fitting together with the hole over the terminal, wherein the connecting piece, the retaining part, the arm piece, and the washer are formed integrally of an insulating material having good expansion/contraction properties.

摘要翻译： 保持器包括：连接件; 一个或多个保持部件，设置在连接件的任一端并具有孔，电气部件的端子装配到该孔中; 靠近孔延伸的臂件; 以及垫圈，其形成在所述臂部件的前端上并且用于与所述端子上的孔一起配合，其中所述连接件，所述保持部件，所述臂部件和所述垫圈由绝缘材料 具有良好的膨胀/收缩性能。

公开(公告)号：US20050037675A1

公开(公告)日：2005-02-17

申请号：US10914076

申请日：2004-08-10

申请人： Takashi Moriyasu ,  Akihiro Suzuki ,  Takashi Saijo

发明人： Takashi Moriyasu ,  Akihiro Suzuki ,  Takashi Saijo

IPC分类号： G03B15/05 ,  F21V19/00 ,  F21Y103/00 ,  G03B15/00 ,  G03B21/18 ,  H01J5/48 ,  H01R13/66

CPC分类号： G03B21/18

摘要： A retainer includes: a connecting piece; one or more retaining parts provided at either end of the connecting piece and having a hole into which a terminal of an electrical component fits; an arm piece extending from near the hole; and a washer that is formed on the fore-end of the arm piece and is for fitting together with the hole over the terminal, wherein the connecting piece, the retaining part, the arm piece, and the washer are formed integrally of an insulating material having good expansion/contraction properties.

摘要翻译： 保持器包括：连接件; 一个或多个保持部件，设置在连接件的任一端并具有孔，电气部件的端子装配到该孔中; 靠近孔延伸的臂件; 以及垫圈，其形成在所述臂部件的前端上并且用于与所述端子上的孔一起配合，其中所述连接件，所述保持部件，所述臂部件和所述垫圈由绝缘材料 具有良好的膨胀/收缩性能。

公开(公告)号：US20090267165A1

公开(公告)日：2009-10-29

申请号：US12094674

申请日：2006-11-24

申请人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

发明人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC分类号： H01L29/84

CPC分类号： G01P1/023 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842

摘要： A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

摘要翻译： 提供具有诸如加速度传感器和陀螺传感器的多个紧凑型传感器的晶片级封装结构。 该封装结构由具有多个传感器单元的半导体晶片和结合到半导体晶片的两个表面的一对封装晶片构成。 每个传感器单元具有一个具有开口的框架，一个保持在开口中的可移动部分可相对于框架移动;以及检测部分，用于根据可移动部分的位置偏移输出电信号。 由于通过在框架上形成的表面激活区域和形成在封装晶片上的表面激活区域之间没有扩散的固相直接接合将半导体晶片结合到每个封装晶片，因此可以防止这种变化 传感器特性由于接合界面处的残余应力而发生。

公开(公告)号：US08080869B2

公开(公告)日：2011-12-20

申请号：US12094600

申请日：2006-11-24

申请人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

发明人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC分类号： H01L23/12

CPC分类号： G01P15/0802 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  G01P1/023 ,  G01P15/123 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0842 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.

摘要翻译： 提供了形成传感器特性变化小的多个紧凑型传感器装置的晶片级封装结构及其制造方法。 该封装结构具有具有多个传感器单元的半导体晶片和与半导体晶片接合的封装晶片。 半导体晶片具有相对于每个传感器单元形成的第一金属层。 封装晶片在面向第一金属层的位置处具有接合金属层。 由于通过第一金属层的活化表面和接合金属层之间的直接接合在室温下形成半导体晶片和封装晶片之间的结合部分，因此可以防止由于残余应力而导致的传感器特性的变化 在接合部分。

公开(公告)号：US08067769B2

公开(公告)日：2011-11-29

申请号：US12094674

申请日：2006-11-24

申请人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

发明人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC分类号： H01L21/66

CPC分类号： G01P1/023 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842

摘要： A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

摘要翻译： 提供具有诸如加速度传感器和陀螺传感器的多个紧凑型传感器的晶片级封装结构。 该封装结构由具有多个传感器单元的半导体晶片和结合到半导体晶片的两个表面的一对封装晶片构成。 每个传感器单元具有一个具有开口的框架，一个保持在开口中的可移动部分可相对于框架移动;以及检测部分，用于根据可移动部分的位置偏移输出电信号。 由于通过在框架上形成的表面激活区域和形成在封装晶片上的表面激活区域之间没有扩散的固相直接接合将半导体晶片结合到每个封装晶片，因此可以防止这种变化 传感器特性由于接合界面处的残余应力而发生。

公开(公告)号：US08026594B2

公开(公告)日：2011-09-27

申请号：US12094772

申请日：2006-11-24

申请人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

发明人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC分类号： H01L23/12

CPC分类号： G01P15/0802 ,  B81B7/0051 ,  B81B7/0064 ,  B81B2201/025 ,  B81C2203/038 ,  G01C19/5719 ,  G01P1/023 ,  G01P15/125 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.

