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24 条记录 (耗时 0.033 秒)

    Process and apparatus for flow soldering
    2.
    发明授权
    Process and apparatus for flow soldering 失效
    流动焊接的工艺和设备

    公开(公告)号：US07150387B2

    公开(公告)日：2006-12-19

    申请号：US10668355

    申请日：2003-09-24

    申请人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    发明人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    IPC分类号： B23K1/00

    CPC分类号： B23K1/08 ,  B23K1/0016 ,  B23K2101/36 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/1121

    摘要： An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.

    摘要翻译： 一种通过无铅焊料将电气部件安装在基板上的装置。 本发明的装置具有焊料供给室，其中焊料材料的熔体通过焊料供给单元供应到板，使得焊料材料粘附到板的预定部分。 该设备还包括冷却室，其中板被冷却单元冷却，使得粘附到板上的焊料材料被快速冷却以固化。 调节室也可以位于焊料供应室和冷却室之间。 调节室对板进行调节，使得至少在焊料材料的快速冷却之前，确保粘附到板的焊料是完全熔融的状态。

    Method of mounting electronics component
    4.
    发明授权
    Method of mounting electronics component 失效
    安装电子部件的方法

    公开(公告)号：US5743007A

    公开(公告)日：1998-04-28

    申请号：US587461

    申请日：1996-01-17

    申请人： Hiroaki Onishi ,  Haruto Nagata ,  Masato Hirano ,  Kenichiro Suetsugu

    发明人： Hiroaki Onishi ,  Haruto Nagata ,  Masato Hirano ,  Kenichiro Suetsugu

    IPC分类号： H05K1/11 ,  H05K3/34

    CPC分类号： H05K3/3484 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/0272 ,  H05K2201/097 ,  H05K2201/10689 ,  H05K2203/0545 ,  H05K3/3452 ,  H05K3/3463 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49144

    摘要： A method for mounting on integrated circuit having many leads with narrow pitches on the printed circuit board. In a method, a resist layer is formed between lands on the board, and solder paste is applied with a stencil to the lands so that the positions of the solder paste on the lands are staggered. Then, leads of the integrated circuit are positioned on the lands. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. In a different embodiment, each land includes a first portion and a second portion having a width narrower than the first portion, and the second portions are arranged staggeredly among the lands. Then, solder paste is applied to the first portions having the wider width. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. If solder including bismuth is used, reflow soldering can be performed in ambient environment.

    摘要翻译： 一种用于安装在印刷电路板上具有窄间距的许多引线的集成电路上的方法。 在一种方法中，在板上的焊盘之间形成抗蚀剂层，并且将焊膏施加到焊盘上的模板，使得焊盘在焊盘上的位置错开。 然后，集成电路的引线位于焊盘上。 然后，焊锡膏在氮气环境下进行焊盘的回焊焊接。 在不同的实施例中，每个平台包括具有比第一部分窄的宽度的第一部分和第二部分，并且第二部分交错布置在平台之间。 然后，将焊膏施加到宽度较宽的第一部分。 然后，焊锡膏在氮气环境下进行焊盘的回焊焊接。 如果使用包含铋的焊料，则可以在周围环境中进行回流焊接。

    Method of processing silver halide photographic materials where the rollers are intermittently rotated during stand-by
    7.
    发明授权
    Method of processing silver halide photographic materials where the rollers are intermittently rotated during stand-by 失效
    处理卤化银照相材料的方法，其中辊在待机期间间歇地旋转

    公开(公告)号：US4931378A

    公开(公告)日：1990-06-05

    申请号：US279897

    申请日：1988-12-05

    申请人： Masato Hirano ,  Eiichi Tadokoro

    发明人： Masato Hirano ,  Eiichi Tadokoro

    IPC分类号： G03C5/26 ,  G03C1/06 ,  G03C5/29 ,  G03D3/00 ,  G03D3/08

    CPC分类号： G03C5/29 ,  G03C1/061

    摘要： Disclosed is a method for processing a silver halide photographic material having at least one silver halide emulsion layer on a support and containing at least one hydrazine derivative in said silver halide emulsion layer or in another hydrophilic colloid layer with a roller-conveying type automatic developing machine using a dihydroxybenzene developer containing a sulfite preservative in an amount of 0.15 mol/liter or more at pH of 10.5 to 12.3, which method is characterized in that at least the roller which is in contact with both the developer and air, among the rollers of the said developing machine, is continuously rotated at a determined speed during conveyance or processing of the material during a processing phase, and intermittently rotated during a stand-by phase. By the method, the photographic material may be processed stably and rapidly for a long period of time to give an image having a high contrast and a high blackened density. The method requires only a small amount of replenisher to compensate for the processing solution fatigued after repeated use.

    Semiconductor memory module having built-in antenna
    9.
    发明授权
    Semiconductor memory module having built-in antenna 失效
    具有内置天线的半导体存储模块

    公开(公告)号：US07471260B2

    公开(公告)日：2008-12-30

    申请号：US11793301

    申请日：2006-02-02

    申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    IPC分类号： H01Q1/36

    CPC分类号： H01Q1/2275 ,  H01L23/49855 ,  H01L25/0652 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q7/00

    摘要： A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

    摘要翻译： 一种由具有半导体存储器件（16）和控制半导体器件（18）的安装模块（12）形成的半导体存储器模块，包含与控制半导体器件（18）耦合的连接端子（20）的电路板（14） ）并且被设置成从外壳（42）的表面露出，以及设置在外壳（42）内部的天线连接端子电极（22）。 以及具有片材板（26）的天线模块（24），所述片材板（26）包括设置在沿着所述边缘的所述边缘附近的一个表面上的天线（28），设置在另一个表面上的磁性物质层 ，以及设置在一个或另一个表面上的天线端子电极（38）。 天线模块（24）重叠在安装的模块（12）上，天线连接端子电极（22）与天线端子电极（38）连接。