摘要翻译： 提供了传感器特性变化小，电噪声提高的传感器装置。 该传感器装置具有传感器单元，该传感器单元设置有具有开口的框架，保持在开口中的可移动部分，以相对于框架可移动;以及检测部分，用于根据可移动的位移位移输出电信号 部分，以及由半导体材料制成的封装衬底，并结合到传感器单元的表面。 封装基板在面向传感器单元的表面上具有电绝缘膜。 通过在室温下在电绝缘膜的活化表面和传感器单元的活化表面之间形成直接接合，封装衬底结合到传感器单元。

公开(公告)号：US20090159997A1

公开(公告)日：2009-06-25

申请号：US12094600

申请日：2006-11-24

申请人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

发明人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： G01P15/0802 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  G01P1/023 ,  G01P15/123 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0842 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.

摘要翻译： 提供了形成传感器特性变化小的多个紧凑型传感器装置的晶片级封装结构及其制造方法。 该封装结构具有具有多个传感器单元的半导体晶片和与半导体晶片接合的封装晶片。 半导体晶片具有相对于每个传感器单元形成的第一金属层。 封装晶片在面向第一金属层的位置处具有接合金属层。 由于通过第一金属层的活化表面和接合金属层之间的直接接合在室温下形成半导体晶片和封装晶片之间的结合部分，因此可以防止由于残余应力而导致的传感器特性的变化 在接合部分。

公开(公告)号：US20140220668A1

公开(公告)日：2014-08-07

申请号：US14240036

申请日：2012-08-21

申请人： Hiroaki Tachibana ,  Koji Tsuji ,  Takashi Saijo ,  Eiichi Tamiya ,  Masato Saito

发明人： Hiroaki Tachibana ,  Koji Tsuji ,  Takashi Saijo ,  Eiichi Tamiya ,  Masato Saito

IPC分类号： B01L7/00 ,  C12Q1/68

CPC分类号： B01L7/52 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00828 ,  B01J2219/00831 ,  B01J2219/00853 ,  B01J2219/00869 ,  B01J2219/00873 ,  B01J2219/00912 ,  B01J2219/00957 ,  B01J2219/00961 ,  B01L3/502707 ,  B01L7/525 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0883 ,  B01L2300/0887 ,  B01L2300/0893 ,  B01L2300/1827 ,  C12M23/16 ,  C12Q1/6844 ,  G01N27/44708 ,  G01N27/44791

摘要： To provide a microfluidic device which does not apply a meandering reaction channel and thus can be reduced in size, the microfluidic device comprising a reaction channel is characterized in that a plurality of thermal cycle regions which respectively comprise at least two thermal regions with different temperatures are repeatedly provided and the reaction channel passes through the plurality of thermal cycle regions.

摘要翻译： 为了提供不应用曲折反应通道并因此可以减小尺寸的微流体装置，包括反应通道的微流体装置的特征在于分别包括至少两个具有不同温度的热区域的多个热循环区域是 反复提供并且反应通道穿过多个热循环区域。

公开(公告)号：US07674638B2

公开(公告)日：2010-03-09

申请号：US12094771

申请日：2006-11-24

申请人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

发明人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC分类号： H01L21/66 ,  H01L23/58 ,  G01R31/26

CPC分类号： G01P15/0802 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  B81C2203/0735 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842

摘要： A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.

摘要翻译： 提供了具有稳定的传感器特性的紧凑的传感器装置和制造方法。 传感器装置形成有传感器基板和粘合到传感器基板的两个表面上的一对封装基板。 传感器基板具有开口的框架，保持在开口中的可移动部分可相对于框架移动;以及检测部分，用于根据可移动部分的位置偏移输出电信号。 通过使用原子束，离子束或惰性气体的等离子体，在传感器基板的框架和封装基板上形成表面激活区域。 通过在室温下在传感器基板的表面激活区域和封装基板之间形成直接接合，可以避免由于接合部分处的残余应力引起的不便。

公开(公告)号：US20090152656A1

公开(公告)日：2009-06-18

申请号：US12094771

申请日：2006-11-24

申请人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

发明人： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： G01P15/0802 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  B81C2203/0735 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842

摘要： A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.

摘要翻译： 提供了具有稳定的传感器特性的紧凑的传感器装置和制造方法。 传感器装置形成有传感器基板和粘合到传感器基板的两个表面上的一对封装基板。 传感器基板具有开口的框架，保持在开口中的可移动部分可相对于框架移动;以及检测部分，用于根据可移动部分的位置偏移输出电信号。 通过使用原子束，离子束或惰性气体的等离子体，在传感器基板的框架和封装基板上形成表面激活区域。 通过在室温下在传感器基板的表面激活区域和封装基板之间形成直接接合，可以避免由于接合部分处的残余应力引起的不便。